KR100593264B1 - p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 - Google Patents
p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 Download PDFInfo
- Publication number
- KR100593264B1 KR100593264B1 KR1020030041813A KR20030041813A KR100593264B1 KR 100593264 B1 KR100593264 B1 KR 100593264B1 KR 1020030041813 A KR1020030041813 A KR 1020030041813A KR 20030041813 A KR20030041813 A KR 20030041813A KR 100593264 B1 KR100593264 B1 KR 100593264B1
- Authority
- KR
- South Korea
- Prior art keywords
- zinc oxide
- type
- thin film
- type semiconductor
- nanorod
- Prior art date
Links
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims abstract description 113
- 239000011787 zinc oxide Substances 0.000 title claims abstract description 53
- 239000002073 nanorod Substances 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 239000010409 thin film Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000011777 magnesium Substances 0.000 claims description 21
- 239000011701 zinc Substances 0.000 claims description 13
- 125000002524 organometallic group Chemical group 0.000 claims description 11
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011572 manganese Substances 0.000 claims description 7
- 239000011669 selenium Substances 0.000 claims description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 abstract 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 12
- 229910002601 GaN Inorganic materials 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- -1 zinc acetate anhydride Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011654 magnesium acetate Substances 0.000 description 2
- 235000011285 magnesium acetate Nutrition 0.000 description 2
- 229940069446 magnesium acetate Drugs 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 2
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 239000004246 zinc acetate Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- UJYLYGDHTIVYRI-UHFFFAOYSA-N cadmium(2+);ethane Chemical compound [Cd+2].[CH2-]C.[CH2-]C UJYLYGDHTIVYRI-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- ALCDAWARCQFJBA-UHFFFAOYSA-N ethylselanylethane Chemical compound CC[Se]CC ALCDAWARCQFJBA-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- AKTIAGQCYPCKFX-FDGPNNRMSA-L magnesium;(z)-4-oxopent-2-en-2-olate Chemical compound [Mg+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AKTIAGQCYPCKFX-FDGPNNRMSA-L 0.000 description 1
- QBJCZLXULXFYCK-UHFFFAOYSA-N magnesium;cyclopenta-1,3-diene Chemical compound [Mg+2].C1C=CC=[C-]1.C1C=CC=[C-]1 QBJCZLXULXFYCK-UHFFFAOYSA-N 0.000 description 1
- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000001883 metal evaporation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- SZKTYYIADWRVSA-UHFFFAOYSA-N zinc manganese(2+) oxygen(2-) Chemical compound [O--].[O--].[Mn++].[Zn++] SZKTYYIADWRVSA-UHFFFAOYSA-N 0.000 description 1
- UMJICYDOGPFMOB-UHFFFAOYSA-N zinc;cadmium(2+);oxygen(2-) Chemical compound [O-2].[O-2].[Zn+2].[Cd+2] UMJICYDOGPFMOB-UHFFFAOYSA-N 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/605—Products containing multiple oriented crystallites, e.g. columnar crystallites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02389—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/0256—Selenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02603—Nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/121—Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/122—Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/823—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Led Devices (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
- p-타입 반도체 박막 위에 n-타입 산화아연(ZnO)계 나노막대가 수직방향으로 성장되고 상기 박막상에 성장된 ZnO계 나노막대들 사이의 팁 부분을 제외한 빈 공간이 절연물질로 채워져 있는 p-타입 반도체와 n-타입 산화아연계 나노막대의 p-n 이종접합 구조체를 포함하는 나노소자.
- 제 1 항에 있어서,p-타입 반도체의 밴드갭이 1.5 eV 내지 4.5 eV 범위인 것을 특징으로 하는, 나노소자.
- 제 2 항에 있어서,p-타입 반도체가 GaN, AlN, GaP 및 GaAs 중에서 선택된 III-V족 화합물 반도체, ZnSe, CdSe, CdS 및 ZnS 중에서 선택된 II-VI족 화합물 반도체, 또는 SrCu2O2, SiC 및 Si 중에서 선택된 반도체임을 특징으로 하는 나노소자.
- 제 1 항에 있어서,산화아연계 나노막대가 산화아연(ZnO)에 마그네슘(Mg), 망간(Mn), 카드뮴(Cd) 또는 셀레늄(Se)이 추가로 포함된 형태인 것을 특징으로 하는 나노소자.
- p-타입 반도체 박막이 위치된 반응기 내로 아연-함유 유기금속 및 산소-함유 기체 또는 산소-함유 유기물을 별개의 라인을 통해 각각 반응기에 주입하고, 0.1 내지 10 torr의 압력 및 온도 400 내지 700℃의 반응 조건 하에서 상기 반응물들을 화학반응시킴으로써, 상기 반도체 박막 표면상에 n-타입 나노막대를 형성하고, 상기 p-타입 반도체 박막상에 성잗된 ZnO계 나노막대 주위의 빈 공간을 절연 물질로 채우고, 산화아연 나노막대의 팁 부분을 노출시킨 다음, p-타입 반도체 박막과 n-타입 나노막대의 표면 상에 전극을 형성하는 단계를 포함하는, 제1항의 나노소자의 제조방법.
- 제 1 항에 따른 나노소자를 복수개 포함하는 나노소자의 어레이.
- 삭제
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030041813A KR100593264B1 (ko) | 2003-06-26 | 2003-06-26 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
CNB2004800177881A CN100499186C (zh) | 2003-06-26 | 2004-06-25 | 氧化锌基纳米棒和半导体薄膜的p-n异质结结构、其制备和包括其的纳米器件 |
US10/562,006 US7541623B2 (en) | 2003-06-26 | 2004-06-25 | P-n heterojunction structure of zinc oxide-based nanorod and semiconductor thin film, preparation thereof, and nano-device comprising same |
PCT/KR2004/001546 WO2004114422A1 (en) | 2003-06-26 | 2004-06-25 | P-n heterojunction structure of zinc oxide-based nanorod and semiconductor thin film, preparation thereof, and nano-device comprising same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030041813A KR100593264B1 (ko) | 2003-06-26 | 2003-06-26 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050001582A KR20050001582A (ko) | 2005-01-07 |
KR100593264B1 true KR100593264B1 (ko) | 2006-06-26 |
Family
ID=36845388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030041813A KR100593264B1 (ko) | 2003-06-26 | 2003-06-26 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7541623B2 (ko) |
KR (1) | KR100593264B1 (ko) |
CN (1) | CN100499186C (ko) |
WO (1) | WO2004114422A1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011078555A2 (ko) * | 2009-12-22 | 2011-06-30 | 동국대학교 산학협력단 | 접촉 구조의 나노로드 반도체 소자 및 그 제조 방법 |
KR101195079B1 (ko) | 2009-09-21 | 2012-11-05 | 위승용 | 피타입과 엔타입화 아연산화물을 함유하는 박막조성물의 코팅방법 |
KR101755655B1 (ko) * | 2016-05-04 | 2017-07-19 | 세종대학교산학협력단 | 발광 소자 및 그의 제조 방법 |
KR20200037014A (ko) | 2018-09-28 | 2020-04-08 | 동국대학교 산학협력단 | 표면 모폴리지 제어 및 광전 특성이 향상된 산화아연계 p-n 이종접합 구조체 및 이의 제조방법 |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100593264B1 (ko) * | 2003-06-26 | 2006-06-26 | 학교법인 포항공과대학교 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
JP3805338B2 (ja) * | 2003-11-07 | 2006-08-02 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US7192802B2 (en) * | 2004-10-29 | 2007-03-20 | Sharp Laboratories Of America, Inc. | ALD ZnO seed layer for deposition of ZnO nanostructures on a silicon substrate |
CN100413780C (zh) * | 2005-04-30 | 2008-08-27 | 中国科学院金属研究所 | 一种纳米棒阵列材料 |
EP1727216B1 (en) | 2005-05-24 | 2019-04-24 | LG Electronics, Inc. | Rod type light emitting diode and method for fabricating the same |
KR100643083B1 (ko) * | 2005-07-20 | 2006-11-10 | 학교법인 포항공과대학교 | 산화아연 나노구조체 제조방법 및 이를 이용한 소자 |
KR100720101B1 (ko) * | 2005-08-09 | 2007-05-18 | 삼성전자주식회사 | 나노구조의 다기능성 오믹층을 사용한 탑에미트형 질화물계발광소자 및 그 제조방법 |
WO2007021047A1 (en) * | 2005-08-19 | 2007-02-22 | Postech Foundation | Light--emitting device comprising conductive nanorods as transparent electrodes |
KR100691276B1 (ko) * | 2005-08-25 | 2007-03-12 | 삼성전기주식회사 | 나노와이어 발광 소자 및 제조방법 |
KR100643473B1 (ko) * | 2005-09-06 | 2006-11-10 | 엘지전자 주식회사 | 나노 로드를 갖는 발광 소자 및 그의 제조 방법 |
US7826336B2 (en) * | 2006-02-23 | 2010-11-02 | Qunano Ab | Data storage nanostructures |
KR100741204B1 (ko) * | 2006-03-17 | 2007-07-19 | 엘지전자 주식회사 | 나노로드를 형성하는 방법 |
US7821015B2 (en) | 2006-06-19 | 2010-10-26 | Semisouth Laboratories, Inc. | Silicon carbide and related wide-bandgap transistors on semi insulating epitaxy |
US8193537B2 (en) | 2006-06-19 | 2012-06-05 | Ss Sc Ip, Llc | Optically controlled silicon carbide and related wide-bandgap transistors and thyristors |
EP1873279A1 (en) * | 2006-06-30 | 2008-01-02 | Stormled AB | Nanorod, method for its manufacture, nano contact, nano electric device, and bath for growing a nanorod. |
CN100424892C (zh) * | 2006-08-01 | 2008-10-08 | 武汉大学 | 一种基于硅纳米线的异质pn结二极管及其制备方法 |
KR100810146B1 (ko) * | 2006-09-28 | 2008-03-06 | 전북대학교산학협력단 | 질화물계 반도체 나노와이어들을 포함하는 발광 다이오드및 그 제조 방법 |
WO2008045423A1 (en) * | 2006-10-10 | 2008-04-17 | Structured Materials Inc. | Self assembled controlled luminescent transparent conductive photonic crystals for light emitting devices |
CN100536173C (zh) * | 2006-10-27 | 2009-09-02 | 中国科学院物理研究所 | 一种从深紫外至远红外光的探测器及制备方法 |
CN100539210C (zh) * | 2006-10-27 | 2009-09-09 | 中国科学院物理研究所 | 一种具有全波长的光探测器及其制备方法 |
KR100793336B1 (ko) | 2006-11-17 | 2008-01-11 | 삼성전기주식회사 | 발광 트랜지스터 |
KR100872281B1 (ko) * | 2006-12-15 | 2008-12-05 | 삼성전기주식회사 | 나노와이어 구조체를 이용한 반도체 발광소자 및 그제조방법 |
US8183587B2 (en) * | 2006-12-22 | 2012-05-22 | Qunano Ab | LED with upstanding nanowire structure and method of producing such |
JP5453105B2 (ja) * | 2006-12-22 | 2014-03-26 | クナノ アーベー | ナノ構造のled及びデバイス |
US8049203B2 (en) * | 2006-12-22 | 2011-11-01 | Qunano Ab | Nanoelectronic structure and method of producing such |
KR100785525B1 (ko) * | 2007-01-30 | 2007-12-12 | 고려대학교 산학협력단 | 산화아연 나노와이어의 표면에 황화아연 양자점이 분포되어있는 형태의 발광 나노와이어 이종구조 및 이의 제조방법 |
KR20090058952A (ko) * | 2007-12-05 | 2009-06-10 | 삼성전자주식회사 | 나노로드를 이용한 발광소자 및 그 제조 방법 |
CN101561194B (zh) * | 2008-04-18 | 2010-12-29 | 清华大学 | 太阳能集热器 |
FR2930839A1 (fr) * | 2008-05-05 | 2009-11-06 | Commissariat Energie Atomique | Procede de realisation d'un composant flexible a base de nanofils |
KR101496151B1 (ko) | 2008-06-25 | 2015-02-27 | 삼성전자주식회사 | 산화물 다이오드를 이용한 디스플레이 장치 |
CN101445961B (zh) * | 2008-12-15 | 2011-06-15 | 浙江大学 | 一种Mg掺杂的ZnO超细纳米线及其合成方法 |
KR101549620B1 (ko) | 2009-01-30 | 2015-09-02 | 삼성전자주식회사 | pn 구조를 지닌 Zn 산화물 나노 와이어 및 그 제조 방법 |
GB2469869A (en) * | 2009-05-01 | 2010-11-03 | Univ Bolton | Continuous ZnO films |
FR2949278B1 (fr) * | 2009-08-18 | 2012-11-02 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif d'emission de lumiere a base de diodes electroluminescentes |
CN101665235B (zh) * | 2009-09-08 | 2012-03-21 | 石家庄铁道学院 | n型掺杂氧化锌纳米粉体的制备方法 |
WO2011078467A2 (ko) * | 2009-12-23 | 2011-06-30 | 동국대학교 산학협력단 | 산화아연 나노로드를 이용한 레이저 다이오드 및 그 제조 방법 |
CN101866975B (zh) * | 2010-05-29 | 2012-05-23 | 兰州大学 | 一种半导体传感器及制备方法 |
CN101863452B (zh) * | 2010-06-10 | 2015-06-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种改善绝缘衬底上纳米阵列结构器件制作的方法 |
CN101894884B (zh) * | 2010-06-10 | 2012-04-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种ⅲ族氮化物纳米阵列结构太阳能电池的制作方法 |
KR20110135293A (ko) * | 2010-06-10 | 2011-12-16 | 삼성전자주식회사 | p형 Zn 산화물 나노 와이어의 제조 방법 및 p형 Zn 산화물을 포함하는 전자 소자 |
US8987016B2 (en) | 2010-08-16 | 2015-03-24 | Rensselaer Polytechnic Institute | Efficient and directed nano-light emitting diode, and method for making same |
TWI573288B (zh) * | 2010-10-18 | 2017-03-01 | 鴻海精密工業股份有限公司 | 發光二極體及其製作方法 |
CN102456786B (zh) * | 2010-10-29 | 2016-03-09 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管及其制作方法 |
KR101713280B1 (ko) * | 2011-03-03 | 2017-03-08 | 삼성전자주식회사 | 전기 에너지 발생장치 |
CN102810601A (zh) * | 2012-08-17 | 2012-12-05 | 南京邮电大学 | 探测光子能量低于禁带宽度的近红外光的探测器的制备方法 |
CN103682078B (zh) * | 2012-09-21 | 2016-11-23 | 北京纳米能源与系统研究所 | 压力传感器阵列及其制备方法 |
US9219123B2 (en) * | 2012-11-26 | 2015-12-22 | Sharp Kabushiki Kaisha | Method of producing a nitride semiconductor crystal with precursor containing carbon and oxygen, and nitride semiconductor crystal and semiconductor device made by the method |
JP6055290B2 (ja) * | 2012-11-26 | 2016-12-27 | シャープ株式会社 | 窒化物半導体結晶の製造方法 |
JP6055325B2 (ja) * | 2013-01-30 | 2016-12-27 | シャープ株式会社 | 窒化物半導体結晶の製造方法 |
CN103594631B (zh) * | 2013-06-25 | 2016-04-27 | 北京科技大学 | 一种新型自驱动紫外探测器及其制作方法 |
CN103579415B (zh) * | 2013-10-22 | 2016-08-31 | 华中科技大学 | 一种氧化锌纳米线阵列紫外光电探测器的制备方法 |
CN103746056A (zh) * | 2013-12-28 | 2014-04-23 | 华中科技大学 | 一种基于镓掺杂氧化锌纳米线阵列的波长可调节发光二极管及其制备方法 |
CN104051589B (zh) * | 2014-06-24 | 2017-02-01 | 东南大学 | 一种横向氧化锌纳米棒阵列发光二极管 |
KR101907742B1 (ko) * | 2016-07-13 | 2018-10-12 | 연세대학교 산학협력단 | 발광 다이오드 및 이의 제조 방법 |
RU2641504C1 (ru) * | 2016-10-24 | 2018-01-17 | Закрытое акционерное общество "Межрегиональное производственное объединение технического комплектования "ТЕХНОКОМПЛЕКТ" (ЗАО "МПОТК "ТЕХНОКОМПЛЕКТ") | Способ изготовления фотодетектора с ограниченным диапазоном спектральной чувствительности на основе массива наностержней оксида цинка |
CN106571405B (zh) * | 2016-11-01 | 2018-04-03 | 华南师范大学 | 一种带有GaN纳米线阵列的紫外探测器及其制作方法 |
FR3061607B1 (fr) * | 2016-12-29 | 2019-05-31 | Aledia | Dispositif optoelectronique a diodes electroluminescentes |
CN106848007A (zh) * | 2017-01-12 | 2017-06-13 | 东南大学 | 一种增强氧化锌‑氮化镓异质结构电致发光的方法 |
CN106684201B (zh) * | 2017-01-13 | 2018-01-19 | 合肥工业大学 | 一种氧化锌纳米棒/黑硅异质结纳米光电探测器及其制备方法 |
RU2723912C1 (ru) * | 2017-04-26 | 2020-06-18 | Закрытое акционерное общество "Межрегиональное производственное объединение технического комплектования "ТЕХНОКОМПЛЕКТ" (ЗАО "МПОТК "ТЕХНОКОМПЛЕКТ") | Способ изготовления гетероструктуры на основе массива наностержней оксида цинка с тонкой сплошной оболочкой из сульфида олова |
CN108866628A (zh) * | 2017-05-11 | 2018-11-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | 掺杂Mg的p型Ⅲ族氮化物单晶及其制备方法和应用 |
US11077475B2 (en) | 2017-05-23 | 2021-08-03 | International Business Machines Corporation | Neuro-chemical sensor with inhibition of fouling on nano-electrode |
CN107342351B (zh) * | 2017-06-22 | 2019-04-05 | 北京工业大学 | 一种基于斜向ZnO纳米线/GaN pn结的LED及制备方法 |
CN107331715B (zh) * | 2017-07-03 | 2020-06-30 | 京东方科技集团股份有限公司 | 一种太阳能电池及其制作方法 |
CN107316927B (zh) * | 2017-08-17 | 2023-11-07 | 滨州学院 | 一种核壳结构发白光器件及其制备方法 |
US10583282B2 (en) | 2017-11-13 | 2020-03-10 | International Business Machines Corporation | Neuro-stem cell stimulation and growth enhancement with implantable nanodevice |
CN107827144A (zh) * | 2017-11-14 | 2018-03-23 | 大连智讯科技有限公司 | p型掺杂ZnO纳米棒制作方法 |
CN108037613A (zh) * | 2017-12-18 | 2018-05-15 | 深圳市华星光电技术有限公司 | 柔性液晶显示器及其背光源 |
EP4053880A1 (en) * | 2018-04-22 | 2022-09-07 | Epinovatech AB | Reinforced thin-film device |
KR102182702B1 (ko) * | 2018-10-08 | 2020-11-25 | 동국대학교 산학협력단 | 광전 특성이 향상된 산화카드뮴계 p-n 이종접합 구조체 및 이의 제조방법 |
CN109360862B (zh) * | 2018-10-26 | 2020-09-01 | 中国石油大学(华东) | 基于ZnO纳米棒/Si异质结的自驱动光电探测器及制备方法 |
EP3813240A1 (en) | 2019-10-25 | 2021-04-28 | Epinovatech AB | Ac-dc converter circuit |
EP3836227A1 (en) | 2019-12-11 | 2021-06-16 | Epinovatech AB | Semiconductor layer structure |
EP3866189B1 (en) | 2020-02-14 | 2022-09-28 | Epinovatech AB | A mmic front-end module |
EP3879706A1 (en) | 2020-03-13 | 2021-09-15 | Epinovatech AB | Field-programmable gate array device |
EP4101945B1 (en) | 2021-06-09 | 2024-05-15 | Epinovatech AB | A device for performing electrolysis of water, and a system thereof |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3398638B2 (ja) | 2000-01-28 | 2003-04-21 | 科学技術振興事業団 | 発光ダイオードおよび半導体レーザーとそれらの製造方法 |
US6882051B2 (en) * | 2001-03-30 | 2005-04-19 | The Regents Of The University Of California | Nanowires, nanostructures and devices fabricated therefrom |
KR20010070678A (ko) | 2001-04-14 | 2001-07-27 | 김영창 | 단파장 산화아연 발광소자의 제조방법 |
US7211143B2 (en) * | 2002-12-09 | 2007-05-01 | The Regents Of The University Of California | Sacrificial template method of fabricating a nanotube |
KR20040059300A (ko) * | 2002-12-28 | 2004-07-05 | 학교법인 포항공과대학교 | 자성체/나노소재 이종접합 나노구조체 및 그 제조방법 |
KR100554155B1 (ko) * | 2003-06-09 | 2006-02-22 | 학교법인 포항공과대학교 | 금속/반도체 나노막대 이종구조를 이용한 전극 구조물 및그 제조 방법 |
US20040252737A1 (en) * | 2003-06-16 | 2004-12-16 | Gyu Chul Yi | Zinc oxide based nanorod with quantum well or coaxial quantum structure |
US7265037B2 (en) * | 2003-06-20 | 2007-09-04 | The Regents Of The University Of California | Nanowire array and nanowire solar cells and methods for forming the same |
KR100593264B1 (ko) * | 2003-06-26 | 2006-06-26 | 학교법인 포항공과대학교 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
US7122827B2 (en) * | 2003-10-15 | 2006-10-17 | General Electric Company | Monolithic light emitting devices based on wide bandgap semiconductor nanostructures and methods for making same |
KR100644166B1 (ko) * | 2004-02-12 | 2006-11-10 | 학교법인 포항공과대학교 | 질화물 반도체의 이종접합 구조체, 이를 포함하는나노소자 또는 이의 어레이 |
KR100646696B1 (ko) * | 2004-03-10 | 2006-11-23 | 주식회사 실트론 | 질화물 반도체 소자 및 그 제조방법 |
KR100831650B1 (ko) * | 2004-03-11 | 2008-05-22 | 학교법인 포항공과대학교 | 산화물계 나노 소재를 포함하는 광촉매 |
KR20050104034A (ko) * | 2004-04-27 | 2005-11-02 | 삼성에스디아이 주식회사 | 나노와이어 제조방법 |
US8217381B2 (en) * | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7078683B2 (en) * | 2004-10-22 | 2006-07-18 | Agilent Technologies, Inc. | Nanowire target support and method |
US20060134392A1 (en) * | 2004-12-20 | 2006-06-22 | Palo Alto Research Center Incorporated | Systems and methods for electrical contacts to arrays of vertically aligned nanorods |
US7202173B2 (en) * | 2004-12-20 | 2007-04-10 | Palo Alto Research Corporation Incorporated | Systems and methods for electrical contacts to arrays of vertically aligned nanorods |
US7569905B2 (en) * | 2004-12-20 | 2009-08-04 | Palo Alto Research Center Incorporated | Systems and methods for electrical contacts to arrays of vertically aligned nanorods |
US20060207647A1 (en) * | 2005-03-16 | 2006-09-21 | General Electric Company | High efficiency inorganic nanorod-enhanced photovoltaic devices |
TWI260669B (en) * | 2005-07-26 | 2006-08-21 | Ind Tech Res Inst | Field emission light-emitting device |
WO2007021047A1 (en) * | 2005-08-19 | 2007-02-22 | Postech Foundation | Light--emitting device comprising conductive nanorods as transparent electrodes |
US20070158661A1 (en) * | 2006-01-12 | 2007-07-12 | Rutgers, The State University Of New Jersey | ZnO nanostructure-based light emitting device |
KR100767284B1 (ko) * | 2006-03-27 | 2007-10-17 | 학교법인 포항공과대학교 | 산화아연계 미세 구조물 및 그 제조방법 |
TWI307908B (en) * | 2006-06-13 | 2009-03-21 | Univ Nat Chiao Tung | Gate controlled filed emission triode and process for fabricating the same |
US20080108122A1 (en) * | 2006-09-01 | 2008-05-08 | State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon | Microchemical nanofactories |
US20080110486A1 (en) * | 2006-11-15 | 2008-05-15 | General Electric Company | Amorphous-crystalline tandem nanostructured solar cells |
US20080135089A1 (en) * | 2006-11-15 | 2008-06-12 | General Electric Company | Graded hybrid amorphous silicon nanowire solar cells |
-
2003
- 2003-06-26 KR KR1020030041813A patent/KR100593264B1/ko active IP Right Grant
-
2004
- 2004-06-25 CN CNB2004800177881A patent/CN100499186C/zh not_active Expired - Lifetime
- 2004-06-25 WO PCT/KR2004/001546 patent/WO2004114422A1/en active Application Filing
- 2004-06-25 US US10/562,006 patent/US7541623B2/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101195079B1 (ko) | 2009-09-21 | 2012-11-05 | 위승용 | 피타입과 엔타입화 아연산화물을 함유하는 박막조성물의 코팅방법 |
WO2011078555A2 (ko) * | 2009-12-22 | 2011-06-30 | 동국대학교 산학협력단 | 접촉 구조의 나노로드 반도체 소자 및 그 제조 방법 |
WO2011078555A3 (ko) * | 2009-12-22 | 2011-11-24 | 동국대학교 산학협력단 | 접촉 구조의 나노로드 반도체 소자 및 그 제조 방법 |
KR101755655B1 (ko) * | 2016-05-04 | 2017-07-19 | 세종대학교산학협력단 | 발광 소자 및 그의 제조 방법 |
KR20200037014A (ko) | 2018-09-28 | 2020-04-08 | 동국대학교 산학협력단 | 표면 모폴리지 제어 및 광전 특성이 향상된 산화아연계 p-n 이종접합 구조체 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
US7541623B2 (en) | 2009-06-02 |
KR20050001582A (ko) | 2005-01-07 |
CN1813357A (zh) | 2006-08-02 |
WO2004114422A1 (en) | 2004-12-29 |
US20060189018A1 (en) | 2006-08-24 |
CN100499186C (zh) | 2009-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100593264B1 (ko) | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 | |
JP4841628B2 (ja) | ナノ構造体及びそれを採用した発光ダイオードとその製造方法 | |
KR100644166B1 (ko) | 질화물 반도체의 이종접합 구조체, 이를 포함하는나노소자 또는 이의 어레이 | |
TWI413279B (zh) | Iii族氮化物半導體發光元件及其製造方法、以及燈 | |
CN101346827B (zh) | Ⅲ族氮化物白光发光二极管 | |
JP4160000B2 (ja) | 発光ダイオードおよびその製造方法 | |
US7858419B2 (en) | Gallium nitride-based compound semiconductor multilayer structure and production method thereof | |
US7646027B2 (en) | Group III nitride semiconductor stacked structure | |
JP2008544567A (ja) | 窒化物多重量子ウェルを有するナノロッドアレイ構造の発光ダイオード、その製造方法、及びナノロッド | |
CN102280547A (zh) | 一种有源区为p型的氮化镓系半导体发光管 | |
KR100682873B1 (ko) | 반도체 발광 소자 및 그 제조 방법 | |
JP2008108924A (ja) | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体発光素子の製造方法 | |
US20110073839A1 (en) | Ii-vi semiconductor nanowires | |
US20110076841A1 (en) | Forming catalyzed ii-vi semiconductor nanowires | |
KR100900471B1 (ko) | 질화 갈륨계 화합물 반도체 다층 구조 및 그 제조방법 | |
JP2809045B2 (ja) | 窒化物半導体発光素子 | |
KR101203140B1 (ko) | 산화아연계 발광 소자의 제조 방법 및 그에 의해 제조된산화아연계 발광 소자 | |
KR100693129B1 (ko) | pn 접합 GaN 나노막대 LED 제조방법 | |
JP2560964B2 (ja) | 窒化ガリウム系化合物半導体発光素子 | |
KR100608928B1 (ko) | Ⅲ-ⅴ 질화물계 반도체 발광소자 및 그 제조방법 | |
KR100540511B1 (ko) | 다중벽 구조의 산화아연계 나노선 및 이의 제조방법 | |
JP6066530B2 (ja) | 窒化物半導体結晶の作製方法 | |
KR100734809B1 (ko) | 황화아연계 발광 소자의 제조 방법 및 그에 의해 제조된황화아연계 발광 소자 | |
JP2560963C (ko) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20030626 |
|
PA0201 | Request for examination | ||
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20050927 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20060327 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20060619 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20060620 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20090622 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20100430 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20110329 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment | ||
PR1001 | Payment of annual fee |
Payment date: 20120330 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment | ||
PR1001 | Payment of annual fee |
Payment date: 20130329 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20140328 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150528 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20150528 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160530 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20160530 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20170515 Start annual number: 12 End annual number: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180515 Year of fee payment: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20180515 Start annual number: 13 End annual number: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190515 Year of fee payment: 14 |
|
PR1001 | Payment of annual fee |
Payment date: 20190515 Start annual number: 14 End annual number: 14 |
|
PR1001 | Payment of annual fee |
Payment date: 20200513 Start annual number: 15 End annual number: 15 |
|
PR1001 | Payment of annual fee |
Payment date: 20210511 Start annual number: 16 End annual number: 16 |
|
PR1001 | Payment of annual fee |
Payment date: 20220516 Start annual number: 17 End annual number: 17 |
|
PR1001 | Payment of annual fee |
Payment date: 20230515 Start annual number: 18 End annual number: 18 |
|
PC1801 | Expiration of term |
Termination date: 20231226 Termination category: Expiration of duration |