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KR101086141B1 - 프린트 배선 기판 및 프린트 배선 기판의 제조 방법 - Google Patents

프린트 배선 기판 및 프린트 배선 기판의 제조 방법 Download PDF

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Publication number
KR101086141B1
KR101086141B1 KR1020090041308A KR20090041308A KR101086141B1 KR 101086141 B1 KR101086141 B1 KR 101086141B1 KR 1020090041308 A KR1020090041308 A KR 1020090041308A KR 20090041308 A KR20090041308 A KR 20090041308A KR 101086141 B1 KR101086141 B1 KR 101086141B1
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KR
South Korea
Prior art keywords
film
mass
metal layer
metal
layer
Prior art date
Application number
KR1020090041308A
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English (en)
Korean (ko)
Other versions
KR20090122881A (ko
Inventor
히로토 와타나베
하루미 나가오
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20090122881A publication Critical patent/KR20090122881A/ko
Application granted granted Critical
Publication of KR101086141B1 publication Critical patent/KR101086141B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020090041308A 2008-05-26 2009-05-12 프린트 배선 기판 및 프린트 배선 기판의 제조 방법 KR101086141B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008137169A JP5517019B2 (ja) 2008-05-26 2008-05-26 プリント配線基板およびプリント配線基板の製造方法
JPJP-P-2008-137169 2008-05-26

Publications (2)

Publication Number Publication Date
KR20090122881A KR20090122881A (ko) 2009-12-01
KR101086141B1 true KR101086141B1 (ko) 2011-11-25

Family

ID=41409097

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090041308A KR101086141B1 (ko) 2008-05-26 2009-05-12 프린트 배선 기판 및 프린트 배선 기판의 제조 방법

Country Status (4)

Country Link
JP (1) JP5517019B2 (zh)
KR (1) KR101086141B1 (zh)
CN (1) CN101594737B (zh)
TW (1) TW201006337A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101886297B1 (ko) * 2011-11-09 2018-08-09 엘지이노텍 주식회사 폴리이미드 코어를 이용한 박형 다층 인쇄회로기판 및 그 제조방법
KR20150008703A (ko) * 2013-07-15 2015-01-23 (주)이엔에이치 정전용량 방식의 터치스크린 패널 및 그 제조방법
CN104427755A (zh) * 2013-08-23 2015-03-18 富葵精密组件(深圳)有限公司 软性电路板及其制作方法
KR20190018564A (ko) * 2015-01-10 2019-02-22 미쯔비시 케미컬 주식회사 양면 금속적층 필름
WO2017183489A1 (ja) * 2016-04-18 2017-10-26 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP7049759B2 (ja) * 2016-07-12 2022-04-07 住友金属鉱山株式会社 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
CN111472000B (zh) * 2020-04-15 2021-07-27 苏州华星光电技术有限公司 一种铜钼膜层的蚀刻方法、阵列基板
US11756797B2 (en) 2020-04-15 2023-09-12 Tcl China Star Optoelectronics Technology Co., Ltd. Etching method of copper-molybdenum film and array substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002252257A (ja) * 2000-12-18 2002-09-06 Mitsui Mining & Smelting Co Ltd 半導体キャリア用フィルム及びその製造方法
JP2003318532A (ja) * 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
JP4008388B2 (ja) * 2003-06-30 2007-11-14 シャープ株式会社 半導体キャリア用フィルムおよびそれを用いた半導体装置、液晶モジュール
CN1899002A (zh) * 2003-12-26 2007-01-17 三井金属矿业株式会社 印刷电路板、其制造方法以及电路装置
JP2007069561A (ja) * 2005-09-09 2007-03-22 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板とその製造方法

Also Published As

Publication number Publication date
CN101594737B (zh) 2011-09-07
TW201006337A (en) 2010-02-01
JP2009283872A (ja) 2009-12-03
TWI362911B (zh) 2012-04-21
CN101594737A (zh) 2009-12-02
JP5517019B2 (ja) 2014-06-11
KR20090122881A (ko) 2009-12-01

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