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JPS585371U - Diode mounting mechanism - Google Patents

Diode mounting mechanism

Info

Publication number
JPS585371U
JPS585371U JP9843881U JP9843881U JPS585371U JP S585371 U JPS585371 U JP S585371U JP 9843881 U JP9843881 U JP 9843881U JP 9843881 U JP9843881 U JP 9843881U JP S585371 U JPS585371 U JP S585371U
Authority
JP
Japan
Prior art keywords
mounting mechanism
diode mounting
diode
lead
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9843881U
Other languages
Japanese (ja)
Inventor
荒牧 光男
田中 国弘
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP9843881U priority Critical patent/JPS585371U/en
Publication of JPS585371U publication Critical patent/JPS585371U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の取付機構を示す説明図、第2図は本考案
に使用したスペーサの斜視図、第3図は該スペーサの断
面図、第4図は同スペーサを用いてダイオードを取付は
構造を示す説明図である。 1・・・プリント基板、2・・・ダイオード本体、3・
・・スペーサ、4・・・リード、5・・・樹脂の盛上り
、6・・・スペーサ、7・・・リード貫通孔、8・・・
窪み。
Fig. 1 is an explanatory diagram showing a conventional mounting mechanism, Fig. 2 is a perspective view of a spacer used in the present invention, Fig. 3 is a sectional view of the spacer, and Fig. 4 shows how to install a diode using the spacer. FIG. 2 is an explanatory diagram showing the structure. 1... Printed circuit board, 2... Diode body, 3...
... Spacer, 4... Lead, 5... Resin bulge, 6... Spacer, 7... Lead through hole, 8...
Hollow.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイオード本体とプリント基板との間に介在せしめたス
ペーサに、リードド根本部の樹脂盛上りを埋設させたこ
とを特徴とするダイオード取付機構。
A diode mounting mechanism characterized in that a resin bulge at the base of the lead is embedded in a spacer interposed between the diode body and the printed circuit board.
JP9843881U 1981-07-03 1981-07-03 Diode mounting mechanism Pending JPS585371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9843881U JPS585371U (en) 1981-07-03 1981-07-03 Diode mounting mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9843881U JPS585371U (en) 1981-07-03 1981-07-03 Diode mounting mechanism

Publications (1)

Publication Number Publication Date
JPS585371U true JPS585371U (en) 1983-01-13

Family

ID=29893195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9843881U Pending JPS585371U (en) 1981-07-03 1981-07-03 Diode mounting mechanism

Country Status (1)

Country Link
JP (1) JPS585371U (en)

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