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JPS5635464A - Formation of npn type transistor - Google Patents

Formation of npn type transistor

Info

Publication number
JPS5635464A
JPS5635464A JP10969279A JP10969279A JPS5635464A JP S5635464 A JPS5635464 A JP S5635464A JP 10969279 A JP10969279 A JP 10969279A JP 10969279 A JP10969279 A JP 10969279A JP S5635464 A JPS5635464 A JP S5635464A
Authority
JP
Japan
Prior art keywords
type
film
layer
sio2
connection layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10969279A
Other languages
Japanese (ja)
Inventor
Koichi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10969279A priority Critical patent/JPS5635464A/en
Publication of JPS5635464A publication Critical patent/JPS5635464A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To contrive the improvement in the characteristics of the NPN type transistor by disposing an N<+> type impurity source through a buffer film on the predetermined region on the surface of a semiconductor substrate, diffusing it and forming an N type collector connection layer thereon, and alleviating the crystal distortion on the surface of the connection layer. CONSTITUTION:An SiO2 film 4 is formed on an N type epitaxial layer 3 on a P type substrate 1 having an N<+> type buried layer 2, an opening is perforated at the layer 2, and an SiO2 buffer film 9 is newly formed therethrough. Then, a phosphorus oxychloride 10 is accumulated thereon, and a P diffusion source 60 is formed through the film 9. The phosphorus oxychloride 10 and the SiO2 9 are removed with HF solution, and P is diffused from the source 60. Then, a P<+> type isolation layer is selectively formed thereon, an SiO2 film 12 is coated thereon, an opening is selectively perforated thereat, a borosilicate glass film 13 is superimposed thereon, B is diffused in N2, and a P type base is formed thereon, openings are selectively perforated then at the films 13, 12, P-As silicate glass 14 is superimposed thereon, an N type emitter is formed by heat diffusion thereon, and P and As are superimposed on the N<+> type collector connection layer. This configuration can alleviate the strain in the vicinity of the surface of the collector connection layer, can improve the withstand voltage thereof, and can lower the noise level thereof.
JP10969279A 1979-08-30 1979-08-30 Formation of npn type transistor Pending JPS5635464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10969279A JPS5635464A (en) 1979-08-30 1979-08-30 Formation of npn type transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10969279A JPS5635464A (en) 1979-08-30 1979-08-30 Formation of npn type transistor

Publications (1)

Publication Number Publication Date
JPS5635464A true JPS5635464A (en) 1981-04-08

Family

ID=14516769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10969279A Pending JPS5635464A (en) 1979-08-30 1979-08-30 Formation of npn type transistor

Country Status (1)

Country Link
JP (1) JPS5635464A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945036A (en) * 1972-08-18 1974-04-27
JPS4965182A (en) * 1972-07-05 1974-06-24
JPS5279666A (en) * 1975-12-25 1977-07-04 Matsushita Electronics Corp Production of transistor
JPS5339081A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4965182A (en) * 1972-07-05 1974-06-24
JPS4945036A (en) * 1972-08-18 1974-04-27
JPS5279666A (en) * 1975-12-25 1977-07-04 Matsushita Electronics Corp Production of transistor
JPS5339081A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device

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