JPS59125862U - Composite circuit device for HIC board mounting - Google Patents
Composite circuit device for HIC board mountingInfo
- Publication number
- JPS59125862U JPS59125862U JP1942283U JP1942283U JPS59125862U JP S59125862 U JPS59125862 U JP S59125862U JP 1942283 U JP1942283 U JP 1942283U JP 1942283 U JP1942283 U JP 1942283U JP S59125862 U JPS59125862 U JP S59125862U
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- composite circuit
- board mounting
- hic board
- hic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Filters And Equalizers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の複合回路装置を示す正面図、第2図はH
IC基板に従来の複合回路装置を塔載した状態を示す一
部断面一部切欠正面図、第3図はこの考案の一実施例を
示す斜視図、および、第4図はこの考案の一実施例であ
る複合回路装置をHIC基板に塔載した状態を示す一部
正面図である。
24・・・誘電体基板、26・・・電極、28・・・コ
イル装置、32・・・第1の導電層、34・・・第2の
導電層。
第2図
第3図Figure 1 is a front view of a conventional composite circuit device, and Figure 2 is an H
FIG. 3 is a partially cross-sectional, partially cutaway front view showing a state in which a conventional composite circuit device is mounted on an IC board, FIG. 3 is a perspective view showing an embodiment of this invention, and FIG. 4 is an embodiment of this invention. FIG. 2 is a partial front view showing a state in which an example composite circuit device is mounted on an HIC board. 24... Dielectric substrate, 26... Electrode, 28... Coil device, 32... First conductive layer, 34... Second conductive layer. Figure 2 Figure 3
Claims (1)
すると共に基板の表面および側端面に延在して形成した
導電層とを有することを特徴とするHIC基板塔載用の
複合回路装置。A composite circuit device for mounting on an HIC substrate, comprising a circuit element mounted on the surface of a substrate, and a conductive layer connected to the circuit element and extending on the surface and side end surfaces of the substrate. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1942283U JPS59125862U (en) | 1983-02-12 | 1983-02-12 | Composite circuit device for HIC board mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1942283U JPS59125862U (en) | 1983-02-12 | 1983-02-12 | Composite circuit device for HIC board mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59125862U true JPS59125862U (en) | 1984-08-24 |
Family
ID=30150566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1942283U Pending JPS59125862U (en) | 1983-02-12 | 1983-02-12 | Composite circuit device for HIC board mounting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59125862U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53146169A (en) * | 1977-05-25 | 1978-12-19 | Canon Kk | Electric circuit board unit |
JPS58137236A (en) * | 1982-02-09 | 1983-08-15 | Nec Corp | Hybrid integrated circuit |
-
1983
- 1983-02-12 JP JP1942283U patent/JPS59125862U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53146169A (en) * | 1977-05-25 | 1978-12-19 | Canon Kk | Electric circuit board unit |
JPS58137236A (en) * | 1982-02-09 | 1983-08-15 | Nec Corp | Hybrid integrated circuit |
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