JP2538642B2 - Electronic circuit component mounting structure - Google Patents

Description

DETAILED DESCRIPTION [Overview] A mounting structure of an electronic circuit component, particularly a structure in which a sub-module made of a metal-based polymer wiring board is mounted on a main wiring board, and the sub-module board is mounted on the main wiring board. In this case, for the purpose of providing a mounting structure of an electronic circuit component capable of improving the mounting space, mounting efficiency, workability, etc., a metal base formed by bonding a resin layer of an insulating material onto a metal base material. Sub-module board is composed of material polymer wiring board, desired signal input / output pattern of the sub-module is provided on the resin layer at the end of the sub-module board, and the input / output pattern is formed in an arc shape with a convex surface. A sub-module board is surface-connected to the main wiring board so that the arcuate convex surface is in contact with the main wiring board.

[Industrial applications]

The present invention relates to a mounting structure for electronic circuit components, and more particularly to a structure for mounting a submodule made of a metal-based polymer wiring board on a main wiring board.

The metal-based polymer wiring board is, for example, aluminum,
A resin layer of an insulating material is bonded to a metal base material such as iron, and a circuit pattern or the like is formed thereon. Sub-modules are constructed by mounting surface mount devices (SMD) etc. on this type of board, and this sub-module is connected to the main wiring board by connecting terminals for signals, power supply, etc. and mounted on the main wiring board. To be done. The metal-based polymer wiring board of this sub-module is also used as a part of a structure such as a housing or an electromagnetic shield case, or used as a three-dimensional wiring board to expand the mounting area on the main wiring board. It may be done. By thus forming the sub-module substrate with the metal-based polymer wiring substrate, the mounting space, mounting efficiency, workability, etc. are improved.

[Conventional technology]

As shown in FIG. 5 or FIG. 6, it is conventionally difficult to limit the height of the parts, such as the variable coil 63 and the electrolytic capacitor 6.
4. In the electronic circuit where packaged functional components such as crystal oscillator 65, filter, etc. and surface mount components (SMD) 4 with relatively low component height are mixed, the spatial mounting density in the height direction In order to effectively use the sub-modules and improve the circuit mounting efficiency, the sub-module boards 51 and 61 are made of resin or ceramics, and the surface-mount components (SMD) 4 are mounted on the circuit pattern 3 of the sub-module boards 51 and 61. The sub module boards 51 and 61 are mounted so as to be perpendicular to the main wiring board 2. The sub-modules 50 and 60 are configured as a test unit, or in a circuit configuration or in terms of mounting, into desired functional units, and the sub-module substrate 51,
A connection lead 52 is formed by inserting a lead frame into one end of 61, and like the other lead parts, the connection lead 52 of the lead frame is inserted into a wiring hole (through hole) 54 provided in the main wiring board 2 and soldered. Then, the circuit was constructed. Further, as shown in FIG. 6, when the sub-module 60 is configured as a high frequency circuit, the metal shield case 62 covers the sub-module 60 to perform electromagnetic shielding.

FIG. 7 shows a configuration of a DPI type sub module 70. As a constituent means of a logic circuit or the like, although the height of parts or the like is relatively uniform, a resistor or a capacitor is a thick film or thin film element (not shown), and a circuit pattern (not shown) is formed. Surface mount device (SMD)
4 is mounted, and the terminal leads 72 of the lead frame on both sides of the sub-module board 71 are connected to the through holes of the main wiring board 2.
It is plugged into 73 and soldered.

In the conventional structure as shown in FIGS. 5 to 7, the connection leads of the sub-modules 50, 60 and 70 are often relatively large, and the connection leads of the sub-modules are formed in the through holes of the main wiring board 2. Since the main wiring board 2 has double-sided wiring, the wiring is restricted by the multilayer wiring surface inside the board in the case of double-sided wiring. Also, for connecting sub-modules (besides the original function)
Extra cost is required for the lead frame and its assembly. Further, in the high frequency circuit, a shield case 62 (FIG. 6) is required to avoid electromagnetic interference. Since the sub module board 61 is mounted in the shield case 62, the sub module board 61 is placed in the shield case 62. A mounting space that does not hit is required, and a space and a mounting land for mounting the shield case 62 on the main wiring board 2 are required.

[Problems to be Solved by the Invention]

Therefore, in the present invention, when a sub-module board is mounted on a main wiring board by using a bendable metal-based polymer wiring board without using a resin board or a ceramic board as the sub-module board. It is an object of the present invention to provide a mounting structure for electronic circuit components that can improve mounting space, mounting efficiency, workability, and the like.

[Means for solving the problem]

In order to solve such a problem, in the present invention, a sub-module substrate is constituted by a metal-based polymer wiring board formed by bonding a resin layer of an insulating material on a metal base, and an end portion of the sub-module board is formed. The desired signal input / output pattern of the sub-module is provided on the resin layer of, the input / output pattern is formed in an arc shape having a convex surface, and the sub-module board is connected to the main wiring board so that the arc-shaped convex surface contacts the main wiring board. Provided is a mounting structure for an electronic circuit component, which is surface-mounted on a substrate.

[Work]

According to the present invention, since the metal-based polymer wiring board forming the sub-module board is formed by bonding an insulating material layer whose malleability is improved by heating to a metal base material having excellent plastic workability, By applying pressure, the end portion can be easily bent. Therefore, by curving the end portion of the sub-module substrate provided with the signal input / output pattern in an arc shape, it becomes possible to make a surface connection to the main wiring substrate. As a result, the mounting space can be omitted and the mounting efficiency and workability can be improved.

〔Example〕

FIGS. 1 to 3 show embodiments (1) to (3) of the present invention corresponding to the conventional examples of FIGS. 5 to 7, respectively. Further, FIG. 4 is a detailed view of the downward bending portion of the submodule substrate.

The embodiment (1) shown in FIG. 1 is an improvement of the conventional example (1) shown in FIG. 5, in which a metal-based polymer wiring board is used as the sub-module board 1 and is perpendicular to the main wiring board 2. It is a substantially flat plate-shaped sub-module 10 to be mounted on. A surface mount device (SMD) 4 is surface-mounted on the circuit pattern 3 of the sub-module board 1, and projecting portions 6 are formed on both sides of the end portion on the main wiring board 2 side. A cylindrical portion 5 is formed in the. Cylindrical part 5
The signal input / output pattern 7 of the sub-module 10 is formed on the convex side of, and is brought into contact with the connection pattern 8 of the main wiring board 2. In order to prevent the sub-module 10 from tipping over, the projecting portions 6 on both ends of the sub-module board 1 are inserted into and penetrate through the through holes 9 of the main wiring board 2, and fixed by soldering or the like like other lead parts (not shown). To do. The signal input / output pattern 7 of the sub-module 10 is the connection pattern 8 of the main wiring board 2.
It is joined by solder reflow.

FIG. 2 is an improvement of the conventional example (2) shown in FIG. 6, in which a metal-based polymer wiring board is used as the sub-module board 1, and the shield case 62 of FIG.
Is also used by the submodule substrate 1 itself
It is composed of 20. After mounting the surface mount component (SMD) 4 on the sub-module substrate 1, the sub-module substrate 1 itself is bent into a substantially U-shape so that the component side is on the inside, thereby forming a shield case. In order to form such a shield case, the sub-module board 1 is provided with a notch hole 22, an oval slit, a notch or the like, if desired, to facilitate bending of the sub-module board 1.

FIG. 3 shows a sub-module 3 improved from the conventional example (3) shown in FIG. 7, which is a DPI type sub-module substrate 1.
Is composed of a metal-based polymer wiring board, and a surface mount component (SMD) 4 is mounted inside the sub-module board 1 (on the side of the main wiring board 2) to improve the mounting efficiency and have an electromagnetic shielding effect. This is an example. In this embodiment, the connection pattern 7 is formed on the surface mount component (SM
D) Since it is provided on the surface opposite to the mounting surface of 4, so it is 3
The surface mount device (SMD) 4 and the connection pattern 7 are connected via 1.

FIG. 4 is a detailed view of the bent portion of the sub-module board 1. The metal base polymer wiring board constituting the sub-module board 1 is, for example, a metal base material such as aluminum or iron.
An epoxy insulating resin layer 42 is adhered or joined to 41, and a conductor circuit pattern 43 is formed thereon by a method such as copper plating or photoetching of a copper-clad substrate. When the end portion of such a metal-based polymer wiring board 1 is bent into a cylindrical shape so that its cross section is substantially U-shaped, only both ends 6 of the end portion of the metal-based polymer wiring board (sub-module board) 1 are processed. The sub-module substrate 1 is made to project linearly and the edge region between both ends 6 is bent so that the cross section has a substantially U-shape.
Surface mounting is performed so that the input / output pattern 7 contacts the terminal pattern 8 of the main wiring board 2. In this case, the connection pattern 7 of the sub-module board 1 contacts the connection pattern 8 of the main wiring board 2 in an arc shape, and the reflowed solder flows well and the solder bondability is good. Therefore, as shown in FIG.
It is convenient to form the cylindrical bent portion 5 so that the character-shaped portion forms an angle of 90 ° or more (Θ> 90 °). In addition,
The protrusions 6 at both ends are inserted into the through holes 9 of the main wiring board 2 as described above and fixed by soldering or the like.

The insulating resin layer 42 may be, for example, polyimide or another polymer material. In addition, a cloth fiber such as glass or the like may be included as a reinforcing material in this.

〔The invention's effect〕

As described above, according to the present invention, since the sub-module substrate is composed of the bendable metal-based polymer wiring substrate, the end portion of the sub-module substrate is curved in an arc shape and the surface connection to the main wiring substrate is made. By doing so, it is not necessary to penetrate the through-holes of the main wiring board by the connection leads of the sub-module as in the conventional case, and the main wiring board is less subject to wiring restrictions. In addition, the lead frame for connecting the sub-module and the extra cost for assembling the lead frame are unnecessary. Furthermore, in high frequency circuits,
The sub-module board itself acts as a shield case for avoiding electromagnetic interference, and the mounting space can be effectively used, and the main wiring board does not require a space for mounting a dedicated shield case or a mounting land. Become.

[Brief description of drawings]

1 to 3 are perspective views respectively showing embodiments (1) to (3) of a mounting structure of an electronic circuit component according to the present invention, and FIG. 4 is a detailed sectional view of a bent portion of a submodule substrate according to the present invention. 5 to 7 are perspective views showing conventional examples (1) to (3) corresponding to the embodiments of the present invention. 1 ... Metal-based polymer wiring board (sub-module board), 2 ... Main wiring board, 3 ... Wiring pattern, 4 ... Surface mount component (SMD), 5 ... Bent portion, 6 ... Both end protruding portions , 7, 8 ...... Terminal pattern, 9 ...... Through hole, 10, 20, 30 ...... Sub module, 22 …… Bending hole, 31 …… Through hole, 41 …… Metal base material, 42 …… Insulation Resin layer, 43 …… Surface pattern.

Claims (1)

(57) [Claims] 1. A resin layer (42) made of an insulating material on a metal substrate (41).
A sub-module substrate (1) is constituted by a metal-based polymer wiring board obtained by bonding the above, and a desired signal input / output pattern (7) of the sub-module is provided on the resin layer at the end of the sub-module substrate, The sub-module board (1) is surface-mounted on the main wiring board (2) so that the input / output pattern is formed in a convex arc shape (5) and the convex arc surface contacts the main wiring board (2). A mounting structure for electronic circuit parts, characterized in that