JPS60143618A - Electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to radios, receivers, television receivers, video tape recorders, and video cameras.

The present invention relates to electronic components such as chip-type film capacitors used in circuits constituting electronic components such as.

Conventional Structures and Problems In general, chip-type film capacitors are, for example, chip-type metallized polyethyl capacitors, in which the plate metal terminals and 3 are connected to the capacitor body 1, as shown in Figures 1a and 1b. While the lead-out tip is positioned on the bottom surface, the bottom surface of the capacitor body 1 is made flat with no unevenness, and the plate metal terminals 2.3 are structured to protrude slightly below the bottom surface of the capacitor body 1. There is.

In order to mount this chip-type film capacitor into a circuit constituting an electronic device, generally, as shown in Fig. 2, a conductive circuit pattern 6 of Cu, Ag-Pa, Ag-Pt, kg, etc. is formed. Cream solder 6 is screen printed on the circuit pattern 6 of a wiring board 4 such as a laminate or a ceramic board.

Next, as shown in FIG. 3, a chip capacitor is mounted on the printed circuit pattern 5 of the cream solder 6, and
The cream solder 6 is melted using a 0-furnace to solder the parts. However, at this time, as shown in FIG. 3, the bottom surface of the capacitor body 1 and the plate metal terminal 2
゜31.7 A large number of granular solder balls 7 are generated in the part where the solder connection is made to the conductor circuit pattern 6 of 3 and the part surrounded by the wiring board 4, and the plate metal terminals 2 and 3 are electrically connected to the conductor. There was a problem that the insulation between the circuit patterns 5 deteriorated or a short circuit occurred.

Furthermore, as shown in FIG. 4, in order to fix the chip-type film capacitor, after screen-printing cream solder 6 on the conductor circuit pattern 6 of the wiring board 4, a thermosetting or ultraviolet nitrifying solder is used to fix the component. A mold adhesive 8 is applied between the conductor circuit patterns 5 using a dispenser or the like. The capacitor body 1 is mounted on this, the adhesive 8 is cured by heat or ultraviolet light, and the cream solder 6 is melted using a reflow oven to solder the parts. However, at this time,
As shown in FIG. 6, there was a problem in that the adhesive 8 pushed and spread by the bottom surface of the capacitor body 1 spread over the wiring board 4 and adhered to the conductor circuit no-turn 5, impairing the reliability of the electrical connection. .

OBJECTS OF THE INVENTION The present invention obviates these conventional drawbacks,
The purpose of the present invention is to provide an electronic component that can improve the reliability of the component mounting process on a circuit board.

Structure of the Invention The electronic component of the present invention has a plate-shaped or columnar metal terminal led out from a resin-molded main body.The electronic component has a plate-like or columnar metal terminal led out from a resin-molded main body. 03~i,.

The protrusion is designed so that the tip of the metal terminal and the tip of the protrusion on the bottom of the main body form almost the same plane.
This prevents deterioration in the reliability of electrical connections due to short circuits between metal terminals and spread of adhesive that fixes the chip components when the chip components are soldered and mounted on a wiring board.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings, taking a chip-type film capacitor as an example.

As shown in FIG.
0.03~o so as to form almost the same plane as the tip of
, a protrusion 9 having a height of +mm is provided.
The shape of is shown in Figure 6d.

As shown in e and f, it may be a circle, a circle, or a square.

Chip-type film capacitors with this structure are shown in Figure 7 a and b.
As shown in FIG. 2, it is attached to a wiring board 4 coated with cream solder 6 and adhesive 8 for fixing chip components. At this time, as shown in FIG. 7, the adhesive 8 is applied to both ends of the capacitor body 1 in the width direction from which the protrusions 9 have been removed. When soldering is carried out using a reflow oven, it is possible to prevent the generation of solder balls between the circuit patterns 6 and the deterioration of reliability due to the insulation of the electrical connections due to the spread of the adhesive 8.

Similarly, if the height of the convex part 9 is 0.03 mm or less, the effect of preventing the generation of solder balls and the deterioration of the reliability of electrical connections is small, and in 1) and 2, the characteristic of miniaturization, which is a characteristic of chip-shaped parts, is small. be damaged.

Also, terminals 12 and 13 shaped as shown in Figures 9a and 9b.
．． 14. 15, similar effects can be obtained.

Effects of the Invention As described above, according to the present invention, a convex portion of a predetermined height is provided on the bottom surface of the resin-molded main body so as to be located between the metal terminals for electrical connection, and the tip of the terminal and the tip of the convex portion are provided. By creating a structure in which the circuit patterns on the wiring board and the metal terminals of the chip components are connected by soldering, short circuits due to the generation of solder balls and adhesion when using adhesives for fixing components can be avoided. This is extremely advantageous in practical terms because it can prevent connection failures due to insulation of solder joints due to spreading of the agent.

[Brief explanation of the drawing]

Figures 1a and b are front and side views of a conventional chip-type film capacitor, Figure 2 is a cross-sectional view of a wiring board coated with cream solder, and Figure 3 is a conventional chip-type film capacitor mounted on a wiring board. A cross-sectional view showing how solder balls are generated during soldering, Figure 4 is a cross-sectional view of a wiring board with cream solder and adhesive applied, and Figure 5 is a spread view of the adhesive and a bottom view. , FIGS. 7a and 7b, and FIG. 8 are cross-sectional views of the parts of the present invention mounted on a wiring board, and FIGS. 9a and b are front views showing another embodiment of the present invention. 1...Capacitor (main body), 2, 3...Plate metal terminal, 4...Wiring board, 6...Circuit pattern, 6... cream solder, 9,9″,9
3...Protrusion. Name of agent: Patent attorney Toshio Nakao and one other person. Dimensions Dimensions Risaru Law - (N -('J ℃ C') ζ

Claims (1)

[Claims] Lead out a resin-molded main body or a pair of plate-shaped or columnar metal terminals so that at least a part of them is located on the bottom surface of the main body, and place them on the bottom surface of the main body between the metal terminals. An electronic component characterized in that a convex portion is provided so that the tip of the metal terminal and the tip of the convex portion on the bottom surface of the main body are located on substantially the same plane.