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JPS5765722A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5765722A
JPS5765722A JP14231580A JP14231580A JPS5765722A JP S5765722 A JPS5765722 A JP S5765722A JP 14231580 A JP14231580 A JP 14231580A JP 14231580 A JP14231580 A JP 14231580A JP S5765722 A JPS5765722 A JP S5765722A
Authority
JP
Japan
Prior art keywords
group
formula
organotin compound
compound
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14231580A
Other languages
Japanese (ja)
Other versions
JPH0140046B2 (en
Inventor
Masaaki Otsu
Masahiro Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP14231580A priority Critical patent/JPS5765722A/en
Publication of JPS5765722A publication Critical patent/JPS5765722A/en
Publication of JPH0140046B2 publication Critical patent/JPH0140046B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition having a long gel time and being capable of providing cured products excellent in heat resistance, prepared by mixing a resorcinol resin with at least one member selected from the group of a specified organotin compound, an aluminate ester and an alkoxy group-containing silane compound.
CONSTITUTION: An epoxy resin composition containing a curing aid consisting of at least one member selected from the group consisting of an organotin compound of formulaI, wherein R1 is a monovalent organic group, R2 is an organic acid residue which can contain a free carboxyl group, and a is 1W3, an organotin compound of formula, wherein R1 and R2 are defined as above, an organotin compound of formula III, wherein R1 and R2 are defined as above, an aluminate ester of formula IV, wherein R3 is an alkyl or an aryl and b is 1W5, and an alkoxy group-containing silane compound of formula V, wherein R4 is a straight or branched alkyl and c is 0 or 1W4, and a curing agent consisting of a resorcinol resin. This composition is easy to handle because of its long gel time and can form cured products having excellent heat resistance.
COPYRIGHT: (C)1982,JPO&Japio
JP14231580A 1980-10-11 1980-10-11 Epoxy resin composition Granted JPS5765722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14231580A JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14231580A JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5765722A true JPS5765722A (en) 1982-04-21
JPH0140046B2 JPH0140046B2 (en) 1989-08-24

Family

ID=15312488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14231580A Granted JPS5765722A (en) 1980-10-11 1980-10-11 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5765722A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56160054A (en) * 1980-05-15 1981-12-09 Toshiba Corp Resin sealing type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
US5821314A (en) * 1994-06-17 1998-10-13 Kansai Paint Company, Limited Thermosetting compositions and methods of forming a finish coat

Also Published As

Publication number Publication date
JPH0140046B2 (en) 1989-08-24

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