JPS4999779A - - Google Patents
Info
- Publication number
- JPS4999779A JPS4999779A JP548973A JP548973A JPS4999779A JP S4999779 A JPS4999779 A JP S4999779A JP 548973 A JP548973 A JP 548973A JP 548973 A JP548973 A JP 548973A JP S4999779 A JPS4999779 A JP S4999779A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP548973A JPS4999779A (en) | 1973-01-09 | 1973-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP548973A JPS4999779A (en) | 1973-01-09 | 1973-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4999779A true JPS4999779A (en) | 1974-09-20 |
Family
ID=11612646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP548973A Pending JPS4999779A (en) | 1973-01-09 | 1973-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4999779A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57135153A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of bonding copper foil to shape |
| JPS57142355A (en) * | 1981-01-22 | 1982-09-03 | Gen Electric | Transfer laminating method for copper film and its product |
| JPH01292890A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Gas Chem Co Inc | Manufacture of thin-copper-clad circuit substrate |
-
1973
- 1973-01-09 JP JP548973A patent/JPS4999779A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57142355A (en) * | 1981-01-22 | 1982-09-03 | Gen Electric | Transfer laminating method for copper film and its product |
| JPS57135153A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of bonding copper foil to shape |
| JPH01292890A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Gas Chem Co Inc | Manufacture of thin-copper-clad circuit substrate |