JPS61104579U - - Google Patents
Info
- Publication number
- JPS61104579U JPS61104579U JP18941084U JP18941084U JPS61104579U JP S61104579 U JPS61104579 U JP S61104579U JP 18941084 U JP18941084 U JP 18941084U JP 18941084 U JP18941084 U JP 18941084U JP S61104579 U JPS61104579 U JP S61104579U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- integrated circuit
- hybrid integrated
- cross
- funnel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図および第２図はそれぞれこの考案による
混成集積回路用基板の実施例を示す断面図、第３
図は従来の混成集積回路用基板の例を示す断面図
である。
図において、１は基板、２は貫通孔、４，５は
それぞれ導体、６はサラトリした面である。なお
各図中同一符号は同一または相当部分を示す。
1 and 2 are cross-sectional views showing an embodiment of the hybrid integrated circuit board according to this invention, and FIG.
The figure is a sectional view showing an example of a conventional hybrid integrated circuit board. In the figure, 1 is a substrate, 2 is a through hole, 4 and 5 are conductors, and 6 is a flattened surface. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
の一方の面から他方の面へ貫通する孔の断面が基
板の一方の面および他方の面、あるいはいずれか
一方の面に大きく開口した漏斗形を成し、その孔
の内面に設けた導体により基板の一方の面および
他方の面に設けた導体間を接続することを特徴と
する混成集積回路用基板。 A hole penetrating from one surface to the other of a substrate forming the substrate of a hybrid integrated circuit has a cross section in the form of a funnel with a large opening on one surface and the other surface of the substrate, or on either surface. 1. A board for a hybrid integrated circuit, characterized in that a conductor provided on the inner surface of the hole connects conductors provided on one surface and the other surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18941084U JPS61104579U (en) | 1984-12-13 | 1984-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18941084U JPS61104579U (en) | 1984-12-13 | 1984-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61104579U true JPS61104579U (en) | 1986-07-03 |
Family
ID=30746861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18941084U Pending JPS61104579U (en) | 1984-12-13 | 1984-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61104579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63197377U (en) * | 1987-06-09 | 1988-12-19 |
-
1984
- 1984-12-13 JP JP18941084U patent/JPS61104579U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63197377U (en) * | 1987-06-09 | 1988-12-19 |