JPS5825066U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS5825066U JPS5825066U JP11769081U JP11769081U JPS5825066U JP S5825066 U JPS5825066 U JP S5825066U JP 11769081 U JP11769081 U JP 11769081U JP 11769081 U JP11769081 U JP 11769081U JP S5825066 U JPS5825066 U JP S5825066U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- copper
- coated
- utility
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はプリント基板の一部を示す図、第2図は第1図
のA−A断面図である。
1・・・基板、2・・・回路、3・・・スルホール、4
・・・ハンダ、5・・・レジストインク。FIG. 1 is a diagram showing a part of the printed circuit board, and FIG. 2 is a sectional view taken along the line AA in FIG. 1... Board, 2... Circuit, 3... Through hole, 4
...Solder, 5...Resist ink.
Claims (1)
面に半透明で薄い青緑色のレジストインクを塗布したこ
とを特徴とするプリント基板。A printed circuit board whose circuit is made of copper, the surface of which is coated with a translucent thin bluish-green resist ink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11769081U JPS5825066U (en) | 1981-08-10 | 1981-08-10 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11769081U JPS5825066U (en) | 1981-08-10 | 1981-08-10 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5825066U true JPS5825066U (en) | 1983-02-17 |
Family
ID=29911848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11769081U Pending JPS5825066U (en) | 1981-08-10 | 1981-08-10 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5825066U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60215949A (en) * | 1984-04-11 | 1985-10-29 | 日研株式会社 | Heat insulating building material |
JPH01231392A (en) * | 1988-03-11 | 1989-09-14 | Toshiba Chem Corp | Printed wiring board |
-
1981
- 1981-08-10 JP JP11769081U patent/JPS5825066U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60215949A (en) * | 1984-04-11 | 1985-10-29 | 日研株式会社 | Heat insulating building material |
JPH01231392A (en) * | 1988-03-11 | 1989-09-14 | Toshiba Chem Corp | Printed wiring board |
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