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IT1150131B - TRANSFER LAMINATION OF THIN COPPER SHEETS AND FILMS, RELATIVE METHOD AND PRODUCT - Google Patents

TRANSFER LAMINATION OF THIN COPPER SHEETS AND FILMS, RELATIVE METHOD AND PRODUCT

Info

Publication number
IT1150131B
IT1150131B IT19222/82A IT1922282A IT1150131B IT 1150131 B IT1150131 B IT 1150131B IT 19222/82 A IT19222/82 A IT 19222/82A IT 1922282 A IT1922282 A IT 1922282A IT 1150131 B IT1150131 B IT 1150131B
Authority
IT
Italy
Prior art keywords
films
product
thin copper
copper sheets
relative method
Prior art date
Application number
IT19222/82A
Other languages
Italian (it)
Other versions
IT8219222A0 (en
Inventor
Eric Lifshin
Margo Elaine Gill
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of IT8219222A0 publication Critical patent/IT8219222A0/en
Application granted granted Critical
Publication of IT1150131B publication Critical patent/IT1150131B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT19222/82A 1981-01-22 1982-01-21 TRANSFER LAMINATION OF THIN COPPER SHEETS AND FILMS, RELATIVE METHOD AND PRODUCT IT1150131B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22729081A 1981-01-22 1981-01-22

Publications (2)

Publication Number Publication Date
IT8219222A0 IT8219222A0 (en) 1982-01-21
IT1150131B true IT1150131B (en) 1986-12-10

Family

ID=22852538

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19222/82A IT1150131B (en) 1981-01-22 1982-01-21 TRANSFER LAMINATION OF THIN COPPER SHEETS AND FILMS, RELATIVE METHOD AND PRODUCT

Country Status (5)

Country Link
JP (1) JPS57142355A (en)
DE (1) DE3200593A1 (en)
FR (1) FR2498125B1 (en)
GB (1) GB2091634B (en)
IT (1) IT1150131B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4427716A (en) * 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPH0333469Y2 (en) * 1985-11-22 1991-07-16
JPS6287831U (en) * 1985-11-22 1987-06-04
MY105514A (en) * 1989-05-05 1994-10-31 Gould Electronic Inc Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing.
DE4009182A1 (en) * 1990-03-22 1991-09-26 Bayer Ag LAMINATED AREA
JP4754402B2 (en) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 Copper foil with carrier foil, method for producing copper foil with carrier foil, surface-treated copper foil with carrier foil, and copper-clad laminate using the surface-treated copper foil with carrier foil
US7913381B2 (en) 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN107889354A (en) * 2016-09-29 2018-04-06 Ｊｘ金属株式会社 The metal foil of appendix body, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine
JP7186141B2 (en) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (en) * 1954-06-25
US4100317A (en) * 1970-10-23 1978-07-11 Oike & Co., Ltd. Metal leaf
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
JPS4999779A (en) * 1973-01-09 1974-09-20
JPS49114772A (en) * 1973-03-10 1974-11-01
JPS5729878B2 (en) * 1973-03-10 1982-06-25
DE2413932C2 (en) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Process for the manufacture of a composite film for the formation of printed circuits
JPS5016624A (en) * 1973-06-08 1975-02-21
JPS514286A (en) * 1974-07-01 1976-01-14 Nippon Denkai Kk KINZOKUSUHAKUBARIGOSEIJUSHIBANNO SEIZOHOHO
US4091138A (en) * 1975-02-12 1978-05-23 Sumitomo Bakelite Company Limited Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
US3969199A (en) * 1975-07-07 1976-07-13 Gould Inc. Coating aluminum with a strippable copper deposit
CH613152A5 (en) * 1976-08-13 1979-09-14 Uop Inc Process for producing a metallised laminate
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board

Also Published As

Publication number Publication date
FR2498125B1 (en) 1989-03-31
JPS57142355A (en) 1982-09-03
DE3200593A1 (en) 1982-09-02
IT8219222A0 (en) 1982-01-21
GB2091634A (en) 1982-08-04
GB2091634B (en) 1984-12-05
FR2498125A1 (en) 1982-07-23

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