JPS56165344A - Stem for semiconductor device - Google Patents
Stem for semiconductor deviceInfo
- Publication number
- JPS56165344A JPS56165344A JP6928580A JP6928580A JPS56165344A JP S56165344 A JPS56165344 A JP S56165344A JP 6928580 A JP6928580 A JP 6928580A JP 6928580 A JP6928580 A JP 6928580A JP S56165344 A JPS56165344 A JP S56165344A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- stem
- plated
- gold
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To manufacture a stem which is economical and abounds in corrosion resistance by coating the surface of a metallic section of the stem for a semiconductor with a plating layer of silver containing gold. CONSTITUTION:The surface of a metallic section of a stem 1 consisting of a metallic bottom plate 2 to which a semiconductor element is fastened and lead terminals 4 insulated and sealed with glass 3 is coated with a plating layer 5 of silver containing gold. The plating layer of silver is obtained in such a manner that the surface of the metallic section of the stem is plated with 0.5-2.0mum thick silver, an upper section of a silver plated layer is plated with 0.1-2.0mum thick gold, the whole is thermally treated and gold on the surface of silver is diffused into silver. Thus, since mobility due to an electric field of silver is suppressed, silver can be used for the metallic section of the stem, and the stem for a semiconductor device, which is cheap and has strong corrosion resistance, can be manufactured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6928580A JPS56165344A (en) | 1980-05-23 | 1980-05-23 | Stem for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6928580A JPS56165344A (en) | 1980-05-23 | 1980-05-23 | Stem for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56165344A true JPS56165344A (en) | 1981-12-18 |
Family
ID=13398183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6928580A Pending JPS56165344A (en) | 1980-05-23 | 1980-05-23 | Stem for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56165344A (en) |
-
1980
- 1980-05-23 JP JP6928580A patent/JPS56165344A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES450690A1 (en) | Passivated and encapsulated semiconductors and method of making same | |
JPS56162875A (en) | Semiconductor device | |
DE3586135D1 (en) | CRYO ELECTRIC PLATING. | |
JPS56165344A (en) | Stem for semiconductor device | |
JPS5632749A (en) | Manufacture of semiconductor device | |
JPS6459786A (en) | Connection member of circuit | |
JPS6486527A (en) | Ccb tape carrier | |
JPS5660038A (en) | Semiconductor device | |
JPS5742138A (en) | Semiconductor device | |
JPS56129349A (en) | Method of manufacturing airtight terminal | |
JPS5730353A (en) | Semiconductor device | |
JPS56115550A (en) | Manufacture of semiconductor device | |
JPS5796561A (en) | Lead for connection of semiconductor device | |
JPS5732655A (en) | Semiconductor integrated circuit device | |
FR2241143A1 (en) | Semiconductor device with cct. element(s) with connecting points - has free areas of main and side surfaces coated with metal film | |
JPS56147453A (en) | Semiconductor device | |
JPS55143054A (en) | Resin sealed semiconductor device | |
JPS57192037A (en) | Semiconductor device | |
JPS5793535A (en) | Semiconductor device | |
JPS56120138A (en) | Semiconductor device and its manufacture | |
JPS57132346A (en) | Resin sealing type semiconductor device | |
JPS57177546A (en) | Semiconductor diode | |
JPS56160075A (en) | Semiconductor pressure sensor | |
JPS5717155A (en) | Resin sealing type semiconductor device | |
JPS57169253A (en) | Circuit substrate |