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JPS57205420A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS57205420A
JPS57205420A JP9134581A JP9134581A JPS57205420A JP S57205420 A JPS57205420 A JP S57205420A JP 9134581 A JP9134581 A JP 9134581A JP 9134581 A JP9134581 A JP 9134581A JP S57205420 A JPS57205420 A JP S57205420A
Authority
JP
Japan
Prior art keywords
water absorption
epoxy resin
epoxy
resin composition
polyvinylphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9134581A
Other languages
Japanese (ja)
Inventor
Yoshikazu Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9134581A priority Critical patent/JPS57205420A/en
Publication of JPS57205420A publication Critical patent/JPS57205420A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition having excellent heat resistance and improved water absorption property, prepared by mixing an epoxy resin with a polyvinylphenol as a curing agent, an epoxy-modified polybutadiene and an organic peroxide.
CONSTITUTION: To an epoxy resin composition prepared by mixing a liquid epoxy resin with a polyvinylphenol as a curing agent and, if necessary, a cure accelerator and an additive are added an epoxy-modified polybutadiene and an organic peroxide (e.g., dicumyl peroxide).
EFFECT: It is possible to improve water absorption, electrostatic properties and insulation properties after water absorption treatment.
USE: Copper-clad laminated sheet, substrate for heat bonding.
COPYRIGHT: (C)1982,JPO&Japio
JP9134581A 1981-06-12 1981-06-12 Thermosetting resin composition Pending JPS57205420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9134581A JPS57205420A (en) 1981-06-12 1981-06-12 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9134581A JPS57205420A (en) 1981-06-12 1981-06-12 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS57205420A true JPS57205420A (en) 1982-12-16

Family

ID=14023824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9134581A Pending JPS57205420A (en) 1981-06-12 1981-06-12 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57205420A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241252A (en) * 2005-03-01 2006-09-14 Sekisui Chem Co Ltd Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component
CN104002538A (en) * 2014-04-18 2014-08-27 南通诺德电子有限公司 Making method for super-thick copper foil and high heat-conducting copper clad laminate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241252A (en) * 2005-03-01 2006-09-14 Sekisui Chem Co Ltd Epoxy resin cured product, sheet made thereof and manufacturing method of the epoxy resin cured product
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component
CN104002538A (en) * 2014-04-18 2014-08-27 南通诺德电子有限公司 Making method for super-thick copper foil and high heat-conducting copper clad laminate

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