KR101573301B1 - 유리 기판용 용기 - Google Patents
유리 기판용 용기 Download PDFInfo
- Publication number
- KR101573301B1 KR101573301B1 KR1020117010802A KR20117010802A KR101573301B1 KR 101573301 B1 KR101573301 B1 KR 101573301B1 KR 1020117010802 A KR1020117010802 A KR 1020117010802A KR 20117010802 A KR20117010802 A KR 20117010802A KR 101573301 B1 KR101573301 B1 KR 101573301B1
- Authority
- KR
- South Korea
- Prior art keywords
- glass substrate
- reinforcing member
- container
- side wall
- container body
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 239000011521 glass Substances 0.000 title claims abstract description 105
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 77
- 230000003139 buffering effect Effects 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 description 6
- -1 polypropylene Polymers 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009032752A JP5227827B2 (ja) | 2009-02-16 | 2009-02-16 | ガラス基板用容器 |
JPJP-P-2009-032752 | 2009-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110115997A KR20110115997A (ko) | 2011-10-24 |
KR101573301B1 true KR101573301B1 (ko) | 2015-12-01 |
Family
ID=42561762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117010802A KR101573301B1 (ko) | 2009-02-16 | 2010-02-08 | 유리 기판용 용기 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5227827B2 (ja) |
KR (1) | KR101573301B1 (ja) |
CN (1) | CN202089455U (ja) |
TW (1) | TWI476134B (ja) |
WO (1) | WO2010092920A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101920816B (zh) * | 2010-08-24 | 2012-04-18 | 友达光电股份有限公司 | 包装缓冲装置 |
JP5826569B2 (ja) * | 2011-09-12 | 2015-12-02 | 積水化成品工業株式会社 | 板状体の搬送用容器 |
TWI432367B (zh) * | 2012-04-13 | 2014-04-01 | Au Optronics Corp | 緩衝包裝盒 |
CN102616488B (zh) * | 2012-04-13 | 2014-04-02 | 深圳市华星光电技术有限公司 | 一种液晶玻璃包装盒 |
US8777007B2 (en) | 2012-04-13 | 2014-07-15 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Packaging box for liquid crystal glass |
JP5917316B2 (ja) * | 2012-06-29 | 2016-05-11 | 積水化成品工業株式会社 | 梱包材および梱包体 |
TWI462211B (zh) * | 2012-06-29 | 2014-11-21 | Au Optronics Corp | 承載裝置與承載裝置及被載物之組合 |
JP2014009020A (ja) * | 2012-06-29 | 2014-01-20 | Sekisui Plastics Co Ltd | 梱包材および梱包体 |
CN102849355B (zh) * | 2012-09-26 | 2015-02-25 | 深圳市华星光电技术有限公司 | 液晶玻璃面板包装结构 |
TWI447054B (zh) * | 2012-10-09 | 2014-08-01 | Au Optronics Corp | 箱體及裝載顯示面板的箱體 |
CN102923394B (zh) * | 2012-10-17 | 2016-03-30 | 深圳市华星光电技术有限公司 | 一种用于容纳板体的包装箱 |
KR200473820Y1 (ko) * | 2012-11-29 | 2014-07-31 | 주식회사 삼일이노팩 | 디스플레이장치용 스티로폼 포장재 |
TWI561443B (en) * | 2012-11-30 | 2016-12-11 | Au Optronics Corp | Packing box |
CN103204291B (zh) * | 2013-04-19 | 2015-09-09 | 深圳市华星光电技术有限公司 | 一种包装装置 |
KR101497422B1 (ko) * | 2013-10-22 | 2015-03-02 | 주식회사 삼진엘앤디 | 디스플레이 패널 보호용 슬롯 |
TWM477042U (en) * | 2013-12-05 | 2014-04-21 | Sekisui Plastics Co Ltd | Reinforcing member and panel transportation vessel |
CN103723386B (zh) * | 2014-01-08 | 2016-03-16 | 友达光电(苏州)有限公司 | 面板承载箱 |
CN104185415B (zh) * | 2014-08-21 | 2018-01-16 | 昆山龙腾光电有限公司 | 基板定位承载装置、基板组立系统及基板组立方法 |
CN104401598B (zh) * | 2014-10-31 | 2017-02-01 | 京东方科技集团股份有限公司 | 显示面板的包装装置 |
JP3198009U (ja) * | 2015-03-31 | 2015-06-11 | 積水化成品工業株式会社 | 梱包材及び梱包体 |
CN109415160B (zh) * | 2016-05-18 | 2020-10-09 | 堺显示器制品株式会社 | 收纳容器 |
KR101687758B1 (ko) * | 2016-06-24 | 2016-12-19 | (주) 다쓰테크 | 유연기판 또는 유리기판 위에 도금하기 위한 전기 도금장치용 스테이지 |
WO2018016077A1 (ja) * | 2016-07-22 | 2018-01-25 | 堺ディスプレイプロダクト株式会社 | 収納容器 |
JP6357218B2 (ja) * | 2016-12-28 | 2018-07-11 | 積水化成品工業株式会社 | 梱包材および梱包体 |
KR20220022003A (ko) | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 표시 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088921A (ja) * | 2003-09-16 | 2005-04-07 | Dainippon Printing Co Ltd | 基板収納ケース |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM326523U (en) * | 2007-08-08 | 2008-02-01 | Ynidyi Entpr Co Ltd | Packaging box for LCD panel with enhanced buffering function |
-
2009
- 2009-02-16 JP JP2009032752A patent/JP5227827B2/ja active Active
-
2010
- 2010-02-08 CN CN2010900006164U patent/CN202089455U/zh not_active Expired - Lifetime
- 2010-02-08 WO PCT/JP2010/051766 patent/WO2010092920A1/ja active Application Filing
- 2010-02-08 KR KR1020117010802A patent/KR101573301B1/ko active IP Right Grant
- 2010-02-12 TW TW099104739A patent/TWI476134B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088921A (ja) * | 2003-09-16 | 2005-04-07 | Dainippon Printing Co Ltd | 基板収納ケース |
Also Published As
Publication number | Publication date |
---|---|
TWI476134B (zh) | 2015-03-11 |
WO2010092920A1 (ja) | 2010-08-19 |
KR20110115997A (ko) | 2011-10-24 |
JP5227827B2 (ja) | 2013-07-03 |
TW201041788A (en) | 2010-12-01 |
JP2010189013A (ja) | 2010-09-02 |
CN202089455U (zh) | 2011-12-28 |
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Patent event date: 20110512 Patent event code: PA01051R01D Comment text: International Patent Application |
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