KR100974847B1 - Coating applicator, method of transferring a substrate and method of coating - Google Patents

Abstract

The substrate is transported between a substrate conveying unit that floats the substrate and conveys the substrate, and an applicator having a coating unit for applying a liquid to the surface of the substrate while conveying the substrate to the substrate conveying unit, and an external conveying mechanism that holds and conveys the substrate. Provided is a method for transferring and applying a substrate. The receiving part which receives a part of the said external conveyance mechanism is formed in the carrying-in stage and the carrying-out stage of a board | substrate conveyance part, respectively, when receiving a part of an external conveyance mechanism, Give and take

Description

COATING APPLICATOR, METHOD OF TRANSFERRING A SUBSTRATE AND METHOD OF COATING}

TECHNICAL FIELD This invention relates to the application | coating apparatus, the delivery method of a board | substrate, and a coating method. This application claims priority based on Japanese Patent Application No. 2007-183388 for which it applied to Japan on July 12, 2007, and uses the content here.

Fine patterns, such as a wiring pattern and an electrode pattern, are formed on the glass substrate which comprises display panels, such as a liquid crystal display. In general, such a pattern is formed by a technique such as photolithography. In the photolithography method, a step of forming a resist film on a glass substrate, a step of pattern exposing the resist film, and a step of developing the resist film thereafter are performed.

BACKGROUND ART As a device for applying a resist film onto the surface of a substrate, a coating device for fixing a slit nozzle and applying a resist to a glass substrate moving below the slit nozzle is known. Especially, the coating apparatus which floats and moves a board | substrate by blowing a gas on a stage is known (patent document 1). In such a coating apparatus, a lifting pin is provided in a board | substrate carrying-in area | region and a board | substrate carrying out area | region, and when a board | substrate is exchanged with the exterior of an apparatus, this board raises a board | substrate by this lifting pin, and an external conveyance mechanism is located under a board | substrate. By forming a space capable of moving, a configuration of sending and receiving is known.

Patent Document 1: Japanese Unexamined Patent Publication No. 2005-270841

However, when the lifting pin is used, a large-scale mechanism such as the lifting mechanism of the lifting pin must be mounted on the coating device, and the cost such as power consumption when operating the lifting mechanism is high. In addition, a space for exchanging substrates was required.

In view of the above circumstances, an object of the present invention is to provide a coating apparatus, a method of receiving a substrate, and a coating method capable of reducing the cost during use.

A 1st aspect which concerns on this invention is a coating apparatus provided with the board | substrate conveyance part which floats a board | substrate and conveys, and the application | coating part which apply | coats a liquid body to the surface of the said board | substrate, conveying to the said board | substrate conveyance part, The said board | substrate conveyance is carried out. The board | substrate carrying-in area | region which carries in the said board | substrate and the board | substrate carrying out area | region which carry out the said board | substrate are formed in the part, At least one of the said board | substrate carrying area | region and the said board | substrate carrying out area | region is carried out between an external conveyance mechanism. It is characterized in that an accommodating portion for accommodating a part of the external conveyance mechanism is formed when sending and receiving.

According to the 1st aspect of this invention, the board | substrate carrying-in area | region which carries in a board | substrate and the board | substrate carrying out area | region which carry out a board | substrate are formed in the board | substrate conveyance part, and at least one of a board | substrate carrying area | region and a board | substrate carrying out area is provided with an external conveyance mechanism. Since the receiving part which receives a part of the said external conveyance mechanism is formed in the case of sending and receiving a board | substrate between, a board | substrate can be sent and received when accommodating a part of the external conveyance mechanism. Thereby, since a board | substrate can be exchanged even without providing a raise pin, the cost of that much can be reduced. In addition, since the substrate can be exchanged even without the lifting pins, the processing tact can be shortened. Moreover, since a board | substrate can be directly exchanged in a board | substrate carrying in area or a board | substrate carrying out area, the space on a board | substrate conveyance part can be utilized efficiently. Thereby, a coating device can be miniaturized.

Preferably, the coating device is provided with a gas ejection port for ejecting a gas for floating the substrate in a region excluding the accommodation portion in a region where the accommodation portion is formed among the substrate loading region and the substrate carrying region. It is done.

1st aspect of this invention WHEREIN: When the gas ejection opening which blows out the gas for floating a board | substrate is formed in the area | region except the said accommodating part in the area | region in which the accommodating part was formed among the board | substrate carrying in area and the board | substrate carrying out area, There is no need to blow off gas to the entire surface of the substrate carrying region. Thereby, compared with the case where gas is blown to the whole surface, the cost of gas blowing can be reduced.

The said coating apparatus may be formed in multiple numbers at the predetermined intervals.

In the first aspect of the present invention, when a plurality of accommodating portions are formed at predetermined intervals, a part of the external conveying mechanism can be accommodated widely even in an external conveying mechanism having a different configuration.

In the said coating apparatus, the said accommodating part may be formed in the direction along a conveyance direction.

In the 1st aspect of this invention, when the accommodating part is formed in the direction along a conveyance direction, the said board | substrate can be conveyed smoothly after receipt of a board | substrate.

Preferably, the coating device preferably positions the substrate so as to correspond to an application position by the coating unit around the region where the accommodation portion is formed at least in the substrate loading region, and the region in which the accommodation portion is formed among the substrate loading regions. A first alignment mechanism for adjusting is formed.

1st aspect of this invention WHEREIN: The 1st which adjusts the position of a board | substrate so that the accommodating part is formed in the board | substrate carrying in area at least, and the periphery of the area | region in which the accommodating part was formed among the said board | substrate carrying in area corresponded to the application | coating position by an application part. When the alignment mechanism is formed, it can be connected smoothly by conveyance of the said board | substrate after carrying in of a board | substrate. Moreover, since a liquid body can be apply | coated in the correct position on a board | substrate after that, it can be connected by appropriate application | coating operation | movement.

The coating device is preferably such that the accommodation portion is formed at least in the substrate carrying out region, and around the region in which the accommodation portion is formed in the substrate carrying out region to correspond to the position of the external transport mechanism used for carrying out the substrate. A second alignment mechanism for adjusting the position of the substrate is provided.

In the first aspect of the present invention, the accommodation portion is formed at least in the substrate carrying out region, and the position of the substrate is adjusted so as to correspond to the position of the external transport mechanism used for carrying out the substrate around the region where the accommodation portion is formed in the substrate carrying out region. When the said 2nd alignment mechanism is formed, when carrying out a board | substrate, a board | substrate can be handed to an external conveyance mechanism smoothly.

The 2nd aspect of this invention is the coating apparatus which has a board | substrate conveyance part which floats and conveys a board | substrate, and the coating apparatus which apply | coats a liquid body to the surface of the said board | substrate, conveying to the said board | substrate conveyance part, and the outside which hold | maintains and conveys the said board | substrate. A method for transferring a substrate to and from a substrate with a conveying mechanism, wherein the substrate conveying unit includes a substrate carrying region for carrying the substrate and a substrate carrying region for carrying the substrate, wherein the substrate carrying region and At least one of the said board | substrate carrying out areas is provided with the accommodating part which accommodates a part of the said external conveyance mechanism when sending and receiving the said board | substrate with an external conveyance mechanism, and accommodates a part of the said external conveyance mechanism in the said accommodating part. The substrate is exchanged by receiving the substrate by mounting the substrate on the substrate transfer unit.

According to the 2nd aspect of this invention, the board | substrate carrying-in area | region which carries in a board | substrate and the board | substrate carrying out area | region which carry out a board | substrate are formed in the board | substrate conveyance part, and at least one of a board | substrate carrying area | region and a board | substrate carrying out area is provided with an external conveyance mechanism. Since the receiving part which accommodates a part of the said external conveyance mechanism is formed at the time of exchanging a board | substrate between, and accommodates a part of the external conveyance mechanism in a accommodating part, and mounts the said board | substrate to a board | substrate conveyance part, Boards can be sent and received without installing lift pins. Thereby, the cost by that much can be reduced. In addition, since the substrate can be exchanged even without the lifting pins, the processing tact can be shortened.

In the above-mentioned substrate delivery method, you may align in the said board | substrate loading area | region so that the position of the said board | substrate may correspond to the application | coating position by the said coating part.

In the delivery method of the present invention, when the alignment is performed so that the position of the substrate in the substrate loading region corresponds to the application position by the coating portion, the substrate can be smoothly connected by conveyance of the substrate. Moreover, since a liquid body can be apply | coated in the correct position on a board | substrate after that, it can be connected by an appropriate application | coating operation.

In the above-mentioned substrate delivery method, you may align in the said board | substrate export area | region so that the position of the said board | substrate may correspond to the position of the external conveyance mechanism used for carrying out the said board | substrate.

In the 2nd aspect of this invention, when carrying out an alignment so that the position of the said board | substrate may correspond to the position of the external conveyance mechanism used for carrying out the said board | substrate in a board | substrate carrying out area | region, when carrying out a board | substrate, it is a smooth external conveyance mechanism. You can pass the substrate to.

In the above-mentioned method for transferring the substrate, the substrate transfer unit may regulate the movement of the substrate when exchanging the substrate.

In the second aspect of the present invention, when regulating the movement of the substrate in the substrate transfer section, the substrate can be prevented from shifting before the substrate is transferred.

In the application | coating method which concerns on this invention, you may send and receive the said board | substrate by the above-mentioned method of receiving and receiving a board | substrate.

In 2nd aspect of this invention, when sending and receiving a board | substrate without providing a lifting pin, the total cost at the time of using the said coating apparatus can be reduced. Moreover, since a board | substrate can be exchanged even without providing a lifting pin, it becomes possible to shorten a process tact.

According to the present invention, a coating apparatus, a method of transferring a substrate, and a coating method capable of reducing the cost at the time of use can be obtained.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a perspective view of the coating device 1 according to the present embodiment. With reference to this drawing, the main structure of the coating device 1 of this invention is demonstrated.

As shown in FIG. 1, the coating apparatus 1 which concerns on this embodiment is a coating apparatus which apply | coats a resist on the glass substrate used for a liquid crystal panel etc., for example, A board | substrate conveyance part 2 and an application part ( 3) and the management part 4 are main components. In the coating device 1, a resist is applied onto the substrate by the coating unit 3 while the substrate is lifted by the substrate transfer unit 2 and transported, and the application unit 3 is applied by the management unit 4. ) State is to be managed. The board | substrate conveyance part 2 is provided with accommodating parts 25b and 28b (refer FIG. 3) which is a characteristic component of this embodiment.

2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. With reference to these drawings, the detailed structure of the coating device 1 is demonstrated.

(Substrate conveying part)

First, the structure of the board | substrate conveyance part 2 is demonstrated.

The board | substrate conveyance part 2 has the board | substrate loading area | region 20, the coating process area | region 21, the board | substrate carrying out area | region 22, the conveyance mechanism 23, and the frame part 24 which supports these. . In this board | substrate conveyance part 2, the board | substrate S is conveyed by the conveyance mechanism 23 to the board | substrate carrying in area 20, the coating process area | region 21, and the board | substrate carrying out area 22 in order. The board | substrate loading area | region 20, the coating process area | region 21, and the board | substrate carrying out area | region 22 are arrange | positioned in this order from the upstream to the downstream side of a board | substrate conveyance direction. The conveyance mechanism 23 is formed in one side of each said part over each part of the board | substrate loading area | region 20, the coating process area | region 21, and the board | substrate carrying out area | region 22. As shown in FIG.

Hereinafter, in explaining the structure of the coating device 1, in order to simplify notation, the direction in drawing is demonstrated using an XYZ coordinate system. As a longitudinal direction of the board | substrate conveyance part 2, the conveyance direction of a board | substrate is described in the X direction. In the plan view, the direction orthogonal to the X direction (substrate conveyance direction) is described as the Y direction. The direction perpendicular to the plane including the X direction axis and the Y direction axis is denoted by the Z direction. In addition, in the X direction, the Y direction, and the Z direction, it is assumed that the arrow direction in the figure is the + direction and the direction opposite to the arrow direction is the-direction.

The board | substrate loading area 20 is a site | part which carries in the board | substrate S conveyed from the exterior of the apparatus, and has the carry-in side stage 25. As shown in FIG.

The carrying-in side stage 25 is provided in the upper part of the frame part 24, and is a rectangular plate-shaped member when it sees from the plane which consists of SUS etc., for example. This carry-in side stage 25 is long in the X direction. The air injection hole 25a and the accommodating part 25b are each provided in the carry-in side stage 25, respectively.

The air blowing hole 25a is a hole which blows out air on the stage surface 25c of the carry-in stage 25, for example, in a plane to the area | region through which the board | substrate S passes in the carry-in stage 25. When viewed, they are arranged in a matrix. This air blowing hole 25a is formed to penetrate the carrying-in side stage 25. An air supply source (not shown) is connected to the air blowing hole 25a. In this carry-in side stage 25, the board | substrate S can be made to float to + Z direction by the air blown out from the air blowing hole 25a.

The accommodating part 25b is a part which accommodates a part of the said external conveyance mechanism, when receiving the board | substrate S from an external conveyance mechanism. This accommodating part 25b is formed in the substantially whole surface toward the + X direction from the edge part of the -X direction among the board | substrate S loading area of the carrying-in side stage 25. As shown in FIG. The accommodating part 25b is formed in multiple numbers along the Y direction.

The alignment apparatus 25d is provided in the both ends of the Y direction among this carry-in stage 25 one by one. The alignment device 25d is a device for aligning the position of the substrate S carried in the carry-in side stage 25. Each alignment device 25d has a long hole and a positioning member (not shown) provided in the long hole, and mechanically sandwiches the substrate carried in the loading stage 25 from both sides.

The application | coating process area | region 21 is the site | part to which application | coating of a resist is given, and the process stage 27 which floats and supports the board | substrate S is provided.

The processing stage 27 is a rectangular plate-like member in plan view, covered with a light absorbing material mainly composed of hard alumite, for example, on the + X direction side with respect to the carrying-in side stage 25. It is installed. In the part of the processing stage 27 covered with the light absorbing material, reflection of light, such as a laser beam, is suppressed. This processing stage 27 is long in the Y direction. The dimension in the Y direction of the processing stage 27 is substantially the same as the dimension in the Y direction of the carry-in side stage 25. The process stage 27 is provided with the some air blowing hole 27a which blows off air on the stage surface 27c, and the some air suction hole 27b which sucks air on the stage surface 27c. . These air blowing holes 27a and air suction holes 27b are formed to penetrate through the processing stage 27.

In the processing stage 27, the pitch of the air jet holes 27a is narrower than the pitch of the air jet holes 25a formed in the carry-in stage 25, and thus the air jet holes 27a are smaller than the carry-in stage 25. It is densely formed. For this reason, in this processing stage 27, the floating amount of a board | substrate can be adjusted with high precision compared with another stage, and it can control so that the floating amount of a board | substrate may be 100 micrometers or less, for example, 50 micrometers or less preferably. It is supposed to be done.

The board | substrate carrying out area | region 22 is a site | part which carries out the board | substrate S to which the resist was apply | coated to the exterior of the apparatus, and has the carrying-out side stage 28. As shown in FIG. This carrying-out stage 28 is provided in the + X direction side with respect to the process stage 27, and is comprised by the material and dimension substantially the same as the carrying-in side stage 25 provided in the board | substrate carrying-in area 20. FIG. The air ejection hole 28a and the accommodating part 28b are formed in the carrying out side stage 28 similarly to the carrying in side stage 25.

The accommodating part 28b is a part which accommodates a part of the said external conveyance mechanism, when passing the board | substrate S to an external conveyance mechanism. This accommodating part 28b is formed in the carrying out area of the board | substrate S 28 with the constant width toward the -X direction from the edge part of the + X direction. The accommodating part 28b is formed in multiple numbers along the Y direction.

The conveyance mechanism 23 has the conveyer 23a, the vacuum pad 23b, and the rail 23c. The conveyer 23a has a structure in which, for example, a linear motor is provided, and the conveyer 23a is able to move on the rail 23c by driving the linear motor.

This conveyer 23a is arrange | positioned so that the predetermined part 23d may overlap with the edge part of the board | substrate S at the -Y direction when it sees in plan view. The part 23d which overlaps with this board | substrate S is formed in the position lower than the height position of the back surface of the board | substrate at the time of making the board | substrate S float.

The vacuum pad 23b is arranged in multiple numbers in the part 23d which overlaps with the said board | substrate S among the conveyers 23a. This vacuum pad 23b has the adsorption surface which vacuum-adsorbs the board | substrate S, and is arrange | positioned so that the said adsorption surface may face upward. The suction surface of the vacuum pad 23b can hold the said board | substrate S by adsorb | sucking the back surface edge part of the board | substrate S. As shown in FIG. The height position from the upper surface of the conveying machine 23a is adjustable in each vacuum pad 23b, for example, so that the height position of the vacuum pad 23b may be moved up and down according to the floating amount of the board | substrate S. It is. The rail 23c extends over each stage to the side of the carry-in stage 25, the processing stage 27, and the carry-out stage 28, and the conveyer 23a is made by sliding the said rail 23c. It is possible to move along each said stage.

(Application department)

Next, the structure of the application part 3 is demonstrated.

The application part 3 is a part which apply | coats a resist on the board | substrate S, and has the sentence frame 31 and the nozzle 32. As shown in FIG.

The sentence frame 31 has the support column member 31a and the bridge | crosslinking member 31b, and is formed so that it may hang on the process stage 27 in the Y direction. The support column members 31a are provided one by one on the Y-direction side of the processing stage 27, and each support column member 31a is supported on both side surfaces of the frame portion 24 on the Y-direction side, respectively. Each support pillar member 31a is formed so that the height position of an upper end part may mutually be the same. The bridge | crosslinking member 31b is bridge | crosslinked between the upper end parts of each support pillar member 31a, and it is possible to raise / lower the said support pillar member 31a.

The door frame 31 is connected to the movement mechanism 31c, and is movable in the X direction. The moving frame 31c enables the door frame 31 to move between the management unit 4. That is, the nozzle 32 formed in the door frame 31 is movable with the management part 4. The door frame 31 is also movable in the Z direction by a moving mechanism not shown.

The nozzle 32 is comprised in the long elongate shape of one direction, and is provided in the -Z direction side surface of the bridge | crosslinking member 31b of the sentence frame 31. As shown in FIG. The slit-like opening 32a is formed in the front-end | tip of the nozzle 32 along the longitudinal direction of the nozzle itself, and the resist is discharged from the opening 32a. The nozzle 32 is arrange | positioned so that the longitudinal direction of the opening part 32a may be parallel to a Y direction, and the said opening part 32a opposes the processing stage 27. As shown in FIG. The dimension of the longitudinal direction of the opening part 32a is smaller than the dimension of the Y direction of the board | substrate S conveyed, and the resist is not apply | coated to the peripheral area of the board | substrate S. FIG. Inside the nozzle 32, a flow path (not shown) for flowing a resist through the opening 32a is formed, and a resist supply source (not shown) is connected to the flow path. This resist supply source has a pump (not shown), for example, and the resist is discharged | emitted from the opening part 32a by pushing the resist to the opening part 32a by this pump. The nozzle 32 is provided with a moving mechanism, and the support column member 31a is provided with a moving mechanism not shown, and the nozzle 32 held by the bridge member 31b by the moving mechanism is in the Z direction. It is possible to move.

Furthermore, the sensor 33 which measures the distance in the Z direction between the opening part 32a of the nozzle 32, ie, the front end of the nozzle 32, and the opposing surface which opposes the front end of the said nozzle 32 is a bridge | crosslinking member 31b. )

(Management)

The structure of the management part 4 is demonstrated.

The management part 4 is a site | part which manages the nozzle 32 so that the discharge amount of the resist (liquid body) discharged to the board | substrate S may become constant, and it applies to the board | substrate conveyance part 2 so that it may overlap in plan view ( It is provided in the -X direction side (upstream side of a board | substrate conveyance direction) with respect to 3). This management part 4 comprises the preliminary discharge mechanism 41, the dip tank 42, the nozzle cleaning device 43, the accommodating part 44 which accommodates these, and the holding member 45 holding the said accommodating part. Have The holding member 45 is connected to the moving mechanism 45a. By the said moving mechanism 45a, the accommodating part 44 is movable in the X direction.

The preliminary ejection mechanism 41, the dip tank 42, and the nozzle cleaning device 43 are arranged in this order on the -X direction side. Each dimension of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the support column members 31a of the door frame 31, and the door frame is (31) It is accessible so that it spreads over each part.

The preliminary ejection mechanism 41 is a part which ejects a resist preliminarily. The preliminary ejection mechanism 41 is provided closest to the nozzle 32. The dip tank 42 is a liquid tank in which solvent, such as thinner, was stored inside. The nozzle cleaning device 43 is a device for rinsing and cleaning the nozzle 32.

The nozzle cleaning device 43 has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the dip tank 42 as long as the moving mechanism is provided. When the said nozzle cleaning apparatus 43 is arrange | positioned in the position (+ X direction side) close to the nozzle 32, another site | part is arrange | positioned in the position (-X direction side) far from the nozzle 32 instead. In this case, when the nozzle 32 approaches another part in the accommodating part 44, it is necessary to pass through a moving mechanism, and the movement distance of the nozzle 32 becomes long by that much.

The nozzle cleaning device 43 of the present embodiment is provided at a position on the -X direction side of the preliminary discharge mechanism 41 and the dip tank 42, and the moving mechanism of the nozzle cleaning device 43 is the nozzle cleaning device 43. Since the nozzle 32 is provided in the -X direction side rather than the washing | cleaning mechanism, the movement distance of the nozzle 32 becomes as short as possible without passing through the moving mechanism. Of course, about arrangement | positioning of the preliminary discharge mechanism 41, the dip tank 42, and the nozzle cleaning apparatus 43, it is not limited to the arrangement | positioning of this embodiment, and other arrangement | positioning may be sufficient.

(Operation of Coating Device)

Next, operation | movement of the coating device 1 comprised as mentioned above is demonstrated.

5A to 10 are diagrams showing an operation process of the coating device 1. With reference to each drawing, the operation | movement which apply | coats a resist to the board | substrate S is demonstrated. In this operation, the substrate S is loaded into the substrate loading area 20 by an external transfer mechanism, the resist is applied in the coating processing region 21 while the substrate S is floated and conveyed, and the resist is applied. One board | substrate S is carried out from the board | substrate carrying out area | region 22. FIG. 6-9, only the outline of the sentence frame 31 was shown by the dashed line, and it was easy to distinguish the structure of the nozzle 32 and the processing stage 27. As shown in FIG. The detailed operation in each part is described below.

Before carrying in a board | substrate to the board | substrate carrying in area 20, the coating device 1 is prepared and made to stand by. Specifically, the conveyer 23a is arranged on the −Y direction side of the substrate loading position of the carry-in stage 25, and the carry position is aligned with the floating height position of the substrate while bringing in the height position of the vacuum pad 23b. Air is blown out from the air blowing hole 25a of the side stage 25, the air blowing hole 27a of the processing stage 27, the air suction hole 27b, and the air blowing hole 28a of the carrying out side stage 28, respectively. It blows off or aspirates, and it is made to supply the air so that a board | substrate may float on the surface of each stage.

In this state, as shown to FIG. 5A, the board | substrate S is conveyed to the board | substrate loading position from the outside by external conveyance mechanisms, such as the conveyance arm 60, for example. When carrying in this board | substrate S on the carry-in stage 25, as shown to FIG. 5B, the said transfer arm 60 is moved to -Z direction, and a part of the said transfer arm 60 is moved to a carrying-in side stage ( It accommodates in the accommodating part 25b provided in 25. When the transfer arm 60 passes through the stage surface 25c of the carry-in side stage 25, the substrate S is held by the air supplied on the stage surface 25c, and is spaced apart on the transfer arm 60. do. Then, as shown to FIG. 5C, the conveyance arm 60 in the accommodating part 25b is moved to the -X direction side, and the conveyance arm 60 is moved out of the accommodating part 25b.

The board | substrate S hold | maintained in the state which floated with respect to the stage surface 25c by air is aligned with the board | substrate S by the positioning member of the alignment apparatus 25d. In this alignment, in particular, the position in the Y direction is adjusted to be a position corresponding to the nozzle 32 of the application portion 3. Then, the vacuum pad 23b of the conveyer 23a arrange | positioned at the -Y direction side of a board | substrate carrying in position is vacuum-suctioned to the edge part of the board | substrate S at the -Y direction side. The state to which the edge part at the side of -Y direction of the board | substrate S was adsorb | sucked is shown in FIG. After the edge part of the -Y direction side of the board | substrate S is attracted by the vacuum pad 23b, the conveyer 23a is moved along the rail 23c. Since the board | substrate S is floated, even if the drive force of the conveyer 23a is made comparatively small, the board | substrate S will move smoothly along the rail 23c.

When the conveyance direction front end of the board | substrate S reaches the position of the opening part 32a of the nozzle 32, as shown in FIG. 7, the resist is discharged toward the board | substrate S from the opening part 32a of the nozzle 32. As shown in FIG. do. Discharge of a resist is performed, fixing the position of the nozzle 32, and conveying the board | substrate S by the conveyer 23a.

With the movement of the board | substrate S, the resist film R is apply | coated on the board | substrate S as shown in FIG. The resistive film R is formed in the predetermined area | region of the board | substrate S by the board | substrate S passing under the opening part 32a which discharges a resist.

The board | substrate S in which the resist film R was formed is conveyed to the carrying out side stage 28 by the conveyer 23a. In the carrying out side stage 28, the board | substrate S is conveyed to the board | substrate carrying out position shown in FIG. 9 in the state floated with respect to the stage surface 28c.

When the substrate S reaches the substrate unloading position, the suction of the vacuum pad 23b is released. Thereafter, as shown in FIGS. 10A to 10C, for example, a part of the external transport mechanism such as the transport arm 61 is moved into the receiving portion 28b, and then the transport arm 61 is moved in the + Z direction. The transfer arm 61 receives the substrate S. As shown in FIG. After receiving the board | substrate S, the conveyance arm 61 is moved to the + X direction side. Thus, the board | substrate S is handed over to the conveyance arm 61. After passing the board | substrate S to the conveyance arm 61, the conveyer 23a is returned to the board | substrate loading position of the carry-in side stage 25 again, and it waits until the next board | substrate S is conveyed.

The preliminary ejection for maintaining the ejection state of the nozzle 32 is performed in the application part 3 until the next board | substrate S is conveyed. As shown in FIG. 11, the moving frame 31c moves the sentence frame 31 to the position of the management part 4 in the -X direction.

After moving the sentence frame 31 to the position of the management part 4, the position of the sentence frame 31 is adjusted, the nozzle 32 is made to approach the nozzle cleaning apparatus 43, and the said nozzle cleaning apparatus 43 is moved. The nozzle 32 is cleaned by this.

After the nozzle 32 is cleaned, the nozzle 32 is brought close to the preliminary ejection mechanism 41. In the preliminary ejection mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while measuring the distance between the opening 32a and the preliminary ejection surface, and the nozzle 32 is moved in the -X direction. The resist R is preliminarily ejected from the opening 32a while moving to.

After performing the preliminary ejection operation, the sentence frame 31 is returned to its original position. When the next board | substrate S is conveyed, as shown in FIG. 12, the nozzle 32 is moved to the predetermined position on a Z direction. In this manner, by repeatedly performing the application operation and the preliminary ejection operation for applying the resist film R to the substrate S, a high quality resist film R is formed on the substrate S. FIG.

In addition, you may make the said nozzle 32 approach the dip tank 42 as needed every time, for example, approaching the management part 4 predetermined number of times. In the dip tank 42, the drying of the nozzle 32 is prevented by exposing the opening 32a of the nozzle 32 to the vapor atmosphere of the solvent (thinner) stored in the dip tank 42.

Thus, according to this embodiment, when exchanging the board | substrate S with the external conveyance mechanism to the carrying-in side stage 25 and the carrying out side stage 28 of the board | substrate conveyance part 2 of the said external conveyance mechanism, Since the accommodating parts 25b and 28b which accommodate a part are formed, respectively, it is possible to give and receive the board | substrate S when accommodating a part of external conveyance mechanism. Thereby, since the board | substrate S can be exchanged even without providing a raise pin, the cost can be reduced by that much. Moreover, since the board | substrate S can be directly exchanged in the board | substrate carrying in area or the board | substrate carrying out area, the space on the board | substrate conveyance part 2 can be utilized efficiently. Thereby, the coating device 1 can be miniaturized. Moreover, since a board | substrate can be exchanged even without providing a lifting pin, it becomes possible to shorten a process tact.

The technical scope of this invention is not limited to the said embodiment, A change can be added suitably in the range which does not deviate from the meaning of this invention.

About the whole structure of the coating device 1, although the conveyance mechanism 23 was arrange | positioned at the -Y direction side of each stage in the said embodiment, it is not limited to this. For example, the structure which arrange | positions the conveyance mechanism 23 to the + Y direction side of each stage may be sufficient. Moreover, as shown in FIG. 13, the said conveyance mechanism 23 (the conveyer 23a, the vacuum pad 23b, the rail 23c) is arrange | positioned at the -Y direction side of each stage, and the said conveyance mechanism at the + Y direction side. The conveyance mechanism 53 (conveyor 53a, the vacuum pad 53b, the rail 53c) of the same structure as 23 is arrange | positioned, and the board | substrate different from the conveyance mechanism 23 and the conveyance mechanism 53 is arranged. You may comprise so that conveyance may be carried out. For example, as shown to the same figure, the conveyance mechanism 23 is made to convey the board | substrate S1, and the conveyance mechanism 53 is made to convey the board | substrate S2. In this case, since the substrate can be alternately conveyed by the transfer mechanism 23 and the transfer mechanism 53, the throughput is improved. Moreover, when conveying the board | substrate which has about half of the said board | substrate S, S1, S2, it is hold | maintained one by one by the conveyance mechanism 23 and the conveyance mechanism 53, for example, and conveyance mechanism 23 is carried out. ) And the conveyance mechanism 53 can be conveyed at the same time by advancing side by side in the + X direction. By such a configuration, the throughput can be improved.

In addition, in the said embodiment, although the alignment mechanism 25d was provided only in the carrying-in side stage 25 side among the board | substrate conveyance parts 2, it is not limited to this, Of course, for example, the carrying out stage 28 is carried out. In addition, it is good also as a structure which provides an alignment mechanism. In this case, the alignment mechanism of the carry-out stage 28 is preferably configured to align the position of the substrate S so as to correspond to the transfer arm 61.

In addition, in the said embodiment, when carrying in the board | substrate S to the carrying-in side stage 25, it was set as the structure which aligns by the alignment mechanism 25d, It is not limited to this, For example, the alignment mechanism ( Apart from 25d), a movement regulating mechanism for regulating the movement of the substrate S may be provided. For example, the movement control member which can go in and out on the stage surface 25c is arrange | positioned so that the board | substrate carrying-in area | region of the loading side stage 25 may be arrange | positioned, and this movement control member is carried out at the stage surface 25c at the time of carrying in the board | substrate S. The structure which protrudes to the above) is mentioned. The same structure may be formed with respect to the board | substrate carrying out area | region of the carrying out side stage 28. As shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the structure of the coating device which concerns on one Embodiment of this invention.

It is a front view which shows the structure of the coating device which concerns on the said embodiment of this invention.

It is a top view which shows the structure of the coating device which concerns on the said embodiment of this invention.

It is a side view which shows the structure of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the coating device which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the nozzle cleaning apparatus which concerns on the said embodiment of this invention.

It is a figure which shows the operation | movement of the nozzle cleaning apparatus which concerns on the said embodiment of this invention.

It is a top view which shows the structure of the coating device which concerns on another embodiment of this invention.

(Explanation of the sign)

1: coating device

2: board | substrate conveyance part

3: coating part

4: management

25: import side stage

25b: receptacle

25d: alignment mechanism

28: carrying out stage

28b: receptacle

S: Substrate

R: resist film

Claims (11)

A coating apparatus comprising a substrate conveying unit for floating a substrate and conveying it, and an application unit for applying a liquid to the surface of the substrate while conveying the substrate to the substrate conveying unit, A management part is provided upstream of the said coating part with respect to the said board | substrate conveyance part, The said management part has a preliminary discharge mechanism, a dip tank, and a nozzle cleaning apparatus, In the said board | substrate conveyance part, the board | substrate carrying in area which carries in the said board | substrate, and the board | substrate carrying out area which carry out the said board | substrate are formed, At least one of the said board | substrate carrying in area and the said board | substrate carrying out area is provided with the accommodating part which accommodates a part of the said external conveyance mechanism when sending and receiving the said board | substrate with an external conveyance mechanism. The method of claim 1, The application apparatus characterized by the above-mentioned substrate carrying area | region and the board | substrate carrying out area | region in which the said accommodating part was formed, the gas ejection opening which blows out the gas for floating the said board | substrate is formed in the area | region except the said accommodating part. The method of claim 1, The said accommodation part is formed in plurality at predetermined intervals, The coating apparatus characterized by the above-mentioned. The method of claim 1, The said accommodating part is formed in the direction along a conveyance direction, The coating apparatus characterized by the above-mentioned. The method of claim 1, The accommodation portion is formed at least in the substrate loading region; And a first alignment mechanism for adjusting the position of the substrate so as to correspond to the application position of the application portion around the region in which the accommodation portion is formed among the substrate loading regions. The method of claim 1, The accommodation portion is formed at least in the substrate carrying out region, A coating apparatus characterized in that a second alignment mechanism for adjusting the position of the substrate is formed around the region where the housing portion is formed in the substrate carrying region so as to correspond to the position of the external conveyance mechanism used for carrying out the substrate. . And a management unit on the upstream side of the coating unit with respect to the substrate conveying unit for floating the substrate and conveying the substrate to the substrate conveying unit and applying the liquid to the surface of the substrate and the substrate conveying unit. As a method of conveying a board | substrate which exchanges a board | substrate between the application | coating apparatus which has a preliminary discharge mechanism, a dip tank, and a nozzle cleaning apparatus, and the external conveyance mechanism which hold | maintains and conveys the said board | substrate, The board | substrate conveyance part which carries in the said board | substrate and the board | substrate carrying out area which carry out the said board | substrate is formed in the said board | substrate conveyance part, and at least one of the said board | substrate carrying area | region and the board | substrate carrying out area | region is between an external conveyance mechanism. A receiving portion for receiving a portion of the external transport mechanism is formed when the substrate is sent and received, A part of said external conveyance mechanism is accommodated in the said accommodating part, and the said board | substrate is transmitted and received by mounting the said board | substrate in the said board | substrate conveyance part. The method of claim 7, wherein The substrate delivery method of the said board | substrate carrying-in area | region is performed so that the position of the said board | substrate may correspond to the application | coating position by the said coating part. The method of claim 7, wherein And the substrate carrying area is aligned so that the position of the substrate corresponds to the position of an external transport mechanism used for carrying out the substrate. The method of claim 7, wherein The transfer method of the board | substrate which controls the movement of the said board | substrate by the said board | substrate conveyance part at the time of receipt of the said board | substrate. The coating method is used for exchanging the substrate by the transfer method of the substrate according to claim 7.

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