JPS59164232U - chip parts - Google Patents
chip partsInfo
- Publication number
- JPS59164232U JPS59164232U JP5686583U JP5686583U JPS59164232U JP S59164232 U JPS59164232 U JP S59164232U JP 5686583 U JP5686583 U JP 5686583U JP 5686583 U JP5686583 U JP 5686583U JP S59164232 U JPS59164232 U JP S59164232U
- Authority
- JP
- Japan
- Prior art keywords
- chip parts
- protects
- chip
- external connection
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のチップ部品を示す斜視図、第2図は本考
案の一実施例におけるチップ積層セラミックコンデンサ
を基板上に実装した状態を示す斜視図である。
11・・・・・・チップコンデンサの外部接続用電極、
12・・・・・・コンデンサを保護する絶縁部、L3・
・曲ハンダ、14・・・・・・配線電極、15・・・・
・・配線電極を印刷した基板。FIG. 1 is a perspective view showing a conventional chip component, and FIG. 2 is a perspective view showing a state in which a chip multilayer ceramic capacitor according to an embodiment of the present invention is mounted on a substrate. 11...External connection electrode of chip capacitor,
12... Insulation section that protects the capacitor, L3.
・Curved solder, 14...Wiring electrode, 15...
...Substrate with printed wiring electrodes.
Claims (1)
を高くして段差を設けたチップ部品。A chip component that has a step with the insulation part that protects resistors and capacitors higher than the external connection electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5686583U JPS59164232U (en) | 1983-04-15 | 1983-04-15 | chip parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5686583U JPS59164232U (en) | 1983-04-15 | 1983-04-15 | chip parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59164232U true JPS59164232U (en) | 1984-11-02 |
Family
ID=30187182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5686583U Pending JPS59164232U (en) | 1983-04-15 | 1983-04-15 | chip parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59164232U (en) |
-
1983
- 1983-04-15 JP JP5686583U patent/JPS59164232U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59164232U (en) | chip parts | |
JPS59132625U (en) | Multilayer ceramic capacitor | |
JPS6035573U (en) | colored solder paste | |
JPS60113667U (en) | Structure of electronic components for printed wiring | |
JPS5874329U (en) | chip electronic components | |
JPS596865U (en) | Electrical component | |
JPS60133665U (en) | electronic circuit equipment | |
JPS5944029U (en) | Chip-shaped electronic components | |
JPS5931223U (en) | Chip-shaped circuit components | |
JPS6090846U (en) | hybrid integrated circuit | |
JPS6061742U (en) | integrated circuit device | |
JPS5944030U (en) | Chip-shaped electronic components | |
JPS58105168U (en) | Component mounting structure of multilayer wiring board | |
JPS5858327U (en) | chip parts | |
JPS5820531U (en) | Leadless single plate ceramic capacitor | |
JPS606242U (en) | hybrid integrated circuit | |
JPS59121863U (en) | Thick film hybrid integrated circuit device | |
JPS58162646U (en) | electronic components | |
JPS5936232U (en) | Electrical component | |
JPS58196869U (en) | Electrical component mounting structure on printed wiring board | |
JPS5869978U (en) | Printed board | |
JPS5931266U (en) | Connection terminal of printed wiring board | |
JPS6083270U (en) | thick film integrated circuit | |
JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
JPS59125862U (en) | Composite circuit device for HIC board mounting |