200922850 九、發明說明 【發明所屬之技術領域】 本發明是關於塗佈裝置、基板的收授方法以及塗佈方 法。 本案是根據於2007年7月12日在日本所申請的曰本 特願2007_183388號案來主張優先權,在此引用其內容。 【先前技術】 在液晶顯示器等的構成顯示面板的玻璃基板上,形成 有配線圖案或電極圖案等的細微圖案。一般來說這種圖案 ,是用例如光微影技術等的方法所形成。在光微影技術中 ,分別進行:在玻璃基板上形成光阻膜的步驟、將該光阻 膜進行圖案曝光的步驟、及之後將該光阻膜予以顯像的步 驟。 已知的作爲在基板表面上塗佈光阻膜的塗佈裝置,是 例如將狹縫噴嘴固定,對於移動於該狹縫噴嘴下的玻璃基 板塗佈光阻劑。在這其中習知的塗佈裝置,是藉由將氣體 噴出到台部上’來使基板浮起移動(例如參考專例文獻1 )。在這種塗佈裝置,在基板搬入區域及基板搬出區域設 置有升降銷’當與裝置的外部之間進行基板的收授時,由 於設置有:能以該升降銷將基板抬起,使外部搬運機構移 動到基板的下側的空間,而藉此來進行收授動作。 [專利文獻1]日本特開2005-270841號公報 200922850 【發明內容】 [發明欲解決的課題] 可是,當使用升降銷時,必須將該升降銷的升降機構 等的大型機構搭載於塗佈裝置,而再加上使該升降機構作 動時消耗的電力等的成本。而且需要收授基板用的空間。 鑑於以上情形,本發明的目的是要提供一種塗佈裝置 、基板的收授方法以及塗佈方法,能夠將使用時的成本降 低。 [用以解決課題的手段] 本發明的第一形態,是具備有:使基板浮起來進行搬 運的基板搬運部、及在藉由上述基板搬運部搬運基板的同 時對上述基板的表面塗佈液狀體的塗佈部,的塗佈裝置, 在上述基板搬運部,設置有:將上述基板搬入的基板搬入 區域、及將上述基板搬出的基板搬出區域;在上述基板搬 入區域及上述基板搬出區域的至少其中一方,設置有:當 與外部搬運機構之間進行收授上述基板時,將該外部搬運 機構的局部予以收容的收容部。 藉由本發明的第一形態,在基板搬運部,設置有:將 基板搬入的基板搬入區域、及將基板搬出的基板搬出區域 ;在基板搬入區域及基板搬出區域的至少其中一方,設置 有:當與外部搬運機構之間進行收授基板時,將該外部搬 運機構的局部予以收容的收容部;所以當收容外部搬運機 構的局部時可以進行基板的收授。藉此,即使不設置升降 -6- 200922850 銷也可進行基板的收授,藉此能夠降低成本。而由於即使 不設置升降銷也能進行基板的收授,所以可將處理管道縮 短化。在基板搬入區域或基板搬出區域能直接進行基板的 收授,所以能有效率地利用基板搬運部上的空間。藉此能 將塗佈裝置小型化。 上述塗佈裝置,在上述基板搬入區域及上述基板搬出 區域之中設置有上述收容部的區域,在除了上述收容部的 區域,設置有:噴出用來使上述基板浮起的氣體的氣體噴 出口。 在本發明的第一形態,在基板搬入區域及基板搬出區 域之中設置有收容部的區域,在除了收容部的區域’設置 有:噴出用來使基板浮起的氣體的氣體噴出口’則不需要 將氣體噴出到基板搬入區域及基板搬出區域的整個面。藉 此,與將氣體噴出到整個面的方式相較,能夠使氣體噴出 所需要的成本降低。 上述塗佈裝置,上述收容部,是以預定間隔設置有複 數個。 在本發明的第一形態,以預定間隔設置有複數個收容 部,則即使是不同構造的外部搬運機構’也能寬闊地將該 外部搬運機構的局部予以收容。 上述塗佈裝置,上述收容部設置在沿著搬運方向的方 向。 在本發明的第一形態,收容部設置在沿著搬運方向的 方向,則在基板收授後,能順暢地進行該基板的搬運。 200922850 上述塗佈裝置’將上述收容部至少設置在上述基板搬 入區域,在上述基板搬入區域之中設置有上述收容部的區 域的周圍’設置有:將上述基板的位置調節成對應於上述 塗佈部進行塗佈的位置的第一對準機構。 在本發明的第一形態,將收容部至少設置在基板搬入 區域,在該基板搬入區域之中設置有收容部的區域的周圍 ,設置有:將基板的位置調節成對應於塗佈部進行塗佈的 位置的第一對準機構,則在基板搬入後,能順暢地接著進 行該基板的搬運。之後也能將液狀體塗佈到基板上的正確 位置,所以能接著進行適當的塗佈動作。 上述塗佈裝置,將上述收容部至少設置在上述基板搬 出區域,在上述基板搬出區域之中設置有上述收容部的區 域的周圍,設置有:將上述基板的位置調節成與用於上述 基板的搬出的外部搬運機構的位置對應的第二對準機構。 在本發明的第一形態’將收容部至少設置在基板搬出 區域,在基板搬出區域之中設置有收容部的區域的周圍, 設置有:將基板的位置調節成與用於基板的搬出的外部搬 運機構的位置對應的第二對準機構,則當基板搬出時,能 順暢地將基板送到外部搬運機構。 本發明的第二形態,是在具備有:使基板浮起來進行 搬運的基板搬運部、及在藉由上述基板搬運部搬運基板的 同時對上述基板的表面塗佈液狀體的塗佈部,的塗佈裝置 ;以及保持上述基板將其進行搬運的外部搬運機構之間, 來進行基板的收授的基板的收授方法,在上述基板搬運部 -8- 200922850 ,設置有:將上述基板搬入的基板搬入區域、及將上述基 板搬出的基板搬出區域;在上述基板搬入區域及上述基板 搬出區域的至少其中一方,設置有:當與外部搬運機構之 間進行收授上述基板時,將該外部搬運機構的局部予以收 容的收容部;將上述外部搬運機構的局部收容於上述收容 部,藉由將上述基板載置於上述基板搬運部,來進行上述 基板的收授。 藉由本發明的第二形態,在基板搬運部,設置有:將 基板搬入的基板搬入區域、及將基板搬出的基板搬出區域 ;在基板搬入區域及基板搬出區域的至少其中一方,設置 有:當與外部搬運機構之間進行收授基板時,將該外部搬 運機構的局部予以收容的收容部;將外部搬運機構的局部 收容於收容部,藉由將該基板載置於基板搬運部’來進行 基板的收授,所以即使不設置升降銷也可進行基板的收授 ,藉此能夠降低成本。而由於即使不設置升降銷也能進行 基板的收授,所以可將處理管道縮短化。 在上述基板的收授方法,在上述基板搬入區域’進行 對準動作以讓上述基板的位置對應於上述塗佈部進行塗佈 的位置。 在上述基板的收授方法,在基板搬入區域’進行對準 動作以讓基板的位置對應於塗佈部進行塗佈的位置’則在 基板搬入後,能順暢地接著進行該基板的搬運。之後也能 將液狀體塗佈到基板上的正確位置’所以能接著進行適當 的塗佈動作。 200922850 在上述基板的收授方法,在上述基板搬出區域,進行 對準動作以讓上述基板的位置與用於該基板的搬出的外部 搬運機構的位置對應。 在本發明的第二形態,在基板搬出區域,進行對準動 作以讓上述基板的位置與用於該基板的搬出的外部搬運機 構的位置對應,則當基板搬出時,能順暢地將基板送到外 部搬運機構。 在上述的基板的收授方法,當上述基板的收授時,在 上述基板搬運部限制上述基板的移動。 在本發明的第二形態,當基板的收授時,在基板搬運 部限制基板的移動,則在基板搬運前能防止該基板偏移。 在本發明的塗佈方法,藉由上述基板的收授方法來進 行上述基板的收授。 在本發明的第二形態,不設置升降銷來進行基板的收 授時’則能讓使用該塗佈裝置時全體的成本降低。而即使 不設置升降銷也能進行基板的收授,所以可將處理管道縮 短。 [發明效果] 藉由本發明,則能提供一種塗佈裝置、基板的收授方 法以及塗佈方法,能夠將使用時的成本降低。 【實施方式】 以下根據圖面來說明本發明的實施方式。 -10 - 200922850 第1圖是本實施方式的塗佈裝置1的立體圖。參考該 圖面,來說明本發明的塗佈裝置1的主要構造。 如第1圖所示,本實施方式的塗佈裝置1,是例如在 液晶面板等所用的玻璃基板上塗佈光阻劑的塗佈裝置,是 以:基板搬運部2、塗佈部3、管理部4,爲主要構成元件 。該塗佈裝置1 ’是藉由基板搬運部2使基板浮起來進行 搬運,且藉由塗佈部3將光阻劑塗佈於該基板上,藉由管 理部4來管理塗佈部3的狀態。在基板搬運部2,設置有 本實施方式的特徵構成要件也就是收容部25b、28b (參考 第3圖)。 第2圖是塗佈裝置1的正視圖,第3圖是塗佈裝置i 的俯視圖,第4圖是塗佈裝置1的側視圖。參考這些圖面 來詳細說明塗佈裝置1的構造。 (基板搬運部) 首先來說明基板搬運部2的構造。 基板搬運部2具有:基板搬入區域20、塗佈處理區域 21、基板搬出區域22、搬運機構23、以及支承這些構造 的框架部24。在該基板搬運部2,是藉由搬運機構23將 基板S依序搬運到基板搬入區域2 0、塗佈處理區域21、 及基板搬出區域22。基板搬入區域20、塗佈處理區域21 、及基板搬出區域22,是以該順序從基板搬運方向的上游 側排列到下游側。搬運機構2 3,爲了要涵蓋基板搬入區域 20、塗佈處理區域21、及基板搬出區域22的各部分,而 -11 - 200922850 設置在該各部分的其中一側。 以下在說明塗佈裝置1的構造時,爲了容易表 用XYZ座標來說明圖中的方向。將基板搬運部2 方向也就是基板的搬運方向記爲X方向。將從俯視 察與X方向(基板搬運方向)垂直相交的方向記 向。將與包含X方向軸及Y方向軸的平面垂直的 爲z方向。分別在X方向、Y方向及z方向,圖中 方向爲+方向,與箭頭的方向相反的方向爲一方向 基板搬入區域20,是將從裝置外部搬運過來的 予以搬入的部位,具有:搬入側台(工作台)25。 搬入側台25,設置在框架部24的上部,是 SUS等所構成的從俯視方向觀察爲矩形的板狀構件 入側台25,其X方向爲長軸。在搬入側台25,分 複數的空氣噴出孔25a、與複數的收容部25b。 空氣噴出孔2 5 a,是將空氣噴出到搬入側台2 5 面25c上的孔’例如在搬入側台25之中基板S通 域配置成從俯視方向觀察爲矩陣狀。該空氣噴出孔 置成貫穿搬入側台25。空氣噴出孔25a連接著沒有 空氣供給源。在該搬入側台2 5,藉由從空氣噴出孔 噴出的空氣而能使基板S朝+ Z方向浮起。 收容部25b ’是當從外部搬運機構接收基板8 該外部搬運機構的局部予以收容的部分。該收容部 設置在:搬入側台2 5的基板S的搬入區域之中從 向的端部到+ X方向的幾乎整個面。收容部25b,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus, a method of receiving a substrate, and a coating method. The case is based on the Japanese Patent Application No. 2007_183388 filed on July 12, 2007 in Japan, the contents of which are incorporated herein by reference. [Prior Art] A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed. A known coating device for applying a photoresist film on the surface of a substrate is, for example, a slit nozzle fixed to apply a photoresist to a glass substrate which is moved under the slit nozzle. In the conventional coating apparatus, the substrate is floated and moved by ejecting a gas onto the stage (for example, refer to the specific document 1). In such a coating apparatus, when the substrate is transported between the substrate carrying-in area and the substrate carrying-out area, when the substrate is received from the outside of the apparatus, the substrate can be lifted by the lift pin to be externally transported. The mechanism moves to the space on the lower side of the substrate, thereby performing the receiving operation. [Problem to be Solved by the Invention] When a lift pin is used, it is necessary to mount a large mechanism such as a lift mechanism of the lift pin on the coating device. And the cost of the electric power consumed when the lifting mechanism is actuated. Moreover, it is necessary to receive space for the substrate. In view of the above circumstances, an object of the present invention is to provide a coating apparatus, a substrate receiving method, and a coating method, which can reduce the cost at the time of use. [Means for Solving the Problem] The first aspect of the present invention includes a substrate transporting unit that transports a substrate and transports the substrate, and a surface coating liquid for the substrate while transporting the substrate by the substrate transporting unit In the application unit of the coating unit of the shape, the substrate transporting unit is provided with a substrate loading area into which the substrate is carried in, and a substrate carrying-out area for carrying out the substrate; and the substrate loading area and the substrate carrying-out area At least one of the accommodating portions that accommodates a part of the external transport mechanism when the substrate is received from the external transport mechanism. According to the first aspect of the present invention, the substrate transporting portion is provided with a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area for carrying out the substrate, and at least one of the substrate carrying-in area and the substrate carrying-out area is provided: When the substrate is received between the external transport mechanism and the external transport mechanism, the portion of the external transport mechanism is accommodated. Therefore, when the external transport mechanism is housed, the substrate can be received. Thereby, the substrate can be received without setting the lift -6-200922850 pin, thereby reducing the cost. Further, since the substrate can be received without providing the lift pins, the processing pipe can be shortened. Since the substrate can be directly received in the substrate loading area or the substrate carrying-out area, the space on the board conveying portion can be utilized efficiently. Thereby, the coating apparatus can be miniaturized. In the above-described coating apparatus, a region in which the accommodating portion is provided in the substrate loading region and the substrate carrying-out region is provided, and a gas discharge port for discharging a gas for floating the substrate is provided in a region other than the accommodating portion. . In the first aspect of the present invention, a region in which the accommodating portion is provided in the substrate carrying-in region and the substrate carrying-out region is provided, and a gas ejector outlet for discharging a gas for floating the substrate is provided in a region 'excluding the accommodating portion' It is not necessary to eject the gas to the entire surface of the substrate carrying-in area and the substrate carrying-out area. As a result, the cost required for the gas ejection can be reduced as compared with the manner in which the gas is ejected to the entire surface. In the above coating apparatus, the accommodating portion is provided in plural at predetermined intervals. According to the first aspect of the present invention, the plurality of storage portions are provided at predetermined intervals, and the external transportation mechanism can be accommodated in a wide range even in the external transportation mechanism ’. In the above coating apparatus, the accommodating portion is provided in a direction along the conveying direction. According to the first aspect of the present invention, the accommodating portion is provided in the direction along the transport direction, and the substrate can be smoothly transported after the substrate is received. 200922850 The above-mentioned coating device 'provides the accommodating portion at least in the substrate carrying-in region, and the periphery of the region where the accommodating portion is provided in the substrate loading region is provided: the position of the substrate is adjusted to correspond to the coating The first alignment mechanism at the location where the coating is performed. In the first aspect of the present invention, the accommodating portion is provided at least in the substrate loading region, and the periphery of the region in which the accommodating portion is provided in the substrate loading region is provided to adjust the position of the substrate to be coated corresponding to the coating portion. The first alignment mechanism at the position of the cloth can smoothly carry the substrate after the substrate is carried in. Thereafter, the liquid material can be applied to the correct position on the substrate, so that an appropriate coating operation can be performed next. In the above coating apparatus, the accommodating portion is provided at least in the substrate carrying-out region, and a periphery of a region where the accommodating portion is provided in the substrate carrying-out region is provided to adjust a position of the substrate to be used for the substrate. The second alignment mechanism corresponding to the position of the external transport mechanism that is carried out. In the first aspect of the present invention, the accommodating portion is provided at least in the substrate carrying-out region, and the periphery of the region where the accommodating portion is provided in the substrate carrying-out region is provided to adjust the position of the substrate to the outside for carrying out the substrate. The second alignment mechanism corresponding to the position of the transport mechanism can smoothly transfer the substrate to the external transport mechanism when the substrate is carried out. According to a second aspect of the present invention, there is provided a substrate transporting unit that transports a substrate and transports the substrate, and a coating portion that applies a liquid to the surface of the substrate while transporting the substrate by the substrate transporting unit. And a method of accommodating a substrate for receiving a substrate between the external transfer mechanisms that hold the substrate and transporting the substrate, and the substrate transport unit -8-200922850 is provided to carry the substrate a substrate loading area and a substrate carrying-out area for carrying out the substrate; and at least one of the substrate loading area and the substrate carrying-out area is provided when the substrate is received between the external transfer mechanism and the substrate An accommodating portion for accommodating a part of the transport mechanism; a part of the external transport mechanism is housed in the accommodating portion, and the substrate is placed on the substrate transport portion to receive the substrate. According to a second aspect of the present invention, the substrate transporting unit is provided with a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area for carrying out the substrate, and at least one of the substrate carrying-in area and the substrate carrying-out area is provided: When the substrate is received between the external transport mechanism and the external transport mechanism, the external transport mechanism is partially housed in the storage portion, and the substrate is placed on the substrate transport portion Since the substrate is received, the substrate can be received without providing the lift pin, thereby reducing the cost. Further, since the substrate can be received without providing the lift pins, the processing pipe can be shortened. In the method of receiving the substrate, an alignment operation is performed in the substrate loading region ‘the position of the substrate corresponds to a position at which the coating portion is applied. In the method of accommodating the above-described substrate, the alignment operation is performed in the substrate carrying-in area so that the position of the substrate corresponds to the position at which the application portion is applied. Then, after the substrate is loaded, the substrate can be smoothly conveyed. Thereafter, the liquid can be applied to the correct position on the substrate, so that an appropriate coating operation can be performed next. In the above-described substrate receiving method, an alignment operation is performed in the substrate carrying-out area so that the position of the substrate corresponds to the position of the external transport mechanism for carrying out the substrate. According to a second aspect of the present invention, in the substrate carrying-out region, the alignment operation is performed so that the position of the substrate corresponds to the position of the external transport mechanism for carrying out the substrate, and the substrate can be smoothly transferred when the substrate is carried out. Go to the external handling mechanism. In the above-described substrate receiving method, when the substrate is received, the substrate transporting portion restricts the movement of the substrate. According to the second aspect of the present invention, when the substrate is transported, the movement of the substrate is restricted in the substrate transporting portion, and the substrate can be prevented from shifting before the substrate is transported. In the coating method of the present invention, the substrate is received by the substrate receiving method. In the second aspect of the present invention, when the substrate is not provided with the lift pin, the cost of the entire coating device can be reduced. Even if the lift pins are not provided, the substrate can be received, so the processing pipe can be shortened. [Effect of the Invention] According to the present invention, it is possible to provide a coating apparatus, a substrate receiving method, and a coating method, which can reduce the cost at the time of use. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. -10 - 200922850 Fig. 1 is a perspective view of the coating device 1 of the present embodiment. The main structure of the coating apparatus 1 of the present invention will be described with reference to this drawing. As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate conveying unit 2 and a coating unit 3 . The management unit 4 is a main constituent element. In the coating apparatus 1 ′, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the coating unit 3, and the coating unit 3 is managed by the management unit 4. status. In the substrate conveyance unit 2, the characteristic components of the present embodiment, that is, the accommodating portions 25b and 28b (refer to Fig. 3) are provided. 2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device i, and FIG. 4 is a side view of the coating device 1. The construction of the coating device 1 will be described in detail with reference to these drawings. (Substrate conveyance unit) First, the structure of the board conveyance unit 2 will be described. The substrate transporting unit 2 includes a substrate loading area 20, a coating processing area 21, a substrate carrying-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate carry-in area 20, the coating processing area 21, and the substrate carry-out area 22 by the transport mechanism 23. The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 213 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22. Hereinafter, in explaining the structure of the coating apparatus 1, the direction in the drawing will be described in order to easily express the XYZ coordinates. The direction in which the substrate conveyance unit 2 is oriented, that is, the conveyance direction of the substrate is referred to as the X direction. It is recorded in a direction perpendicular to the X direction (substrate conveyance direction) in plan view. The direction z is perpendicular to the plane including the X-axis and the Y-axis. In the X direction, the Y direction, and the z direction, the direction in the figure is the + direction, and the direction opposite to the direction of the arrow is the one direction substrate loading area 20, which is a portion to be transported from the outside of the apparatus, and has a loading side. Taiwan (workbench) 25. The loading side table 25 is provided on the upper portion of the frame portion 24, and is a plate-shaped member entering the side table 25 which is formed in a rectangular shape as viewed from a plan view, such as SUS, and has a long axis in the X direction. The loading side table 25 has a plurality of air ejection holes 25a and a plurality of housing portions 25b. The air ejection holes 255a are holes for ejecting air onto the loading side table 25 surface 25c. For example, in the loading side table 25, the substrate S is disposed in a matrix shape as viewed in a plan view. The air ejection hole is inserted through the loading side table 25. The air ejection hole 25a is connected to the air supply source. At the loading side table 25, the substrate S can be floated in the +Z direction by the air ejected from the air ejection holes. The accommodating portion 25b' is a portion that receives the substrate 8 from the external transport mechanism and houses the portion of the external transport mechanism. The accommodating portion is provided at almost the entire surface in the +X direction from the end portion of the loading region of the substrate S loaded into the side table 25. Housing portion 25b,
示,使 的長軸 方向觀 I Ύ方 方向記 箭頭的 〇 基板S 例如由 。該搬 別設有 的台表 過的區 25a設 圖示的 25a所 時來將 25b, 一 X方 沿著Y -12- 200922850 方向設置有複數個。 在該搬入側台25之中的Y方向的兩端部,各設置有 —個對準裝置2 5 d。對準裝置2 5 d ,是將搬入到搬入側台 25的基板S予以定位的裝置。各對準裝置2 5d具有:長 孔部、與設在該長孔部內的定位構件(沒有圖示),將搬 入到搬入側台2 5的基板從兩側機械性地予以夾持。 塗佈處理區域2 1,是進行光阻劑的塗佈處理的部位’ 設置有:將基板S浮起支承的處理台27。 處理台27,是以例如硬質氧化鋁膜爲主成分的光吸收 材料來覆蓋台表面27c的從俯視方向觀察爲矩形的板狀構 件,是設置在相對於搬入側台25的+ X方向側。在處理 台2 7之中以光吸收材料覆蓋的部位,會抑制雷射光等的 光線反射。該處理台2 7,Y方向爲長軸。處理台2 7的Y 方向的尺寸,與搬入側台25的Y方向尺寸大致相同。在 處理台27設置有:將空氣噴出到台表面27c上的複數的 空氣噴出孔27a、與將台表面27c上的空氣予以吸引的複 數的空氣吸引孔27b。這些空氣噴出孔27a及空氣吸引孔 27b,設置成貫穿處理台27。 在處理台2 7,空氣噴出孔2 7 a的間距,是相較於設置 在搬入側台25的空氣噴出孔25a的間距更狹窄,與搬入 側台25相比,將空氣噴出孔27a設置得較緊密。因此, 與其他的台部相比,在該處理台2 7能以較高精確度來調 節基板的浮起量,基板的浮起量例如可控制爲1 〇〇 μ„ι以下 ,而50μιη以下較佳。 -13- 200922850 基板搬出區域22,是用來將塗佈有光阻劑的基板S 搬出到裝置外部的部位,具有:搬出側台(工作台)28。 該搬出側台2 8,設置在相對於處理台2 7的+ X方向側, 由與設置在基板搬入區域2 0的搬入側台2 5大致相同的材 質、尺寸所構成。與搬入側台2 5同樣地,在搬出側台2 8 設置有:空氣噴出孔28a及收容部28b。 收容部28b,是當將基板S送到外部搬運機構時來將 該外部搬運機構的局部予以收容的部分。該收容部2 8b, 設置在:搬出側台28之中的基板S的搬出區域之中從+ χ 方向的端部到_ X方向的一定的寬度。收容部2 8 b,沿著 Y方向設置有複數個。 搬運機構23,具有:搬運機23 a、真空襯墊23b、軌 道23c。搬運機23a的構造是在內部設置有例如線性馬達 ,藉由驅動該線性馬達,讓搬運機23a可於軌道23c上移 動。 該搬運機23a是配置成:在俯視方向觀察讓預定的部 分23d重疊於基板S的- Y方向端部。與該基板S重疊的 部分23d,是設置在:較當使基板S浮起時的基板背面的 高度位置更低的位置。 真空襯墊23b,是有複數個排列在搬運機23a之中與 上述基板S重疊的部分23d。該真空襯墊23b,具有用來 真空吸附基板S的吸附面,配置成讓該吸附面朝向上方。 真空襯墊23b,藉由讓吸附面吸附住基板S的背面端部, 則可保持住該基板S。各真空襯墊23b,其從搬運機23a -14- 200922850 的上面部起算的高度位置是可調節的,例如可因應基板S 的浮起量而將真空襯墊23b的高度位置上下調整。軌道 23c是在:搬入側台25、處理台27、及搬出側台28的側 方涵蓋各台部地延伸著,藉由滑動於該軌道23c而能讓搬 運機23a沿著該各台部移動。 (塗佈部) 接著來說明塗佈部3的構造。 塗佈部3,是用來在基板S上塗佈光阻劑的部分,具 有:門型框架3 1、與噴嘴3 2。 門型框架3 1,具有:支柱構件3 1 a、與架橋構件3 ! b ,是設置成在Y方向跨越處理台27。支柱構件31a,在處 理台27的Y方向側各設置有一個,各支柱構件3 i ^分別 支承於框架部24的Y方向側的兩側面。各支柱構件31a ,是設置成讓其上端部的局度位置一致。架橋構件3 1 b , 是架橋於各支柱構件3 1 a的上端部之間,相對於該支柱構 件3 1 a可進行升降。 該門型框架31是連接於移動機構31c,可朝X方向 移動。藉由該移動機構31c讓門型框架31可在其與管理 部4之間移動。也就是說,設置於門型框架31的噴嘴32 可在其與管理部4之間移動。而該門型框架3 1,藉由沒有 圖示的移動機構讓其也可朝Z方向移動。 噴嘴32,是作成其中一方向爲長軸的長條狀,是設置 在門型框架3 1的架橋構件3 1 b的-Z方向側的面部。在 -15- 200922850 該噴嘴32之中的一 Z方向的前端,沿著本身的長軸方向 設置有狹縫狀的開口部32a,從該開口部32a將光阻劑吐 出。噴嘴32,其開口部32a的長軸方向與Y方向平行, 並且該開口部32a配置成與處理台27相對向。開口部32a 的長軸方向的尺寸是較所搬運的基板S的Y方向的尺寸更 小,而不會將光阻劑塗佈到基板S的周邊區域。在噴嘴 32的內部設置有使光阻劑流通到開口部32a的沒有圖示的 流通路,該流通路連接著沒有圖示的光阻劑供給源。該光 阻劑供給源例如具有沒有圖示的泵浦,藉由以該泵浦將光 阻劑推擠到開口部32a,而從開口部32a將光阻劑吐出。 在噴嘴32設置有移動機構,在支柱構件31a設置有沒有 圖示的移動機構,藉由該移動機構,讓在架橋構件31b所 保持的噴嘴32可朝Z方向移動。在架橋構件31b安裝有 :用來將噴嘴32的開口部32a,也就是噴嘴32的前端以 及與該噴嘴3 2前端相對向的相對向面之間的Z方向上的 距離予以測定的感應器3 3。 (管理部) 來說明管理部4的構造。 管理部4,是爲了讓吐出到基板S的光阻劑(液狀體 )的吐出量爲定量而將噴嘴32進行管理的部位,是設置 在:從俯視方向觀察與基板搬運部2重疊且相對於塗佈部 3的- X方向側(基板搬運方向的上游側)。該管理部4 ,具有:預備吐出機構41、浸漬槽42、噴嘴洗淨裝置43 -16- 200922850 、將這些構造予以收容的收容部44、以及用來保持該收容 部的保持構件4 5。保持構件4 5與移動機構4 5 a連接。藉 由該移動機構45a讓收容部44可朝X方向移動。 預備吐出機構41、浸漬槽42、及噴嘴洗淨裝置43, 是以該順序朝一 X方向側排列。該預備吐出機構4 1、浸漬 槽42、及噴嘴洗淨裝置43的Y方向的各尺寸,是較上述 門型框架3 1的支柱構件3 1 a之間的距離更小,上述門型 框架3 1是跨越各部分來接達。 預備吐出機構4 1,是預備性地將光阻劑吐出的部分。 該預備吐出機構41設置成最接近噴嘴32。浸漬槽42,是 在內部儲存有稀釋劑等的溶劑的液體槽。噴嘴洗淨裝置43 ,是用來將噴嘴3 2予以沖洗的裝置。 噴嘴洗淨裝置43,其設置有移動機構的部分,與預備 吐出機構41及浸漬槽42相較,在X方向的尺寸更大。當 將該噴嘴洗淨裝置43配置在接近噴嘴32的位置(+X方 向側)時,則將其他部位配置到距離噴嘴32較遠的位置 (- X方向側)。在這種情況,當噴嘴3 2接達到收容部 44內的其他部位時會需要通過移動機構,藉此讓噴嘴32 的移動距離變長。 本實施方式的噴嘴洗淨裝置43是設置在較預備吐出 機構41及浸漬槽42更靠- X方向側的位置,並且噴嘴洗 淨裝置43的移動機構是設置在較該噴嘴洗淨裝置43的洗 淨機構更靠- X方向側,所以噴嘴3 2不會通過移動機構 ’配置成盡量縮短噴嘴3 2的移動距離。而當然針對預備 -17- 200922850 吐出機構41、浸漬槽42、噴嘴洗淨裝置43的配置方式, 並不限於本實施方式的配置方式,也可以用其他的配置方 式。 (塗佈裝置的動作) 接著來說明如上述構造的塗佈裝置1的動作。 第5A圖〜第10圖,是顯示塗佈裝置1的動作過程的 Γ 圖面。參考各圖來說明將光阻劑塗佈在基板S的動作。在 該動作,藉由外部搬運機構將基板S搬入到基板搬入區域 2〇,使該基板S浮起而進行搬運,且在塗佈處理區域21 塗佈光阻劑,將已塗佈好該光阻劑的基板S從基板搬出區 域2 2搬出。第6圖〜第9圖僅以虛線顯示門型框架3 1 ( 管理部4是實線而已經刪除)的輪廓,而容易判斷噴嘴3 2 及處理台27的構造。以下來說明各部分的詳細動作。 在將基板搬入到基板搬入區域20之前,使塗佈裝置1 ( 待機。具體來說,在搬入側台25的基板搬入位置的-Υ 方向側配置搬運機23a,將真空襯墊23b的高度位置定位 在基板的浮起高度位置,並且從搬入側台25的空氣噴出 孔25a、處理台27的空氣噴出孔27a、空氣吸引孔27b及 搬出側台28的空氣噴出孔28a分別將空氣噴出或吸引, 成爲將空氣供給到讓基板浮起於各台部表面的程度的狀態 〇 在該狀態,例如藉由搬運臂6 0等的外部搬運機構, 如第5 A圖所示,從外部將基板S搬運到基板搬入位置。 -18- 200922850 當將該基板S搬入到搬入側台25上時,如第5B圖所示, 將該搬運臂60朝- Z方向移動,使該搬運臂6〇的局部收 容在於搬入側台25處設置的收容部25b內。當搬運臂60 通過搬入側台25的台表面25c時,藉由供給於台表面25c 上的空氣來保持基板S,讓其離開搬運臂60上。然後, 如第5C圖所示,使收容部25b內的搬運臂60朝一 X方向 側移動,使搬運臂6 0移動到收容部2 5外。 藉由空氣而保持爲相對於台表面2 5 c浮起的狀態的基 板S,是藉由定位裝置2 5 d的定位構件來進行基板S的定 位。在該定位動作,尤其是將Y方向的位置對準成爲與塗 佈部3的噴嘴3 2對應的位置。然後,使在基板搬入位置 的- Y方向側處配置的搬運機23a的真空襯墊23b真空吸 附於基板S的一 Y方向側端部。在第6圖顯示吸附著基板 S的_ Y方向側端部的狀態。在藉由真空襯墊2 3 b吸附住 基板S的- Y方向側端部之後,使搬運機2 3 a沿著軌道 23c移動。讓基板S成爲浮起狀態,所以即使搬運機23a 的驅動力較小,基板S也能沿著軌道23c順利移動。 一旦基板S的搬運方向前端到達噴嘴32的開口部32a 的位置,如第7圖所示,則從噴嘴32的開口部32a朝向 基板S吐出光阻劑。光阻劑的吐出動作,是使噴嘴3 2的 位置固定,藉由搬運機23a —邊搬運基板S —邊來進行。 伴隨著基板S的移動,則如第8圖所示在基板S上塗 佈光阻膜R。藉由讓基板S通過,吐出光阻劑的開口部 3 2a下面,而在基板S的預定區域形成光阻膜R。 -19- 200922850 形成了光阻膜R的基板s’是藉由搬運機23a將其朝 向搬出側台28搬運。在搬出側台28,在相對於台表面 2 8 c浮起的狀態,如第9圖所示將基板S搬運到基板搬出 位置。 一旦基板S到達基板搬出位置,則首先解除真空襯墊 23b的吸附。然後如第10A圖〜第10C圖所示,例如使搬 運臂61等的外部搬運機構的局部移動到收容部28b內, 而使該搬運臂61朝+ Z方向移動,搬運臂61接收基板S 。在接收了基板S之後,使搬運臂6 1朝+ X方向側移動 。將基板S送到搬運臂61。在將基板S送到搬運臂61之 後,使搬運機23a再回到搬入側台25的基板搬入位置, 待機直到要搬運下個基板S。 在尙未要搬運下個基板S的期間,在塗佈部3,進行 用來保持噴嘴32的吐出狀態的預備吐出動作。如第η圖 所示,藉由移動機構31c使門型框架31朝- X方向移動 到管理部4的位置。 在使門型框架3 1移動到管理部4的位置之後,調整 門型框架3 1的位置將噴嘴3 2接達到噴嘴洗淨裝置43,藉 由該噴嘴洗淨裝置4 3將噴嘴3 2洗淨。 在洗淨好噴嘴3 2之後,將該噴嘴3 2接達到預備吐出 機構41。在預備吐出機構41,會一邊將開口部32a與預 備吐出面之間的距離予以測定,一邊將噴嘴3 2的開口部 32a移動到z方向上的預定位置,一邊使噴嘴32朝_x方 向移動’一邊從開口部32a預備吐出光阻劑。 -20- 200922850 在預備吐出動作之後,將門型框架31回到原來位置 。當要搬運下個基板S時,如第12圖所示,使噴嘴32移 動到Z方向上的預定位置。藉由對基板S反覆進行塗佈光 阻膜R的塗佈動作與預備吐出動作,則在基板S形成良質 的光阻膜R。 而也可因應需要,例如每預定次數接達到管理部4, 則使該噴嘴3 2接達到浸漬槽42內。在浸漬槽42,藉由將 噴嘴32的開口部32a暴露於:儲存於浸漬槽42的溶劑( 稀釋劑)的蒸氣環境中,來防止噴嘴32乾燥。 藉由本實施方式,由於在基板搬運部2的搬入側台25 及搬出側台28設置有:當與外部搬運機構之間收授基板 S時,將該外部搬運機構的局部予以收容的收容部25b、 2 8b,所以當將外部搬運機構的局部收容時,能進行基板 S的收授。藉此,即使不設置升降銷也能進行基板S的收 授,藉此能使成本降低。而由於在基板搬入區域或基板搬 出區域能直接進行基板S的收授,所以能有效率地利用基 板搬運部2上的空間。藉此能使塗佈裝置1小型化。而由 於即使不設置升降銷也能進行基板的收授,所以能使處理 管道縮短化。 本發明的技術範圍並不限於上述實施方式,在不脫離 本發明主旨的範圍可以作適當變更。 針對塗佈裝置1的全體構造,在上述實施方式,雖然 是將搬運機構23配置在各台部的一 Y方向側,而並不限 於此。例如,也可將搬運機構23配置在各台部的+ Y方 -21 - 200922850 向側。而如第13圖所示,也可在各台部的- Y方向側配 置上述搬運機構23 (搬運機23a、真空襯墊23b、軌道 23c ),在+ Y方向側配置與該搬運機構23爲相同構造的 搬運機構53(搬運機53a、真空襯墊53b、軌道53c), 而能以搬運機構23與搬運機構53來搬運不同的基板。例 如,如該圖所示,在搬運機構23搬運基板S1,在搬運機 構53搬運基板S2。在該情況,則能以搬運機構23與搬 運機構53來交互搬運基板,讓生產能力提升。而在要將 具有上述基板S、SI、S2的一半程度的面積的基板進行搬 運的情況,例如以搬運機構23與搬運機構53各保持一枚 ,藉由使搬運機構23與搬運機構53朝+ X方向一同行進 ’則能同時搬運兩枚基板。藉由這種構造,則能讓生產能 力提升。 在上述實施方式中,雖然只有在基板搬運部2之中的 搬入側台25側設置對準裝置25d,而並不限於此,例如當 然也可在搬出側台2 8設置對準裝置。在該情況,搬出側 台28的對準裝置,要使基板S的位置對準成與上述搬運 臂6 1對應。 在上述實施方式,當將基板S搬入到搬入側台25時 是藉由對準裝置2 5 d進行對準動作,而並不限於此,例如 不同於對準裝置2 5,也可設置用來限制基板S移動的移 動限制機構。例如舉例,將可出沒於台表面2 5 c的移動限 制構件配置成包圍搬入側台2 5的基板搬入區域,使該移 動限制構件在搬入基板S時突出於台表面25c上。也可將 -22- 200922850 同樣的構造對於搬出側台2 8的基板搬出區域設置。 【圖式簡單說明】 第1圖是顯示本發明的一種實施方式的塗佈裝置的構 造的立體圖。 第2圖是顯示本發明的上述實施方式的塗佈裝置的構 造的正視圖。 第3圖是顯示本發明的上述實施方式的塗佈裝置的構 造的俯視圖。 第4圖是顯示本發明的上述實施方式的塗佈裝置的構 造的側視圖。 第5 A圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第5 B圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第5 C圖是本發明的上述實施方式的塗佈裝置的動作 的顯示圖。 第6圖是本發明的上述實施方式的塗佈裝置的動作的 顯Tp:圖。 第7圖是本發明的上述實施方式的塗佈裝置的動作的 顯示圖。 第8圖是本發明的上述實施方式的塗佈裝置的動作的 顯示圖。 第9圖是本發明的上述實施方式的塗佈裝置的動作的 -23- 200922850 顯示圖。The direction of the long axis is shown as I. The direction of the arrow 的 The substrate S is, for example, by . The area 25a of the table provided by the moving is set to 25a, 25b, and one X side is provided in the Y -12-200922850 direction. An alignment device 2 5 d is provided at each of both end portions of the loading side table 25 in the Y direction. The alignment device 2 5 d is a device for positioning the substrate S carried into the loading side table 25. Each of the alignment devices 25d has a long hole portion and a positioning member (not shown) provided in the long hole portion, and the substrate carried into the loading side table 25 is mechanically sandwiched from both sides. The coating treatment region 21 is a portion where the coating treatment of the photoresist is performed. ??? A processing table 27 for supporting and supporting the substrate S is provided. The processing table 27 is a plate-like member that is rectangular in plan view when the light-absorbing material having a hard aluminum oxide film as a main component is applied to cover the land surface 27c, and is provided on the +X direction side with respect to the loading side table 25. The portion of the processing table 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing table 27, the Y direction is the long axis. The size of the processing table 27 in the Y direction is substantially the same as the size of the loading side table 25 in the Y direction. The processing table 27 is provided with a plurality of air ejection holes 27a for discharging air onto the table surface 27c, and a plurality of air suction holes 27b for sucking air on the table surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27. In the processing table 27, the pitch of the air ejection holes 27a is narrower than the pitch of the air ejection holes 25a provided in the loading side table 25, and the air ejection hole 27a is provided in comparison with the loading side table 25. Closer. Therefore, compared with other stages, the processing table 27 can adjust the amount of floating of the substrate with higher accuracy, and the amount of floating of the substrate can be controlled, for example, to 1 〇〇μ ι or less, and 50 μm or less. Preferably, the substrate carrying-out area 22 is a portion for carrying out the substrate S coated with the photoresist to the outside of the apparatus, and has a carry-out side table (work table) 28. The carry-out side stand 2 8 The + X direction side of the processing table 27 is formed of substantially the same material and size as the loading side table 25 provided in the substrate loading area 20, and is similar to the loading side table 2 5 on the carry-out side. The stage 2 8 is provided with an air ejection hole 28a and an accommodating portion 28b. The accommodating portion 28b is a portion for accommodating a part of the external conveying mechanism when the substrate S is sent to the external conveying mechanism. The accommodating portion 28b is provided. Among the carry-out areas of the substrate S in the carry-out side table 28, the end portion from the + 方向 direction is a constant width in the _X direction. The accommodating portion 2 8 b is provided in plural in the Y direction. It has a conveyor 23a, a vacuum pad 23b, and a rail 23c. The structure of the transporter 23a is internally provided with, for example, a linear motor that allows the transporter 23a to move on the rail 23c by driving the linear motor. The transporter 23a is configured to overlap the predetermined portion 23d when viewed in a plan view. The portion 23d overlapping the substrate S in the -Y direction end portion of the substrate S is disposed at a position lower than the height position of the back surface of the substrate when the substrate S is floated. The vacuum liner 23b has a plurality of positions. The portion 23d of the carrier 23a that overlaps the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The substrate S can be held by the adsorption surface adsorbing the back end portion of the substrate S. The height position of each vacuum pad 23b from the upper surface of the carrier 23a - 14 - 200922850 can be adjusted, for example, The height position of the vacuum pad 23b is adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends over the side of the loading side table 25, the processing table 27, and the unloading side table 28, and By sliding on the track 23c, the conveyor 23a can be moved along the respective bases. (Coating portion) Next, the structure of the coating portion 3 will be described. The coating portion 3 is a portion for applying a photoresist on the substrate S. The door frame 3 1 and the nozzle 3 2. The door frame 3 1 has a pillar member 3 1 a and a bridge member 3 b that is disposed to span the processing table 27 in the Y direction. The pillar member 31a is One of the Y-direction sides of the processing table 27 is provided, and each of the pillar members 3 i ^ is supported on both side surfaces of the frame portion 24 on the Y-direction side. Each of the pillar members 31a is disposed such that the position of the upper end portion thereof coincides. The bridging members 3 1 b are bridged between the upper end portions of the respective strut members 31a, and are movable up and down with respect to the strut members 31a. The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided to the portal frame 31 is movable between it and the management portion 4. The gantry frame 3 1, which can also be moved in the Z direction by a moving mechanism not shown. The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 3 1 b of the portal frame 3 1 . In the -15-200922850, one end of the nozzle 32 in the Z direction is provided with a slit-like opening 32a along the longitudinal direction of the nozzle 32, and the photoresist is discharged from the opening 32a. In the nozzle 32, the longitudinal direction of the opening 32a is parallel to the Y direction, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the major axis direction is smaller than the dimension of the substrate S to be transported in the Y direction, and the photoresist is not applied to the peripheral region of the substrate S. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening 32a is provided, and a flow of the photoresist (not shown) is connected to the flow path. The resist supply source has, for example, a pump (not shown), and the resist is discharged from the opening 32a by pushing the resist to the opening 32a by the pump. The nozzle 32 is provided with a moving mechanism, and the strut member 31a is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 held by the bridging member 31b to move in the Z direction. The bridge member 31b is provided with an inductor 3 for measuring the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip end of the nozzle 32 and the opposing surface facing the tip end of the nozzle 3 2 . 3. (Management Unit) The structure of the management unit 4 will be described. The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is disposed so as to overlap the substrate transport unit 2 as viewed in plan view. On the -X direction side of the coating portion 3 (upstream side in the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43-16-200922850, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45 5 a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a. The preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 are arranged in the X direction side in this order. The size of each of the preliminary discharge mechanism 4 1 , the immersion tank 42 , and the nozzle cleaning device 43 in the Y direction is smaller than the distance between the pillar members 31 1 a of the portal frame 3 1 , and the gate frame 3 is smaller. 1 is to access through the various parts. The preliminary discharge mechanism 41 is a portion that preliminarily discharges the photoresist. The preliminary discharge mechanism 41 is disposed closest to the nozzle 32. The immersion tank 42 is a liquid tank in which a solvent such as a diluent is stored. The nozzle cleaning device 43 is a device for rinsing the nozzle 32. The nozzle cleaning device 43 is provided with a moving mechanism, and has a larger dimension in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42. When the nozzle cleaning device 43 is disposed at a position close to the nozzle 32 (+X direction side), the other portion is disposed at a position farther from the nozzle 32 (-X direction side). In this case, when the nozzle 3 2 is connected to other portions in the accommodating portion 44, it is necessary to pass the moving mechanism, thereby making the moving distance of the nozzle 32 long. The nozzle cleaning device 43 of the present embodiment is provided at a position closer to the -X direction than the preliminary discharge mechanism 41 and the immersion tank 42, and the moving mechanism of the nozzle cleaning device 43 is provided in the nozzle cleaning device 43. Since the cleaning mechanism is further on the X-direction side, the nozzle 32 is not configured by the moving mechanism to minimize the moving distance of the nozzle 32. Of course, the arrangement of the discharge mechanism 41, the dipping tank 42, and the nozzle cleaning device 43 for the preparation -17-200922850 is not limited to the arrangement of the present embodiment, and other arrangements may be employed. (Operation of Coating Apparatus) Next, the operation of the coating apparatus 1 having the above configuration will be described. Figs. 5A to 10 are views showing the operation of the coating device 1. The action of applying a photoresist to the substrate S will be described with reference to the respective drawings. In this operation, the substrate S is carried into the substrate carrying-in area 2 by the external transport mechanism, the substrate S is floated and transported, and the photoresist is applied to the coating processing region 21 to apply the light. The substrate S of the resist is carried out from the substrate carry-out area 2 2 . 6 to 9 show the outline of the portal frame 3 1 (the management unit 4 is a solid line and has been deleted) by a broken line, and it is easy to judge the configuration of the nozzle 3 2 and the processing table 27. The detailed operation of each part will be described below. Before the substrate is carried into the substrate loading area 20, the application device 1 is placed on standby (specifically, the carrier 23a is placed on the side of the substrate carrying position of the loading side table 25, and the height position of the vacuum pad 23b is placed. Positioned at the floating height position of the substrate, and the air ejection hole 25a of the loading side table 25, the air ejection hole 27a of the processing table 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out side table 28 respectively eject or attract air. In a state in which the air is supplied to the surface of each of the mesa portions, the external substrate is transported from the outside, for example, as shown in FIG. 5A. Transfer to the substrate loading position. -18- 200922850 When the substrate S is carried onto the loading side table 25, as shown in Fig. 5B, the transport arm 60 is moved in the -Z direction to partially the transport arm 6 The accommodation is housed in the accommodating portion 25b provided at the loading side table 25. When the transport arm 60 is carried into the table surface 25c of the side table 25, the substrate S is held by the air supplied to the table surface 25c, and is separated from the transport arm 60. On. Then, as in the first As shown in FIG. 5C, the transport arm 60 in the accommodating portion 25b is moved toward the X-direction side, and the transport arm 60 is moved outside the accommodating portion 25. The air is held by the air to be floated relative to the table surface 2 5 c. The substrate S is positioned by the positioning member of the positioning device 25d. In this positioning operation, in particular, the position in the Y direction is aligned to the position corresponding to the nozzle 32 of the coating unit 3. Then, the vacuum pad 23b of the carrier 23a disposed on the -Y direction side of the substrate loading position is vacuum-adsorbed to the Y-direction side end portion of the substrate S. Fig. 6 shows the _Y direction side of the substrate S adsorbed thereon. After the end portion of the substrate S is adsorbed by the vacuum pad 2 3 b, the carrier 2 3 a is moved along the rail 23c. The substrate S is brought into a floating state, so even if it is carried The driving force of the machine 23a is small, and the substrate S can smoothly move along the rail 23c. When the leading end of the substrate S in the conveyance direction reaches the position of the opening 32a of the nozzle 32, as shown in Fig. 7, the opening from the nozzle 32 is opened. 32a discharges a photoresist toward the substrate S. The discharge operation of the photoresist is such that The position of the nozzle 3 2 is fixed, and the carrier 23a is transported while carrying the substrate S. With the movement of the substrate S, the photoresist film R is applied onto the substrate S as shown in Fig. 8. The substrate S passes through the opening portion 32a of the photoresist, and a photoresist film R is formed in a predetermined region of the substrate S. -19- 200922850 The substrate s' on which the photoresist film R is formed is formed by the carrier 23a. The conveyance side table 28 is conveyed to the carry-out side table 28. The substrate S is transported to the substrate carry-out position as shown in Fig. 9 in a state where the carry-out side stand 28 is floated with respect to the table surface 28c. Once the substrate S reaches the substrate carry-out position, the suction of the vacuum liner 23b is first released. Then, as shown in Figs. 10A to 10C, for example, a part of the external transport mechanism such as the transport arm 61 is moved into the accommodating portion 28b, and the transport arm 61 is moved in the +Z direction, and the transport arm 61 receives the substrate S. After the substrate S is received, the transport arm 6 1 is moved toward the +X direction side. The substrate S is sent to the transfer arm 61. After the substrate S is sent to the transport arm 61, the transporter 23a is returned to the substrate loading position of the loading side table 25, and stands by until the next substrate S is to be transported. While the next substrate S is not being transported, the application portion 3 performs a preliminary discharge operation for holding the discharge state of the nozzles 32. As shown in the figure n, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the moving mechanism 31c. After the door frame 3 1 is moved to the position of the management unit 4, the position of the door frame 3 1 is adjusted to connect the nozzle 3 2 to the nozzle cleaning device 43, and the nozzle cleaning device 4 3 washes the nozzle 3 2 net. After the nozzle 3 2 is cleaned, the nozzle 3 2 is connected to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the z direction while the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is moved in the _x direction. The preparation of the photoresist is prepared from the opening 32a. -20- 200922850 After the preparatory ejection operation, the portal frame 31 is returned to the original position. When the next substrate S is to be transported, as shown in Fig. 12, the nozzle 32 is moved to a predetermined position in the Z direction. By applying the coating operation of the photoresist film R and the preliminary discharge operation to the substrate S, a favorable photoresist film R is formed on the substrate S. Alternatively, if necessary, for example, the management unit 4 is connected every predetermined number of times, and the nozzle 3 2 is brought into the dipping tank 42. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening 32a of the nozzle 32 to a vapor atmosphere of a solvent (diluent) stored in the immersion tank 42. In the present embodiment, the loading side table 25 and the unloading side table 28 of the board conveying unit 2 are provided with a housing portion 25b that accommodates a part of the external conveying mechanism when the substrate S is received between the external conveying mechanism and the external conveying mechanism. Since it is 2 8b, when the external transport mechanism is partially housed, the substrate S can be received. Thereby, the substrate S can be received without providing the lift pins, whereby the cost can be reduced. Further, since the substrate S can be directly received in the substrate loading area or the substrate carrying-out area, the space on the substrate conveying unit 2 can be efficiently utilized. Thereby, the coating apparatus 1 can be miniaturized. Further, since the substrate can be received without providing the lift pins, the processing pipe can be shortened. The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention. In the entire configuration of the coating device 1, in the above embodiment, the transport mechanism 23 is disposed on the Y-direction side of each of the table portions, and is not limited thereto. For example, the transport mechanism 23 may be disposed on the side of the +Y side -21 - 200922850 of each stage. Further, as shown in Fig. 13, the transport mechanism 23 (the transporter 23a, the vacuum cushion 23b, and the rail 23c) may be disposed on the -Y direction side of each of the base portions, and the transport mechanism 23 may be disposed on the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum cushion 53b, and the rail 53c) having the same structure can transport different substrates by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the substrate S1 is transported by the transport mechanism 23, and the substrate S2 is transported by the transport mechanism 53. In this case, the substrate can be transported by the transport mechanism 23 and the transport mechanism 53 to increase the productivity. On the other hand, when the substrate having the area of half of the substrates S, SI, and S2 is to be transported, for example, the transport mechanism 23 and the transport mechanism 53 are each held one by one, and the transport mechanism 23 and the transport mechanism 53 are moved toward the + The X direction can be carried in at the same time. With this configuration, production capacity can be improved. In the above-described embodiment, the aligning device 25d is provided only on the loading side table 25 side of the board conveying portion 2, and the aligning device is not limited thereto. For example, the aligning device can be provided on the carry-out side table 28. In this case, the alignment device of the carry-out side table 28 is aligned with the position of the substrate S so as to correspond to the transfer arm 61. In the above embodiment, the alignment operation is performed by the alignment device 25 d when the substrate S is carried into the loading side table 25, and is not limited thereto. For example, unlike the alignment device 25, it may be provided. A movement restricting mechanism that restricts the movement of the substrate S. For example, the movement restricting member that can be present on the table surface 2 5 c is disposed so as to surround the substrate loading area of the loading side table 25, and the movement restricting member protrudes from the table surface 25c when the substrate S is loaded. The same structure as -22-200922850 can also be provided for the substrate carry-out area of the carry-out side table 28. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a coating apparatus according to an embodiment of the present invention. Fig. 2 is a front elevational view showing the configuration of the coating apparatus of the above embodiment of the present invention. Fig. 3 is a plan view showing the configuration of the coating apparatus of the above embodiment of the present invention. Fig. 4 is a side view showing the configuration of the coating apparatus of the above embodiment of the present invention. Fig. 5A is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 5B is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 5C is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 6 is a view showing the operation of the coating apparatus according to the above embodiment of the present invention. Fig. 7 is a view showing the operation of the coating apparatus of the above embodiment of the present invention. Fig. 8 is a view showing the operation of the coating apparatus according to the embodiment of the present invention. Fig. 9 is a view showing the operation of the coating apparatus according to the embodiment of the present invention, -23-200922850.
第1 0A 的顯示圖。Display of the 1st 0A.
第10B 的顯示圖。 第1 0C 的顯示圖。 圖是本發明 圖是本發明 圖是本發明 的上述實施 的上述實施 的上述實施 方式的塗佈 方式的塗佈 方式的塗佈 裝置的動作 裝置的動作 裝置的動作 第Η圖是本發明的上述實施方式的噴嘴洗淨裝置的 動作的顯示圖。 第12圖是本發明的上述實施方式的噴嘴洗淨裝置的 動作的顯示圖。 第13圖是顯不本發明的另一個實施方式的塗佈裝置 的構造的俯視圖。 【主要元件符號說明】 1 :塗佈裝置 2 :基板搬運部 3 :塗佈部 4 :管理部 25 :搬入側台 25b :收容部 2Sd :對準裝置 2 8 :搬出側台 28b :收容部 -24- 200922850 S :基板 R :光阻膜Display of page 10B. The display of the 1 0C. The present invention is an operation of the operating device of the working device of the coating device of the coating method according to the above-described embodiment of the above-described embodiment of the present invention, which is the above-described embodiment of the present invention. A display diagram of the operation of the nozzle cleaning device of the embodiment. Fig. 12 is a view showing the operation of the nozzle cleaning device according to the embodiment of the present invention. Fig. 13 is a plan view showing the configuration of a coating apparatus according to another embodiment of the present invention. [Explanation of main component symbols] 1 : Coating apparatus 2 : Substrate conveying section 3 : Coating section 4 : Management section 25 : Loading side table 25 b : accommodating section 2 Sd : Aligning device 2 8 : Carrying out side 28 b : accommodating section - 24- 200922850 S : Substrate R: Photoresist film