JPS59185870U - Mounting structure of chip components on printed circuit board - Google Patents
Mounting structure of chip components on printed circuit boardInfo
- Publication number
- JPS59185870U JPS59185870U JP7967883U JP7967883U JPS59185870U JP S59185870 U JPS59185870 U JP S59185870U JP 7967883 U JP7967883 U JP 7967883U JP 7967883 U JP7967883 U JP 7967883U JP S59185870 U JPS59185870 U JP S59185870U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive part
- mounting structure
- chip components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従□来のチップ部品の装着構造を示す断面図で
ある。第２図はこの考案の一実施例の装着構造を示す断
面図である。
図において、１はチップ部品、２は電極、３はプリント
基板、４は第１の導電部、５は接着剤、６は第２の導電
部、７は樹脂材料である。FIG. 1 is a sectional view showing a conventional chip component mounting structure. FIG. 2 is a sectional view showing the mounting structure of one embodiment of this invention. In the figure, 1 is a chip component, 2 is an electrode, 3 is a printed circuit board, 4 is a first conductive part, 5 is an adhesive, 6 is a second conductive part, and 7 is a resin material.
Claims (1)
導電部と接触した状態で、同じチップ部” 品の
電極が形成されていない面がプリント基板上に形成され
た第２の導電部との間に付与された接着剤によって仮止
めされた、プリント基板上でのチップ部品の装着構造に
おいて、 −前記第２の導電部の表面は前記接着剤に対して接着力
の弱い樹脂材料でコートされ、この樹脂材料を介して前
記接着剤と前記第２の導電部とが接着することを特徴と
する、プリント基板上でのチップ部品の装着構造−[Claim for Utility Model Registration] When the electrode of the chip component is in contact with the first conductive part formed on the printed circuit board, the surface of the same chip component on which the electrode is not formed is formed on the printed circuit board. In the structure for mounting a chip component on a printed circuit board, the surface of the second conductive part is temporarily fixed with an adhesive applied between the second conductive part and the second conductive part, wherein the surface of the second conductive part is A structure for mounting chip components on a printed circuit board, characterized in that the adhesive is coated with a resin material having a weak adhesive strength, and the adhesive and the second conductive part are bonded to each other through the resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7967883U JPS59185870U (en) | 1983-05-26 | 1983-05-26 | Mounting structure of chip components on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7967883U JPS59185870U (en) | 1983-05-26 | 1983-05-26 | Mounting structure of chip components on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59185870U true JPS59185870U (en) | 1984-12-10 |
Family
ID=30209672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7967883U Pending JPS59185870U (en) | 1983-05-26 | 1983-05-26 | Mounting structure of chip components on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185870U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834763B2 (en) * | 1978-04-14 | 1983-07-28 | 横河電機株式会社 | Liquid release measurement method |
-
1983
- 1983-05-26 JP JP7967883U patent/JPS59185870U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834763B2 (en) * | 1978-04-14 | 1983-07-28 | 横河電機株式会社 | Liquid release measurement method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59185870U (en) | Mounting structure of chip components on printed circuit board | |
| JPS5866687U (en) | spacer | |
| JPS5920671U (en) | printed wiring board | |
| JPS6049662U (en) | Chip component mounting structure | |
| JPS6057154U (en) | flexible printed board | |
| JPS5874329U (en) | chip electronic components | |
| JPS5918459U (en) | Electrical element mounting structure | |
| JPS5999477U (en) | Hybrid integrated circuit device | |
| JPS59123361U (en) | Oscillator with circuit | |
| JPS6037274U (en) | flexible circuit board | |
| JPS58103161U (en) | Printed board | |
| JPS59159975U (en) | hybrid integrated circuit board | |
| JPS59143093U (en) | Electronic component mounting board | |
| JPS59123369U (en) | Multi-board mounting equipment | |
| JPS59101425U (en) | electronic components | |
| JPS59125862U (en) | Composite circuit device for HIC board mounting | |
| JPS59191703U (en) | chip parts | |
| JPS59128726U (en) | chip parts | |
| JPS6054340U (en) | integrated circuit | |
| JPS5844874U (en) | Electronic component mounting structure on printed circuit board | |
| JPS60144263U (en) | printed wiring board | |
| JPS606242U (en) | hybrid integrated circuit | |
| JPS6083274U (en) | Spacer with adhesive tape | |
| JPS6138774U (en) | Grounding mechanism of electronic component case | |
| JPS6068659U (en) | hybrid integrated circuit |