JPS5755921A - Water-resistant epoxy resin composition - Google Patents
Water-resistant epoxy resin compositionInfo
- Publication number
- JPS5755921A JPS5755921A JP12985380A JP12985380A JPS5755921A JP S5755921 A JPS5755921 A JP S5755921A JP 12985380 A JP12985380 A JP 12985380A JP 12985380 A JP12985380 A JP 12985380A JP S5755921 A JPS5755921 A JP S5755921A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- alkyl
- water
- resin composition
- resistant epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: Titled composition prepared by mixing an epoxy resin containing a phenol resin precondensate curing agent and an inorganic filler with a coupling agent which is a silane compound free from groups reactive with functional groups of the resin and the curing agent under the curing condition.
CONSTITUTION: A water-resistant epoxy resin composition is prepared by mixing (A) an epoxy resin having at least two epoxy groups in the molecule with (B) a phenol resin precondensate, (C) an inorganic filler, e.g., silica, and (D) a silane coupling agent of the formula, wherein R1 is a 1W3C alkyl, vinyl, phenyl or meth- acryloxypropyl, R2 is a 1W15C alkyl, a 1W5C alkoxy-substituted alkyl, e.g., methyltriethoxysilane. Component D is preferably 0.05W5wt% based on component C.
EFFECT: It is possible to give high water resistance without lowering the strength.
USE: Insulating materials.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12985380A JPS5755921A (en) | 1980-09-18 | 1980-09-18 | Water-resistant epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12985380A JPS5755921A (en) | 1980-09-18 | 1980-09-18 | Water-resistant epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5755921A true JPS5755921A (en) | 1982-04-03 |
Family
ID=15019869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12985380A Pending JPS5755921A (en) | 1980-09-18 | 1980-09-18 | Water-resistant epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5755921A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5991139A (en) * | 1982-11-16 | 1984-05-25 | Meidensha Electric Mfg Co Ltd | Thermally conductive electrically insulating material |
| JPS59126576A (en) * | 1983-01-08 | 1984-07-21 | Canon Inc | Fixing device and roller for fixation |
| JPS6178823A (en) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | Epoxy resin composition |
| JPS61247753A (en) * | 1985-04-26 | 1986-11-05 | Toshiba Chem Corp | Sealing resin composition |
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
-
1980
- 1980-09-18 JP JP12985380A patent/JPS5755921A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5991139A (en) * | 1982-11-16 | 1984-05-25 | Meidensha Electric Mfg Co Ltd | Thermally conductive electrically insulating material |
| JPS59126576A (en) * | 1983-01-08 | 1984-07-21 | Canon Inc | Fixing device and roller for fixation |
| JPH0554112B2 (en) * | 1983-01-08 | 1993-08-11 | Canon Kk | |
| JPS6178823A (en) * | 1984-09-27 | 1986-04-22 | Toshiba Corp | Epoxy resin composition |
| JPS6251973B2 (en) * | 1984-09-27 | 1987-11-02 | Tokyo Shibaura Electric Co | |
| JPS61247753A (en) * | 1985-04-26 | 1986-11-05 | Toshiba Chem Corp | Sealing resin composition |
| JPH0514726B2 (en) * | 1985-04-26 | 1993-02-25 | Toshiba Chem Prod | |
| JPS61296020A (en) * | 1985-06-26 | 1986-12-26 | Toshiba Corp | Epoxy resin liquid composition for sealing electronic part |
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