KR101940987B1 - Printed circuit board with heatsink for led lighting apparatus - Google Patents

Abstract

The present invention relates to a printed circuit board for an LED lighting apparatus to which a heat sink is applied capable of improving light efficiency, light speed maintenance rate, and LED life expectancy. The printed circuit board comprises: a plurality of LED package units (110); a circuit unit (120); a plurality of heat dissipation pad units (130); and a heat sink unit (140).

Description

FIELD OF THE INVENTION [0001] The present invention relates to a printed circuit board for a LED lighting device having a heat sink,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board for an LED lighting apparatus to which a heat sink is applied, more specifically, by applying a heat sink to a circuit pattern of a printed circuit board for an LED lighting apparatus, To a printed circuit board for an LED lighting device to which a heat sink capable of lowering the internal temperature of the LED lighting device to a guaranteed temperature or less and improving the light efficiency, the lumen maintenance rate and the LED lifetime can be obtained.

The lighting device appropriately supplies light to the space as a visual environment, and can be divided into artificial lighting and daylighting. Here, only artificial illumination is referred to as a lighting apparatus.

Such a lighting device is mainly used as a light source for emitting light, a printed circuit board for an LED lighting device having an LED which is environment-friendly and has excellent lifetime and durability while generating high luminance with low power consumption.

LEDs are optical semiconductors and are devices called light emitting diodes.

In addition, LEDs emit light energy as a result of electron hole coupling and are also emitted as heat energy. For example, when 100% of the electric energy input to the LED is converted, 25% to 35% of the LED is converted to light energy, and 65% to 75% is converted to heat energy.

If the heat-generating LED is installed inside the lighting device, the internal temperature of the lighting device is increased due to the heat energy of the LED.

If the internal temperature of the lighting apparatus is increased, the PCB may be deformed or damaged due to a high internal temperature, thereby significantly degrading the LED lighting performance.

In addition, the efficiency of the LED is lowered due to the heat generated from the LED, and the amount of heat generated when the LED is used for a long period of time causes shortening of the lifetime of the LED.

In order to prevent an increase in the internal temperature of the LED lighting device, heat generated from the LED must be emitted to the outside.

In this case, the LED has the highest heat transfer rate due to heat conduction among the heat transfer methods, and also has some convection and radiation heat transfer rates.

The heat conduction refers to a phenomenon in which heat energy is transferred from a high temperature portion to a low temperature portion without involving the movement of a substance. In the case of the solid, the heat conduction is transmitted by the vibration of the molecule and the energy transfer of the free electrons. In the case of gas or liquid, the heat is transferred by collision and diffusion of molecules.

Conventionally, a heat sink is formed adjacent to a surface on which a circuit pattern of a printed circuit board for an LED lighting device is not formed, in order to emit the heat of the LED.

In addition, as disclosed in Japanese Patent Application No. 10-1281340 (registered on June, 2013, June 26, 2013), in a printed circuit board for a LED lighting device having a substrate body made of a metal material, LEDs are mounted on the front surface, And a plurality of heat dissipating fin portions bent outwardly of the circuit body and protruding toward the rear of the circuit portion, wherein the plurality of heat dissipating fin portions are bonded to the mutually opposing heat dissipating fin portions to form a ring shape, A printed circuit board for an LED lighting device can be used.

However, since the heat dissipation fin portion is formed so as to protrude from the rear surface of the printed circuit board for the LED lighting apparatus, the volume of the printed circuit board for the LED lighting apparatus is increased and the volume and size of the lighting apparatus are increased .

In addition, since the heat generated from the LED is transferred to the circuit portion of the printed circuit board for the LED lighting apparatus adjacent to the LED and then dissipated to the radiating fin portion, the circuit portion of the printed circuit board for the LED lighting apparatus may be damaged, There is a problem.

Accordingly, there is a demand for a heat dissipating technology for preventing the light efficiency from deteriorating while efficiently dissipating heat generated from the LED.

The present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a heat sink for mounting the LED package on a surface of a printed circuit board for mounting the LED package, The present invention also provides a printed circuit board for an LED lighting apparatus to which a heat sink capable of improving heat dissipation can be improved.

In addition, when a heat sink is applied to a circuit pattern of a printed circuit board for an LED lighting apparatus, a heat sink capable of preventing the circuit pattern of the printed circuit board for the LED lighting apparatus from being damaged by using a heat- An object of the present invention is to provide a printed circuit board for a lighting apparatus.

Another object of the present invention is to provide a printed circuit board for an LED lighting apparatus to which a heat sink to which a light-reflecting paint can be applied is applied to a heat sink mounted on a printed circuit board for an LED lighting apparatus.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

A first metal lead 112 and a second metal lead 113 coupled to the aluminum plate 111 having a predetermined size, the first metal lead 112 and the second metal lead 113 being connected to each other, A plurality of LED package units 110 including an LED chip 114 connected by a bonding wire 115 so as to be energized; a plurality of LED package units 110 mounted on the circuit board 110, A plurality of heat dissipating grooves 141 laminated on the plurality of heat dissipating pad portions 130 and a plurality of heat dissipating grooves 141 formed on the surfaces of the plurality of heat dissipating pad portions 130, The heat dissipation pad unit 130 and the heat sink unit 140 are disposed between the LED package units 110 separated from each other, The LED package unit 110 is mounted on a circuit pattern of the formed circuit unit 120, The LED chip 114 is positioned such that one side thereof is adjacent to the first metal lead of the LED package unit 110 and the other side thereof is adjacent to the second metal lead of the other LED package unit, White paint is applied in order to prevent light from being absorbed and reflect light to improve light efficiency.

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As described above, according to the present invention, a heat sink is mounted on the same surface as an LED package mounted on a printed circuit board for an LED lighting apparatus to improve the self heat dissipation performance, thereby improving the thermal conductivity of the LED, The luminous efficiency and the luminous flux retention ratio for maintaining the luminous efficiency can be improved and the lifetime of the LED can be prevented from being lowered.

In addition, when a heat sink is applied to a circuit pattern of a printed circuit board for an LED lighting device, a heat radiating pad or a heat dissipating grease is used to improve the heat transfer rate to shorten the heat radiation time and improve the heat radiation performance, It is possible to prevent damage to the surface.

In addition, since the heat sink is applied to the surface of the printed circuit board for the LED lighting device on which the circuit pattern is formed, the manufacturing process and the manufacturing time can be shortened.

In addition, there is an effect that a light-reflecting paint is applied to a heat sink mounted on a printed circuit board for an LED lighting device to improve light efficiency.

1 and 2 show a printed circuit board for an LED lighting device to which a heat sink according to an embodiment of the present invention is applied,
3 is an enlarged exploded perspective view of a printed circuit board for an LED lighting device to which a heat sink according to an embodiment of the present invention is applied,
FIG. 4 illustrates an LED package unit of a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied,
5 is a perspective view illustrating a printed circuit board for an LED lighting apparatus to which a heat sink according to another embodiment of the present invention is applied,
FIG. 6 is an exploded perspective view of an LED lighting apparatus to which a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied,
7 is an exploded perspective view of an LED lighting apparatus to which a printed circuit board for an LED lighting apparatus to which a heat sink according to another embodiment of the present invention is applied,
FIG. 8 is an exploded perspective view of an LED lighting engine of a LED lighting apparatus to which a printed circuit board for an LED lighting apparatus to which a heat sink according to another embodiment of the present invention is applied,
FIG. 9 is a cross-sectional view illustrating a heat sink according to an exemplary embodiment of the present invention. FIG.
10 is a cross-sectional view of a streetlight, a streetlight, a streetlight, a streetlight, and the like, to which a printed circuit board for a LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied,
FIG. 11 is a perspective view illustrating a down light, a down light, a down light,
FIG. 12 is a perspective view illustrating a sensor for applying a printed circuit board for an LED lighting device to which a heat sink according to an embodiment of the present invention is applied,
FIG. 13 is a perspective view illustrating a lighting device, such as a parking light or the like, to which a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied,
FIG. 14 is a perspective view of a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied.

Hereinafter, a printed circuit board for an LED lighting apparatus to which a heat sink according to the present invention is applied will be described in detail with reference to the accompanying drawings.

1 and 2 are printed circuit boards for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied. 3 is an enlarged perspective view of a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied.

FIG. 5 is a cross-sectional view illustrating an LED package according to another embodiment of the present invention. Referring to FIG. 4, FIG. 6 is an exploded perspective view of an LED lighting apparatus using a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied.

FIG. 7 is an exploded perspective view of an LED lighting apparatus to which a printed circuit board for an LED lighting apparatus to which a heat sink according to another embodiment of the present invention is applied, FIG. 8 is a perspective view illustrating a heat sink according to another embodiment of the present invention, FIG. 9 is a perspective view of a LED lighting device using a printed circuit board for an LED lighting device according to an embodiment of the present invention. FIG. 10 is a cross-sectional view of a LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied, FIG. 12 is a view illustrating a down light which can be applied to a printed circuit board, and FIG. FIG. 13 is a view illustrating a parking light or the like to which a printed circuit board for an LED lighting apparatus to which a heat sink according to an embodiment of the present invention is applied. FIG. It is a room where a printed circuit board for the device can be applied.

In the drawings, the same reference numerals are given to the same elements even when they are shown in different drawings. In the drawings, the same reference numerals as used in the accompanying drawings are used to designate the same or similar elements. And detailed description of the configuration will be omitted. Also, directional terms such as "top", "bottom", "front", "back", "front", "forward", "rear", etc. are used in connection with the orientation of the disclosed drawing (s). Since the elements of the embodiments of the present invention can be positioned in various orientations, the directional terminology is used for illustrative purposes, not limitation.

As shown in FIGS. 1 to 3, the printed circuit board 100 for an LED lighting apparatus for a LED lighting apparatus to which a heat sink according to a preferred embodiment of the present invention is applied includes an LED for emitting light A circuit unit 120 having a plurality of LED package units 110 and a plurality of LED package units 110 spaced from each other and having a circuit pattern formed thereon; A plurality of heat dissipation pad portions 130 attached to the circuit patterns of the circuit portion 120 formed between the LED package portions 110 and spaced apart from the LED package portions 110, And a heat sink part 140 laminated on the heat radiating pad part 130 for receiving and discharging the heat of the pad part 130.

The printed circuit board 100 for the LED lighting apparatus is constructed by removing an unnecessary copper foil according to a circuit diagram of a substrate on which a thin copper foil is coated on a plate as an insulator.

4, the LED package unit 110 includes a first metal lead 112 and a second metal lead 113 coupled to an aluminum plate 111 having a predetermined size, An LED chip 114 mounted between the lead 112 and the second metal lead 113 and an LED chip 114 connected to the first metal lead 112 and the second metal lead 113 A package heat sink 116 positioned between the LED chip 114 and the aluminum plate 111 to dissipate heat generated from the LED chip 114, And a molding material 117 for receiving and protecting the package heat sink 116, the LED chip 114, and the bonding wire 115.

At this time, the LED chip 114 is composed of a substrate, a semiconductor element which is a diode, and an electrode. The diode is composed of a P-type GaN layer for uniformly spreading electrons and holes, an N-type GaN layer, and a multi-emission well structure (MQW) in which an emission layer and an insulating layer are alternately stacked.

When the forward voltage is applied to the diode in contact with the p-type GaN and the n-type GaN, the LED chip 114 emits light while recombining electrons and holes in the light emitting layer of the multiple quantum well (MQW).

Also, the LED chip 114 emits light and emits heat from the multiple quantum well (MQW).

Accordingly, the LED chip 114 becomes a heat source of the LED package unit 110. At this time, the heat source of the LED package 110 may be from the LED chip 114 to the metal lead.

The heat generated from the LED package 110 can raise the temperature to the periphery due to the characteristic of heat to move from a high temperature to a low temperature.

The plurality of LED package units 110 are mounted on the circuit unit 120.

The circuit unit 120 includes a plurality of LED package units 110 spaced apart from each other by a predetermined distance, and a circuit pattern for forming an electrical circuit between the LED package units 110 is formed.

The circuit unit 120 functions as a current supply path through which a current for driving and controlling the LED chip 114 of the LED package unit 110 can be supplied.

When a current is supplied to the circuit unit 120, the LED chip 114 of the LED package unit 110 emits light.

Here, the heat emitted from the LED chip 114 along with the light is moved to the circuit unit 120 having a relatively low temperature in the LED package unit 110 whose temperature is raised by the emitted heat.

As a result, the temperature of the circuit part 120 becomes high, and the circuit pattern may be damaged.

The heat dissipation pad unit 130 and the heat sink unit 140 are configured to receive heat transferred to the circuit unit 120 and dissipate heat.

The heat dissipation pad unit 130 is for receiving heat emitted from the LED chip 114 of the LED package unit 110 and may be made of silver, copper, gold aluminum, or the like having high thermal conductivity.

The heat dissipation pad unit 130 may include a plurality of heat dissipation pad units 130 and may have a rectangular plate shape having a predetermined size to be positioned between the LED package units 110.

At this time, the heat dissipation pad unit 130 may have various shapes such as an elliptical shape as well as a rectangular plate shape.

The heat dissipation pad unit 130 is positioned on the same plane as the surface on which the LED package unit 110 is mounted so that the circuit patterns of the circuit unit 120 formed between the LED package units 110 are electrically connected Respectively.

The heat dissipation pad unit 130 improves the heat transfer rate and allows the heat of the LED package unit 110 to be quickly transmitted to the circuit unit 120. In addition, It is possible to prevent the circuit pattern from being damaged by preventing the heat sink part 140 from being directly mounted.

Alternatively, a heat dissipation grease may be used in place of the heat dissipation pad unit 130. However, since the heat dissipating grease has a weak adhesive force, the heat dissipating grease can be easily released to the outside when the heat sink 140 is attached later. The heat dissipation grease may be used, but the heat dissipation pad unit 130 is preferably used.

The heat sink part 140 is stacked on the heat radiating pad part 130 and emits heat transmitted through the heat radiating pad part 130.

The heat sink part 140 is formed in a plate shape having the same size and shape as the heat radiating pad part 130 and a plurality of heat radiating grooves 141 may be formed at regular intervals.

Since the heat dissipation groove 141 is formed, the contact surface with the outside can be widened, and the heat transferred from the heat dissipation pad unit 130 can be easily discharged.

5, the heat sink 140 may have the same size and shape as the heat radiating pad 130, and a plurality of heat radiating fins 142 may be formed.

At this time, the heat dissipation fins 142 are preferably formed in a columnar shape, but may be formed in a square column shape or the like.

Further, the heat radiating fins 142 may be formed with wings so as to protrude outward like teeth. By forming a wing on the radiating fins 142, the heat radiation effect can be improved by widening the contact area with the outside.

The convection phenomenon occurs due to the temperature difference between the heat sink unit 140 and the heat sink unit 130, and the heat transferred from the heat sink pad unit 130 can be rapidly discharged. That is, the heat sink 140, which receives heat from the heat radiating pad 130, has a relatively high temperature, and the heat of the heat sink 140 is shifted to the outside through a temperature difference between the heat sink 140 and the outside. So that the internal temperature of the LED chip 114 can be lowered.

In addition, since the heat sink part 140 is located on one side, the heat generated from the LED chip 114 of the LED package part 110 can be quickly received and dissipated, thereby shortening the heat dissipation time Heat radiation performance can be improved.

The heat dissipation pad unit 130 and the heat sink unit 140 may be coated with a light reflecting coating.

Here, the color of the paint is preferably white, but may be changed according to the color temperature of the LED.

A white paint is applied to the heat dissipation pad unit 130 and the heat sink unit 140 so that a phenomenon such as a yellow ring due to the shadow of the heat dissipation pad unit 130 and the heat sink unit 140 Can be prevented from occurring.

Also, it is possible to prevent the light emitted from the LED chip 114 of the LED package unit 110 from being absorbed into the heat dissipation pad unit 130 and the heat sink unit 140 due to the paint, The light emitted from the LED chip 114 of the LED package unit 110 is reflected to improve the light efficiency.

On the other hand, the heat dissipation pad unit 130 and the heat sink unit 140 are positioned such that one side is adjacent to the first metal lead of the LED package unit and the other side is positioned adjacent to the second metal lead of the other LED package unit .

The heat dissipation pad unit 130 and the heat sink unit 140 are positioned so as to be adjacent to the metal leads of the LED package unit which are spaced apart from each other to shorten the time required for the heat of the LED package unit to be transmitted to the heat dissipation pad unit 130 .

Since the heat radiation pad portion 130 has a higher heat transfer rate than the printed circuit board 100 for the LED lighting device, heat can be received without passing through the printed circuit board 100 for the LED lighting device, It is possible to prevent heat from being transmitted to the printed circuit board 100 for the apparatus as well as to prevent the temperature of the printed circuit board 100 for the LED lighting apparatus from being increased.

The printed circuit board 100 for an LED lighting apparatus having the above-described structure can heat itself by mounting the heat dissipation pad unit 130 and the heat sink unit 140 in the circuit pattern of the circuit unit 120, The heat conductivity is improved and the heat emitted from the LED chip 114 of the LED package unit 110 can be rapidly discharged to the outside. Accordingly, the internal temperature of the LED chip 114 can be lowered to the guaranteed temperature or less, and the light efficiency and lifetime of the LED chip 114 can be prevented from being lowered due to the high temperature.

At this time, the guaranteed temperature is a temperature range in which the LED chip can operate normally.

In addition, when the LED chip 114 is used for a long time, it is possible to prevent the light holding time due to the heat of the LED chip 114 from being shortened, thereby improving the luminous flux retention rate and improving the lifetime of the LED.

Since the heat radiation pad portion 130 is formed between the circuit pattern of the circuit portion 120 and the heat sink portion 140, damage to the circuit pattern can be prevented, The heat generated by the heat sink 140 can be quickly transmitted to the heat sink 140, thereby reducing the heat dissipation time.

6 and 7, the LED lighting apparatus to which the printed circuit board 100 for the LED lighting apparatus is applied has one surface such that the printed circuit board 100 for the LED lighting apparatus is installed inside A light guide plate 300 for covering the open side of the housing 200 while uniformly dispersing light incident thereon; a light guide plate 300 stacked on one surface of the light guide plate 300, A light diffusing plate 300 for diffusing light emitted from the light guide plate 300 toward the inner side of the housing 200 through the light guide plate 300 And a reflection sheet 500 for reflecting the light reflected by the reflection sheet 500.

The housing 200 is preferably formed in a rectangular tube shape having a predetermined size, and the printed circuit board 100 for the LED lighting apparatus is installed inside.

At this time, the housing 200 may have various shapes such as a cylindrical shape as well as a rectangular tube shape.

The light guide plate 300 is formed in a rectangular plate shape having a predetermined size so as to cover an opened one side of the housing 200 and the LED package unit 110 of the printed circuit board 100 The light emitted from the light source is received and uniformly dispersed.

Here, the light guide plate 300 may be formed according to the shape of the housing 200.

The other surface of the light guide plate 300 may be positioned to face the inner side of the housing 200.

The diffusion plate 400 is preferably formed to have the same shape and size as the light guide plate 300. The diffusion plate 400 is disposed on one side of the light guide plate 300 and diffuses light emitted through the light guide plate 300 to the outside do.

The reflective sheet 500 may be formed to have the same shape and size as the light guide plate 300 so as to be positioned on the other side of the light guide plate 300.

The reflective sheet 500 reflects the light emitted from the light guide plate 300 toward the inner side of the housing 200 toward the light guide plate 300.

The LED lighting apparatus formed as described above can heat the printed circuit board 100 for the LED lighting apparatus itself by using the printed circuit board 100 for the LED lighting apparatus, Therefore, not only the manufacturing process and the manufacturing time can be shortened, but also the volume of the lighting apparatus can be reduced.

The printed circuit board 100 for the LED lighting apparatus can also be used in an LED lighting engine, as shown in FIG.

9 to 14, the printed circuit board 100 for the LED lighting device may be formed by a light source such as a flood light, a street light, a tunnel, a sensor, a moisture proof light, a circular room, , Security lamps, and the like.

Experimental Example

In the experimental example, the LED lighting apparatus to which the printed circuit board 100 for the LED lighting apparatus is applied and the conventional LED lighting apparatus to which the heat sink was applied to the surface of the printed circuit board for the LED lighting apparatus, Respectively.

In the experimental example, the performance evaluation was performed after putting the present invention and the conventional printed circuit board for an LED lighting apparatus into a chamber. The performance evaluation was applied to 1.35A in order to evaluate the temperature and optical performance in a chamber on a printed circuit board for each LED lighting device, and the results are shown in Table 1 below.

As shown in the following Table 1, it can be seen that the present invention is generally measured at a lower temperature than a printed circuit board for a conventional LED lighting apparatus.

Invention of the present invention A printed circuit board for a conventional LED lighting apparatus Temperature difference against room temperature Room temperature (캜) 49.183 49.174 POINT1 (℃) 62.417 65.683 3.275 POINT2 (℃) 63.583 65.934 2.360 POINT3 (℃) 66.173 69.393 3.229 POINT4 (℃) 67.016 69.820 2.813

The evaluation result was lower than that of a conventional printed circuit board for an LED lighting apparatus according to the present invention. That is, the temperature of the metal lead of the LED package unit 110 is lowered by 2 ° C. to 3.5 ° C., which means that the heat radiation performance is improved.

The heat dissipation pad unit 130 and the heat sink unit 140 are mounted on the circuit pattern of the circuit unit 120 so that heat generated from the LED chip 114 of the LED package unit 110 The heat dissipation time can be shortened and the heat dissipation performance can be improved to lower the internal temperature of the LED chip 114 to improve the light flux retention rate and to prevent the lifetime of the LED from being shortened.

On the other hand, in a conventional printed circuit board for an LED lighting apparatus in which a separate heat sink is mounted on a surface on which no circuit pattern is formed, heat generated from the LED chip is transferred to a printed circuit board for an LED lighting apparatus, It is difficult to shorten the heat dissipation time and the heat dissipation performance is deteriorated.

The performance of the LED lighting apparatus using the present invention and the conventional LED lighting apparatus for a printed circuit board were compared, and the results are shown in Table 2 below.

LED
Lighting device Beam
[lm] Light efficiency
[lm / W] Power Consumption
[W] Input voltage
[V] Input current
[A] Color temperature
[K] Color rendering
[Ra] Power factor
[%] Application of the present invention 5058.26 125.64 40.26 219.87 0.18724 5655.5 82.7 97.8 Conventional
Application of printed circuit board for LED lighting device 4944.99 122.70 40.30 219.90 0.18733 5643.4 82.5 97.8

The evaluation results show that the light efficiency is improved as the temperature of the printed circuit board for the LED lighting device is lowered.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention if they are apparent to those skilled in the art.

100: printed circuit board for LED lighting device 110: LED package part
111: aluminum plate 112: first metal lead
113: second metal lead 114: LED chip
115: bonding wire 116: package heat sink
117: molding material 120: circuit part
130: heat dissipation pad part 140: heat sink part
141: heat dissipating groove 142:
200: housing 300: light guide plate
400: diffuser plate 500: reflective sheet

Claims (3)

A plurality of LED chips 114 including a first metal lead 112 coupled to an aluminum plate 111 of a predetermined size and an LED chip 114 connected by a bonding wire 115 between the second metal leads 113 to be energized, A circuit part 120 having a circuit pattern formed on the LED package part 110 and the LED package part 110 so as to be spaced apart from each other; And a heat sink 140 having a pad 130 and a plurality of heat dissipation grooves 141 stacked on the plurality of heat dissipation pad portions 130. In the printed circuit board for an LED lighting device,
The heat dissipation pad part 130 and the heat sink part 140 are mounted on the circuit pattern of the circuit part 120 formed between the separated LED package parts 110, One side is positioned adjacent to the first metal lead of the LED package unit 110 and the other side is positioned adjacent to the second metal lead of the other LED package unit in order to shorten the receiving time,
And a heat sink is applied to prevent light emitted from the LED chip (114) from being absorbed and to reflect light to improve light efficiency. delete delete

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