KR100872281B1 - 나노와이어 구조체를 이용한 반도체 발광소자 및 그제조방법 - Google Patents
나노와이어 구조체를 이용한 반도체 발광소자 및 그제조방법 Download PDFInfo
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- KR100872281B1 KR100872281B1 KR1020060129014A KR20060129014A KR100872281B1 KR 100872281 B1 KR100872281 B1 KR 100872281B1 KR 1020060129014 A KR1020060129014 A KR 1020060129014A KR 20060129014 A KR20060129014 A KR 20060129014A KR 100872281 B1 KR100872281 B1 KR 100872281B1
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- light emitting
- emitting device
- semiconductor light
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- 239000002070 nanowire Substances 0.000 title claims abstract description 60
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims description 25
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000010409 thin film Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000012780 transparent material Substances 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 abstract description 8
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000011777 magnesium Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000010949 copper Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- 239000011701 zinc Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- -1 Gd 2 O 2 S: Tb Chemical compound 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/701—Integrated with dissimilar structures on a common substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/701—Integrated with dissimilar structures on a common substrate
- Y10S977/72—On an electrically conducting, semi-conducting, or semi-insulating substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/701—Integrated with dissimilar structures on a common substrate
- Y10S977/72—On an electrically conducting, semi-conducting, or semi-insulating substrate
- Y10S977/721—On a silicon substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
- Y10S977/765—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less with specified cross-sectional profile, e.g. belt-shaped
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/939—Electron emitter, e.g. spindt emitter tip coated with nanoparticles
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (13)
- 기판;상기 기판 상에 순차적으로 형성된 제1 도전형 반도체층, 활성층 및 제2 도전형 반도체층을 갖는 발광 구조물;상기 발광 구조물 상에 형성되고 투명 물질로 이루어진 다수의 나노 와이어 구조체; 및상기 다수의 나노 와이어 구조체의 상면, 측면 및 상기 다수의 나노 와이어 구조체 사이에 노출된 상기 발광 구조물 상에 형성된 형광체 박막을 포함하는 것을 특징으로 하는 반도체 발광소자.
- 제1항에 있어서,상기 다수의 나노 와이어 구조체는 투명 전도성 산화물로 이루어진 것을 특징으로 하는 반도체 발광소자.
- 제2항에 있어서,상기 투명 전도성 산화물은 In, Sn, Zn, Ga, Cd, Mg, Be, Ag, Mo, V, Cu, Ir, Rh, Ru, W, Co, Ni, Mn 및 La으로 이루어지는 그룹에서 선택된 적어도 어느 한 원소의 산화물인 것을 특징으로 하는 반도체 발광소자.
- 제1항에 있어서,상기 다수의 나노 와이어는 ZnxMg1-xO(0≤x≤1) 및 AlxInyGa1-x N(0≤x,y≤1)으로 이루어지는 그룹에서 선택된 어느 하나의 물질로 이루어진 것을 특징으로 하는 반도체 발광소자.
- 삭제
- 제1항에 있어서,상기 기판은 도전성을 가지며,상기 기판의 하면과 상기 제2 도전형 반도체층의 상면에 각각 형성된 제1 및 제2 전극을 더 포함하는 것을 특징으로 하는 반도체 발광소자.
- 제1항에 있어서,상기 다수의 나노 와이어는 2∼100㎚의 간격으로 성장되는 것을 특징으로 하는 반도체 발광소자.
- 기판 상에 제1 도전형 반도체층, 활성층 및 제2 도전형 반도체층을 갖는 발광 구조물을 형성하는 단계;상기 발광 구조물 상에 투명 물질로 이루어진 다수의 나노 와이어 구조체를 형성하는 단계; 및상기 다수의 나노 와이어 구조체의 상면, 측면 및 상기 다수의 나노 와이어 구조체 사이에 노출된 상기 발광 구조물 상에 형광체 박막을 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 발광소자 제조방법.
- 제8항에 있어서,상기 다수의 나노 와이어는 투명 전도성 산화물로 이루어진 것을 특징으로 하는 반도체 발광소자 제조방법.
- 제9항에 있어서,상기 투명 전도성 산화물은 In, Sn, Zn, Ga, Cd, Mg, Be, Ag, Mo, V, Cu, Ir, Rh, Ru, W, Co, Ni, Mn 및 La으로 이루어지는 그룹에서 선택된 적어도 어느 한 원소의 산화물인 것을 특징으로 하는 반도체 발광소자 제조방법.
- 제8항에 있어서,상기 다수의 나노 와이어는 ZnxMg1-xO(0≤x≤1) 및 AlxInyGa1-x N(0≤x,y≤1)으로 이루어지는 그룹에서 선택된 어느 하나의 물질로 이루어진 것을 특징으로 하는 반도체 발광소자 제조방법.
- 삭제
- 제8항에 있어서,상기 다수의 나노 와이어는 2∼100㎚의 간격으로 성장되는 것을 특징으로 하는 반도체 발광소자 제조방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060129014A KR100872281B1 (ko) | 2006-12-15 | 2006-12-15 | 나노와이어 구조체를 이용한 반도체 발광소자 및 그제조방법 |
US11/896,667 US7781778B2 (en) | 2006-12-15 | 2007-09-05 | Semiconductor light emitting device and method of manufacturing the same employing nanowires and a phosphor film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060129014A KR100872281B1 (ko) | 2006-12-15 | 2006-12-15 | 나노와이어 구조체를 이용한 반도체 발광소자 및 그제조방법 |
Publications (2)
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KR20080055546A KR20080055546A (ko) | 2008-06-19 |
KR100872281B1 true KR100872281B1 (ko) | 2008-12-05 |
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US (1) | US7781778B2 (ko) |
KR (1) | KR100872281B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101075185B1 (ko) | 2010-07-12 | 2011-10-19 | 국민대학교산학협력단 | 다양한 크기와 형상을 갖는 막 구조체를 포함하는 소자 제조 방법 |
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KR20100028412A (ko) * | 2008-09-04 | 2010-03-12 | 삼성전자주식회사 | 나노 막대를 이용한 발광 다이오드 및 그 제조 방법 |
KR101048713B1 (ko) * | 2008-10-20 | 2011-07-14 | 엘지디스플레이 주식회사 | 유기발광 디바이스 및 그 제조 방법 |
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