JPS603587Y2 - light emitting diode board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a light emitting diode substrate, and particularly to a light emitting diode substrate capable of displaying high brightness.

Conventionally, displays using light emitting diodes 17 as shown in FIG. 1 have insufficient brightness, which has prevented the spread of displays such as fluorescent display tubes.
There are two reasons, one of which is that the luminous efficiency of the element itself is not sufficient.

The second problem is that the light from the light emitting diode 17 is absorbed by the display component parts or leaks between parts, producing light that does not contribute to the display. In particular, a large amount of light is absorbed by the substrate 11.

This is an electrode pattern 16 on a substrate 11 such as paper epoxy.
16 is set to the minimum area necessary for mounting the light emitting diode 17 as shown in FIG. 2a, and as shown in the same figure,
When an electrode pattern with an area larger than the bottom opening 20 of the reflective frame 19 is used, the brightness of the display surface is between 50 and 10.
It can be easily devised since the difference is as much as 0%.

The third reason is that when heat dissipation is insufficient, the light emitting efficiency of the element decreases, the life span becomes short, and the wavelength of light shifts to the longer wavelength side.

This can be solved to some extent by enlarging the electrode pattern 16.16, but in the case of a small display or a display with many picture elements (segments, etc.), the electrode pattern cannot be made large, and when pulse driving In order to keep the effective value of power constant, a pulse with a high current value is applied, but even in such a case, sufficient heat is not dissipated.

The present invention improves the latter two of the above three drawbacks, reduces the light absorption rate of the substrate, and improves heat dissipation.

The main proposal will be explained in detail below. FIG. 3 is a sectional view of a main part of this embodiment, and 1 is a light emitting diode substrate according to the present invention, which has the following structure.

The base 2 is made of aluminum with a thickness of 1.0 to 2.0 mm (
Using A resin, the surface is oxidized to a thickness of 10 to 30p.
ya alumite layers 3 and 4 are provided.

A light reflective insulating layer 5 is provided on the surface of this alumite layer 4.

The insulating layer 5 is formed by printing a mixture of epoxy resin, polycarbonate, etc. with an insulating light reflecting agent such as titanium oxide, zinc white, white pigment, or paint to a thickness of 25 to 150 μm.

This insulating layer 5 needs to have good adhesion to the alumite layer 4 in order to prevent peeling between the alumite layer 4 and the printed wiring, but this layer alone needs to have high light reflectivity. Rather, it is sufficient to have high light reflectivity when light is applied to the aluminum substrate from the surface of the insulating layer.

Then, on this insulating layer 5, a printed wiring layer 6 having a predetermined pattern is provided using copper foil.

7 is a light emitting diode such as GaP mounted on the printed wiring layer 6 of the light emitting diode substrate 1;
8 is a thin wire for wiring, and 9 is a reflective frame made of resin molding or the like.

In this case, the light emitting diode substrate 1 has the above-described structure, so that the heat generated by lighting the light emitting diode 7 is transferred to the aluminum substrate 2 and the alumite layer 3 through the printed wiring layer 6 and the insulating layer 5. **4, and is radiated by contacting the outside air over a wide area.

Furthermore, since the aluminum base 2 is covered with an alumite layer 3.4, it will not be affected by various external stimuli or be attacked by the insulating layer 5.

Further, the light emitted from the light emitting diode 7 is effectively guided to the display surface by the printed wiring layer 6, the insulating layer 5 and the reflective frame 9.

Table 1 shows examples of the brightness of the display devices of the conventional and embodiments of the present invention.

Table 1 Display device using GaP green light emitting diode As mentioned above, in this case, an alumite layer is provided on the surface of an aluminum base, an insulating layer mixed with an insulating light reflector is provided on top of the alumite layer, and then Since the light emitting diode is fixed on the printed wiring layer of the aluminum substrate (the light emitting diode board in the above embodiment) obtained by providing a printed wiring layer on the aluminum substrate, it has excellent heat dissipation and light reflection properties. Since it is excellent in brightness and enables high-brightness display, it is extremely effective especially when using green light-emitting diodes, where insufficient brightness is a problem, or when using pulse drive.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a light emitting diode display, FIG. 2 is an electrode pattern diagram, and FIG. 3 is a sectional view of a main part of an embodiment of the present invention. 1... Light emitting diode substrate (aluminum substrate), 2... Base, 3, 4... Aramite layer, 5... Insulating layer, 6, 6 ...Printed wiring layer, 7...Light emitting diode.

Claims (1)

[Scope of utility model registration request] An alumite layer is provided on the surface of the aluminum base, on which an insulating layer containing a light reflecting agent and having excellent light reflecting properties from the side on which the light emitting diode is mounted is provided on almost the entire surface, and a conductive thin layer is further provided on top of that. A light emitting diode substrate characterized in that a light emitting diode is mounted on a thin conductive layer of an aluminum substrate obtained by this method.