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JPS5858327U - chip parts - Google Patents

chip parts

Info

Publication number
JPS5858327U
JPS5858327U JP15276781U JP15276781U JPS5858327U JP S5858327 U JPS5858327 U JP S5858327U JP 15276781 U JP15276781 U JP 15276781U JP 15276781 U JP15276781 U JP 15276781U JP S5858327 U JPS5858327 U JP S5858327U
Authority
JP
Japan
Prior art keywords
chip parts
chip component
recorded
chip
electronic filing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15276781U
Other languages
Japanese (ja)
Inventor
政雄 林
白石 潔
村松 秀哲
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP15276781U priority Critical patent/JPS5858327U/en
Publication of JPS5858327U publication Critical patent/JPS5858327U/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の一実施例によるチップ部品を示す断
面図、第2図は、同実施例によるチップ部品をプリント
配線板に装着した状態を示す断面図である。
FIG. 1 is a sectional view showing a chip component according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a state in which the chip component according to the embodiment is mounted on a printed wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品における電極部をはんだにより被覆したこと
を特徴とするチップ部品。
A chip component characterized in that an electrode part of the chip component is covered with solder.
JP15276781U 1981-10-16 1981-10-16 chip parts Pending JPS5858327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15276781U JPS5858327U (en) 1981-10-16 1981-10-16 chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15276781U JPS5858327U (en) 1981-10-16 1981-10-16 chip parts

Publications (1)

Publication Number Publication Date
JPS5858327U true JPS5858327U (en) 1983-04-20

Family

ID=29945407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15276781U Pending JPS5858327U (en) 1981-10-16 1981-10-16 chip parts

Country Status (1)

Country Link
JP (1) JPS5858327U (en)

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