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JPWO2020255663A1 - - Google Patents

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Publication number
JPWO2020255663A1
JPWO2020255663A1 JP2021527519A JP2021527519A JPWO2020255663A1 JP WO2020255663 A1 JPWO2020255663 A1 JP WO2020255663A1 JP 2021527519 A JP2021527519 A JP 2021527519A JP 2021527519 A JP2021527519 A JP 2021527519A JP WO2020255663 A1 JPWO2020255663 A1 JP WO2020255663A1
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JP
Japan
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Granted
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JP2021527519A
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JP7451521B2 (ja
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2021527519A 2019-06-20 2020-05-28 半導体装置及び半導体装置の製造方法 Active JP7451521B2 (ja)

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JPWO2023100681A1 (ja) * 2021-12-01 2023-06-08
EP4278380A1 (en) * 2022-04-08 2023-11-22 Hitachi Energy Switzerland AG Arrangement for a power module, power module and method for producing an arrangement for a power module
WO2024057847A1 (ja) * 2022-09-15 2024-03-21 ローム株式会社 半導体装置

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WO2007125939A1 (ja) * 2006-04-27 2007-11-08 Neomax Materials Co., Ltd. 配線接続用クラッド材及びそのクラッド材から加工された配線接続部材
JP2008212977A (ja) * 2007-03-05 2008-09-18 Fuji Electric Device Technology Co Ltd レーザ溶接部材およびそれを用いた半導体装置
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WO2020255663A1 (ja) 2020-12-24
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