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JPS6296883U - - Google Patents

Info

Publication number
JPS6296883U
JPS6296883U JP18720285U JP18720285U JPS6296883U JP S6296883 U JPS6296883 U JP S6296883U JP 18720285 U JP18720285 U JP 18720285U JP 18720285 U JP18720285 U JP 18720285U JP S6296883 U JPS6296883 U JP S6296883U
Authority
JP
Japan
Prior art keywords
conductive
holes
wiring board
cylindrical shape
dielectric material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18720285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18720285U priority Critical patent/JPS6296883U/ja
Publication of JPS6296883U publication Critical patent/JPS6296883U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の実施例を示す断面図、第2
図は第1図を上面から見た平面図、第3図は本考
案の第2の実施例を示す断面図、第4図は第3図
を上面から見た平面図である。 1…基板、2…接地導体、3…誘電体、4…接
続導体、5…誘電体基板、8…接地導体のスルー
ホール、9…接続導体のスルーホール。
Fig. 1 is a sectional view showing an embodiment of the present invention;
The drawings are a plan view of FIG. 1 viewed from above, FIG. 3 is a sectional view showing a second embodiment of the present invention, and FIG. 4 is a plan view of FIG. 3 viewed from above. DESCRIPTION OF SYMBOLS 1... Board, 2... Ground conductor, 3... Dielectric, 4... Connection conductor, 5... Dielectric substrate, 8... Through hole of ground conductor, 9... Through hole of connection conductor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性スルーホールを有する多層配線基板にお
いて、その導電性スルーホールの周囲に円筒状に
誘電体が配置され、さらにその外周に円筒状に形
成された接地電位のスルーホール導体が設けられ
ていることを特徴とする多層配線基板。
In a multilayer wiring board having conductive through holes, a dielectric material is arranged in a cylindrical shape around the conductive through holes, and a through hole conductor formed in a cylindrical shape and having a ground potential is further provided on the outer periphery of the dielectric material. A multilayer wiring board featuring:
JP18720285U 1985-12-06 1985-12-06 Pending JPS6296883U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18720285U JPS6296883U (en) 1985-12-06 1985-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18720285U JPS6296883U (en) 1985-12-06 1985-12-06

Publications (1)

Publication Number Publication Date
JPS6296883U true JPS6296883U (en) 1987-06-20

Family

ID=31137462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18720285U Pending JPS6296883U (en) 1985-12-06 1985-12-06

Country Status (1)

Country Link
JP (1) JPS6296883U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239995A (en) * 1988-03-22 1989-09-25 Fujitsu Ltd Base body for electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01239995A (en) * 1988-03-22 1989-09-25 Fujitsu Ltd Base body for electronic component

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