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JPS57142355A - Transfer laminating method for copper film and its product - Google Patents

Transfer laminating method for copper film and its product

Info

Publication number
JPS57142355A
JPS57142355A JP57006876A JP687682A JPS57142355A JP S57142355 A JPS57142355 A JP S57142355A JP 57006876 A JP57006876 A JP 57006876A JP 687682 A JP687682 A JP 687682A JP S57142355 A JPS57142355 A JP S57142355A
Authority
JP
Japan
Prior art keywords
product
copper film
laminating method
transfer laminating
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57006876A
Other languages
Japanese (ja)
Inventor
Rifushin Eritsuku
Erain Giru Maago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS57142355A publication Critical patent/JPS57142355A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP57006876A 1981-01-22 1982-01-21 Transfer laminating method for copper film and its product Pending JPS57142355A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22729081A 1981-01-22 1981-01-22

Publications (1)

Publication Number Publication Date
JPS57142355A true JPS57142355A (en) 1982-09-03

Family

ID=22852538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57006876A Pending JPS57142355A (en) 1981-01-22 1982-01-21 Transfer laminating method for copper film and its product

Country Status (5)

Country Link
JP (1) JPS57142355A (en)
DE (1) DE3200593A1 (en)
FR (1) FR2498125B1 (en)
GB (1) GB2091634B (en)
IT (1) IT1150131B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287831U (en) * 1985-11-22 1987-06-04
JPS6287832U (en) * 1985-11-22 1987-06-04
JP2007307767A (en) * 2006-05-17 2007-11-29 Mitsui Mining & Smelting Co Ltd Copper foil with carrier foil, its manufacturing method, surface-treated copper foil with carrier foil and copper clad laminated sheet using it

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4427716A (en) * 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
MY105514A (en) * 1989-05-05 1994-10-31 Gould Electronic Inc Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing.
DE4009182A1 (en) * 1990-03-22 1991-09-26 Bayer Ag LAMINATED AREA
US7913381B2 (en) 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN107889354A (en) * 2016-09-29 2018-04-06 Ｊｘ金属株式会社 The metal foil of appendix body, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine
JP7186141B2 (en) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24
JPS4999779A (en) * 1973-01-09 1974-09-20
JPS49114771A (en) * 1973-03-10 1974-11-01
JPS49114772A (en) * 1973-03-10 1974-11-01
JPS502658A (en) * 1973-04-25 1975-01-11
JPS5016624A (en) * 1973-06-08 1975-02-21
JPS514286A (en) * 1974-07-01 1976-01-14 Nippon Denkai Kk KINZOKUSUHAKUBARIGOSEIJUSHIBANNO SEIZOHOHO

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (en) * 1954-06-25
US4100317A (en) * 1970-10-23 1978-07-11 Oike & Co., Ltd. Metal leaf
US4091138A (en) * 1975-02-12 1978-05-23 Sumitomo Bakelite Company Limited Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
US3969199A (en) * 1975-07-07 1976-07-13 Gould Inc. Coating aluminum with a strippable copper deposit
CH613152A5 (en) * 1976-08-13 1979-09-14 Uop Inc Process for producing a metallised laminate
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24
JPS4999779A (en) * 1973-01-09 1974-09-20
JPS49114771A (en) * 1973-03-10 1974-11-01
JPS49114772A (en) * 1973-03-10 1974-11-01
JPS502658A (en) * 1973-04-25 1975-01-11
JPS5016624A (en) * 1973-06-08 1975-02-21
JPS514286A (en) * 1974-07-01 1976-01-14 Nippon Denkai Kk KINZOKUSUHAKUBARIGOSEIJUSHIBANNO SEIZOHOHO

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6287831U (en) * 1985-11-22 1987-06-04
JPS6287832U (en) * 1985-11-22 1987-06-04
JPH0333469Y2 (en) * 1985-11-22 1991-07-16
JP2007307767A (en) * 2006-05-17 2007-11-29 Mitsui Mining & Smelting Co Ltd Copper foil with carrier foil, its manufacturing method, surface-treated copper foil with carrier foil and copper clad laminated sheet using it

Also Published As

Publication number Publication date
GB2091634A (en) 1982-08-04
FR2498125A1 (en) 1982-07-23
FR2498125B1 (en) 1989-03-31
IT1150131B (en) 1986-12-10
GB2091634B (en) 1984-12-05
DE3200593A1 (en) 1982-09-02
IT8219222A0 (en) 1982-01-21

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