KR100544144B1 - 박막 트랜지스터 및 이를 구비한 평판표시장치 - Google Patents
박막 트랜지스터 및 이를 구비한 평판표시장치 Download PDFInfo
- Publication number
- KR100544144B1 KR100544144B1 KR1020040036635A KR20040036635A KR100544144B1 KR 100544144 B1 KR100544144 B1 KR 100544144B1 KR 1020040036635 A KR1020040036635 A KR 1020040036635A KR 20040036635 A KR20040036635 A KR 20040036635A KR 100544144 B1 KR100544144 B1 KR 100544144B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor layer
- derivatives
- source
- groove
- thin film
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 66
- 239000010409 thin film Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 36
- 239000011368 organic material Substances 0.000 claims description 9
- -1 polyparaphenylenevinylene Polymers 0.000 claims description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- 229920000123 polythiophene Polymers 0.000 claims description 5
- 229920002098 polyfluorene Polymers 0.000 claims description 4
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 3
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 claims description 3
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims description 3
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 claims description 3
- WSRHMJYUEZHUCM-UHFFFAOYSA-N perylene-1,2,3,4-tetracarboxylic acid Chemical compound C=12C3=CC=CC2=CC=CC=1C1=C(C(O)=O)C(C(O)=O)=C(C(O)=O)C2=C1C3=CC=C2C(=O)O WSRHMJYUEZHUCM-UHFFFAOYSA-N 0.000 claims description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000059 patterning Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 61
- 239000010408 film Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 5
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- YOZHUJDVYMRYDM-UHFFFAOYSA-N 4-(4-anilinophenyl)-3-naphthalen-1-yl-n-phenylaniline Chemical compound C=1C=C(C=2C(=CC(NC=3C=CC=CC=3)=CC=2)C=2C3=CC=CC=C3C=CC=2)C=CC=1NC1=CC=CC=C1 YOZHUJDVYMRYDM-UHFFFAOYSA-N 0.000 description 1
- NAZODJSYHDYJGP-UHFFFAOYSA-N 7,18-bis[2,6-di(propan-2-yl)phenyl]-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17,19-tetrone Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C(=O)C=1C2=C3C4=CC=1)C(=O)C2=CC=C3C(C=C1)=C2C4=CC=C3C(=O)N(C=4C(=CC=CC=4C(C)C)C(C)C)C(=O)C1=C23 NAZODJSYHDYJGP-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78681—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (11)
- 기판;상기 기판 상에 소정 패턴으로 형성된 게이트 전극;상기 기판을 덮도록 형성되고, 소스 및 드레인 영역과, 상기 소스 및 드레인 영역을 연결하는 채널 영역을 갖는 것으로, 적어도 상기 채널 영역을 인접한 박막 트랜지스터와 구별시키는 그루브를 갖는 반도체층;상기 반도체층의 소스 및 드레인 영역에 각각 접하는 소스 및 드레인 전극; 및상기 반도체층, 소스 전극, 및 드레인 전극과 상기 게이트 전극의 사이에 개재되고, 상기 기판을 덮도록 형성된 절연층;을 포함하는 것을 특징으로 하는 박막 트랜지스터.
- 제1항에 있어서,상기 그루브는 폐곡선상인 것을 특징으로 하는 박막 트랜시스터.
- 제2항에 있어서,상기 폐곡선상의 그루브 내에 상기 채널영역이 위치한 것을 특징으로 하는 박막 트랜시스터.
- 제1항에 있어서,상기 그루브는 적어도 한 쌍의 평행선상인 것을 특징으로 하는 박막 트랜시 스터.
- 제4항에 있어서,상기 그루브의 평행선 사이에 상기 채널영역이 위치한 것을 특징으로 하는 박막 트랜시스터.
- 제1항에 있어서,상기 그루브는 적어도 상기 소스 영역, 채널 영역, 및 드레인 영역을 연결하는 선에 대략 평행한 것을 특징으로 하는 박막 트랜시스터.
- 제1항에 있어서,상기 그루브는, 그 깊이가 상기 반도체층의 두께 이하인 채널 형상인 것을 특징으로 하는 박막 트랜시스터.
- 제1항에 있어서,상기 그루브의 깊이는 상기 반도체층의 두께 이상이고, 상기 반도체층의 하부에 위치한 적어도 하나의 층의 두께 이하인 것을 특징으로 하는 박막 트랜시스터.
- 제1항에 있어서,반도체층은 반도체성 유기물질로 구비된 것을 특징으로 하는 박막 트랜지스터.
- 제9항에 있어서,상기 반도체성 유기물질은 폴리티오펜 및 그 유도체, 폴리파라페닐렌비닐렌 및 그 유도체, 폴리파라페닐렌 및 그 유도체, 폴리플로렌 및 그 유도체, 폴리티오펜비닐렌 및 그 유도체, 폴리티오펜-헤테로고리방향족 공중합체 및 그 유도체로 이루어진 군, 및 펜타센, 테트라센, 나프탈렌의 올리고아센 및 이들의 유도체, 알파-6-티오펜, 알파-5-티오펜의 올리고티오펜 및 이들의 유도체, 금속을 함유하거나 함유하지 않은 프탈로시아닌 및 이들의 유도체, 파이로멜리틱 디안하이드라이드 또는 파이로멜리틱 디이미드 및 이들의 유도체, 퍼릴렌테트라카르복시산 디안하이드라이드 또는 퍼릴렌테트라카르복실릭 디이미드 및 이들의 유도체로 이루어진 군으로부터 선택된 적어도 어느 하나로 구비된 것을 특징으로 하는 박막 트랜지스터.
- 제1항 내지 제10항 중 어느 한 항의 박막 트랜지스터를 구비한 것을 특징으로 하는 평판 표시장치.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040036635A KR100544144B1 (ko) | 2004-05-22 | 2004-05-22 | 박막 트랜지스터 및 이를 구비한 평판표시장치 |
JP2005042920A JP2005340771A (ja) | 2004-05-22 | 2005-02-18 | 薄膜トランジスタ、該薄膜トランジスタの製造方法、該薄膜トランジスタを具備した平板表示装置、及び該平板表示装置の製造方法 |
US11/131,233 US7442960B2 (en) | 2004-05-22 | 2005-05-18 | TFT, method of manufacturing the TFT, flat panel display having the TFT, and method of manufacturing the flat panel display |
EP05104136A EP1598860A3 (en) | 2004-05-22 | 2005-05-18 | TFT, method of manufacturing the TFT, flat panel display having the TFT, and method of manufacturing the flat panel display |
CNB2005100922861A CN100565925C (zh) | 2004-05-22 | 2005-05-20 | Tft及其制造方法,包括该tft的平板显示器及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040036635A KR100544144B1 (ko) | 2004-05-22 | 2004-05-22 | 박막 트랜지스터 및 이를 구비한 평판표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050111487A KR20050111487A (ko) | 2005-11-25 |
KR100544144B1 true KR100544144B1 (ko) | 2006-01-23 |
Family
ID=36773437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040036635A KR100544144B1 (ko) | 2004-05-22 | 2004-05-22 | 박막 트랜지스터 및 이를 구비한 평판표시장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7442960B2 (ko) |
EP (1) | EP1598860A3 (ko) |
JP (1) | JP2005340771A (ko) |
KR (1) | KR100544144B1 (ko) |
CN (1) | CN100565925C (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834348B2 (en) | 2008-03-04 | 2010-11-16 | Samsung Electronics Co., Ltd. | Display device and manufacturing method thereof |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0427563D0 (en) * | 2004-12-16 | 2005-01-19 | Plastic Logic Ltd | A method of semiconductor patterning |
KR100647690B1 (ko) * | 2005-04-22 | 2006-11-23 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 구비한 평판 디스플레이 장치 |
KR100647693B1 (ko) * | 2005-05-24 | 2006-11-23 | 삼성에스디아이 주식회사 | 유기박막 트랜지스터 및 그의 제조방법과 유기 박막트랜지스터를 구비한 유기전계 발광표시장치 |
KR100752374B1 (ko) | 2005-11-11 | 2007-08-27 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조방법 |
KR100829743B1 (ko) | 2005-12-09 | 2008-05-15 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터 및 이의 제조 방법, 이를 구비한평판 디스플레이 장치 |
KR100751360B1 (ko) * | 2006-01-02 | 2007-08-22 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터의 제조 방법, 이로부터 제조된 유기박막 트랜지스터 및 이를 포함하는 평판 표시 장치 |
JP5477547B2 (ja) * | 2009-06-22 | 2014-04-23 | ソニー株式会社 | 薄膜トランジスタの製造方法 |
KR101274719B1 (ko) * | 2010-06-11 | 2013-06-25 | 엘지디스플레이 주식회사 | 박막트랜지스터 기판 및 그 제조 방법과 그를 가지는 평판 표시 소자 |
US8797487B2 (en) * | 2010-09-10 | 2014-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, liquid crystal display device, and manufacturing method thereof |
WO2012035975A1 (en) * | 2010-09-15 | 2012-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and manufacturing method thereof |
JP6076038B2 (ja) | 2011-11-11 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP6059968B2 (ja) * | 2011-11-25 | 2017-01-11 | 株式会社半導体エネルギー研究所 | 半導体装置、及び液晶表示装置 |
JP6033071B2 (ja) | 2011-12-23 | 2016-11-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
CN102790056B (zh) | 2012-08-13 | 2014-12-10 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、goa单元制作方法及显示装置 |
KR101949861B1 (ko) * | 2012-10-10 | 2019-02-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
JP6209920B2 (ja) * | 2013-09-26 | 2017-10-11 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよび画像表示装置 |
WO2016042962A1 (ja) * | 2014-09-18 | 2016-03-24 | 富士フイルム株式会社 | 半導体装置の製造方法および半導体装置 |
CN104538413B (zh) * | 2015-02-03 | 2018-03-23 | 重庆京东方光电科技有限公司 | 阵列基板及其制作方法、显示装置 |
JP2016146422A (ja) * | 2015-02-09 | 2016-08-12 | 株式会社ジャパンディスプレイ | 表示装置 |
GB2556313B (en) * | 2016-02-10 | 2020-12-23 | Flexenable Ltd | Semiconductor patterning |
JP7092041B2 (ja) * | 2017-02-15 | 2022-06-28 | 凸版印刷株式会社 | 薄膜トランジスタアレイおよびその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63119579A (ja) * | 1986-11-07 | 1988-05-24 | Ricoh Co Ltd | 薄膜トランジスター |
JP3246189B2 (ja) * | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | 半導体表示装置 |
JPH0832072A (ja) * | 1994-07-13 | 1996-02-02 | Fuji Xerox Co Ltd | 半導体装置 |
US6133610A (en) * | 1998-01-20 | 2000-10-17 | International Business Machines Corporation | Silicon-on-insulator chip having an isolation barrier for reliability and process of manufacture |
GB2362262A (en) * | 2000-05-11 | 2001-11-14 | Ibm | Thin film transistor (TFT) with conductive channel which may be p-type or n-type in response to a gate voltage |
JP3415602B2 (ja) * | 2000-06-26 | 2003-06-09 | 鹿児島日本電気株式会社 | パターン形成方法 |
US6639281B2 (en) * | 2001-04-10 | 2003-10-28 | Sarnoff Corporation | Method and apparatus for providing a high-performance active matrix pixel using organic thin-film transistors |
JP4653374B2 (ja) | 2001-08-23 | 2011-03-16 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
US6885146B2 (en) * | 2002-03-14 | 2005-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates |
US6838321B2 (en) * | 2002-09-26 | 2005-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor substrate with defects reduced or removed and method of manufacturing the same, and semiconductor device capable of bidirectionally retaining breakdown voltage and method of manufacturing the same |
JP2004140012A (ja) * | 2002-10-15 | 2004-05-13 | Seiko Epson Corp | 半導体装置及びその製造方法 |
JP2004152958A (ja) * | 2002-10-30 | 2004-05-27 | Pioneer Electronic Corp | 有機半導体装置 |
US7123332B2 (en) * | 2003-05-12 | 2006-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device, electronic device having the same, and semiconductor device |
TWI222546B (en) * | 2003-05-28 | 2004-10-21 | Au Optronics Corp | TFT LCD and manufacturing method thereof |
US20050082492A1 (en) * | 2003-10-17 | 2005-04-21 | Wei-Chuan Lin | Image detector with tandem-gate TFT |
KR100585410B1 (ko) * | 2003-11-11 | 2006-06-07 | 엘지.필립스 엘시디 주식회사 | 구동회로 일체형 액정표시장치의 스위칭 소자 및 구동소자및 그 제조방법 |
US7223641B2 (en) * | 2004-03-26 | 2007-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for manufacturing the same, liquid crystal television and EL television |
-
2004
- 2004-05-22 KR KR1020040036635A patent/KR100544144B1/ko active IP Right Grant
-
2005
- 2005-02-18 JP JP2005042920A patent/JP2005340771A/ja active Pending
- 2005-05-18 US US11/131,233 patent/US7442960B2/en active Active
- 2005-05-18 EP EP05104136A patent/EP1598860A3/en not_active Ceased
- 2005-05-20 CN CNB2005100922861A patent/CN100565925C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834348B2 (en) | 2008-03-04 | 2010-11-16 | Samsung Electronics Co., Ltd. | Display device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
US7442960B2 (en) | 2008-10-28 |
EP1598860A2 (en) | 2005-11-23 |
JP2005340771A (ja) | 2005-12-08 |
KR20050111487A (ko) | 2005-11-25 |
CN1783515A (zh) | 2006-06-07 |
EP1598860A3 (en) | 2007-01-10 |
CN100565925C (zh) | 2009-12-02 |
US20050258487A1 (en) | 2005-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100544144B1 (ko) | 박막 트랜지스터 및 이를 구비한 평판표시장치 | |
KR100615212B1 (ko) | 평판 표시 장치 | |
US8324612B2 (en) | Thin film transistor, method of fabricating the same, and flat panel display having the same | |
KR100659054B1 (ko) | 유기 박막 트랜지스터를 구비한 능동 구동형 유기전계발광 디스플레이 장치 및 그 제조방법 | |
KR100647683B1 (ko) | 유기 박막 트랜지스터 및 이를 구비한 평판 디스플레이 장치 | |
EP1715531A1 (en) | Thin film transistor (TFT) and flat panel display including the TFT | |
KR20050098596A (ko) | 유기 전계 발광 표시장치 및 그 제조 방법 | |
US8710502B2 (en) | Thin film transistor and flat panel display device including the same | |
JP4602920B2 (ja) | 有機薄膜トランジスタ、それを備えた平板ディスプレイ装置、及び有機薄膜トランジスタの製造方法 | |
KR100592302B1 (ko) | 박막 트랜지스터를 구비한 기판의 제조방법, 이에 따라제조된 박막 트랜지스터를 구비한 기판, 평판 표시장치의제조방법, 및 이에 따라 제조된 평판 표시장치 | |
KR100563060B1 (ko) | 박막 트랜지스터를 구비한 평판표시장치 | |
KR100683665B1 (ko) | 유기 전계 발광 표시장치 | |
KR100719546B1 (ko) | 유기 박막 트랜지스터, 이를 구비한 평판 디스플레이 장치및 유기 박막 트랜지스터의 제조방법 | |
KR20050077832A (ko) | 박막 트랜지스터 및 이를 구비한 평판표시장치 | |
KR100647686B1 (ko) | 유기 박막 트랜지스터 및 이를 구비한 평판 디스플레이장치 | |
KR100696489B1 (ko) | 박막 트랜지스터, 이를 제조하는 방법 및 이를 구비하는평판 디스플레이 장치 | |
KR100669702B1 (ko) | 박막 트랜지스터 및 이를 구비한 평판표시장치 | |
KR100603329B1 (ko) | 박막 트랜지스터 및 이를 구비한 평판표시장치 | |
KR100813852B1 (ko) | 유기 전계 발광 표시장치 및 이를 제조하는 방법 | |
KR100592270B1 (ko) | 박막 트랜지스터 및 이를 구비한 평판표시장치 | |
KR20060039683A (ko) | 박막 트랜지스터를 구비한 기판의 제조방법, 이에 따라제조된 박막 트랜지스터를 구비한 기판, 평판 표시장치의제조방법, 및 이에 따라 제조된 평판 표시장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130102 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140102 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20141231 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20151230 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170102 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180102 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190102 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20191223 Year of fee payment: 15 |