JPS57188827A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57188827A JPS57188827A JP7321381A JP7321381A JPS57188827A JP S57188827 A JPS57188827 A JP S57188827A JP 7321381 A JP7321381 A JP 7321381A JP 7321381 A JP7321381 A JP 7321381A JP S57188827 A JPS57188827 A JP S57188827A
- Authority
- JP
- Japan
- Prior art keywords
- annealing
- defects
- device region
- annealing process
- oxygen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 238000000034 method Methods 0.000 abstract 9
- 238000000137 annealing Methods 0.000 abstract 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 3
- 230000007547 defect Effects 0.000 abstract 3
- 229910052760 oxygen Inorganic materials 0.000 abstract 3
- 239000001301 oxygen Substances 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 230000001473 noxious effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Abstract
PURPOSE:To remove noxious impurities from a device region by annealing a silicon substrate through a Czochralski method while the annealing is divided into four processes. CONSTITUTION:The manufacture consists of the first annealing process at 1,200 deg.C or higher, the second annealing process between 950 deg.C and 1,200 deg.C, the third annealing process at 800 deg.C or lower and the fourth annealing process at 850 deg.C or higher. Oxygen diffuses to the outside and oxygen depositing nuclei shrink in the first process, the concentration of surface oxygen lowers and the generation of defects in the surface device region is reduced because a temperature drops in the second process, and the growth of the depositing nuclei is promoted because a sufficient number of defects are generated in a wafer in the third and fourth processes. Accordingly, a remarkable effect is displayed in the reduction of the defects of the surface device region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7321381A JPS57188827A (en) | 1981-05-15 | 1981-05-15 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7321381A JPS57188827A (en) | 1981-05-15 | 1981-05-15 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57188827A true JPS57188827A (en) | 1982-11-19 |
Family
ID=13511650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7321381A Pending JPS57188827A (en) | 1981-05-15 | 1981-05-15 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57188827A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184075A (en) * | 1984-09-18 | 1986-04-28 | イギリス国 | Photovoltaic solar cell |
JPH02224249A (en) * | 1988-11-29 | 1990-09-06 | Nec Corp | Manufacture of silicon substrate |
-
1981
- 1981-05-15 JP JP7321381A patent/JPS57188827A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6184075A (en) * | 1984-09-18 | 1986-04-28 | イギリス国 | Photovoltaic solar cell |
JPH02224249A (en) * | 1988-11-29 | 1990-09-06 | Nec Corp | Manufacture of silicon substrate |
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