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JPS6459786A - Connection member of circuit - Google Patents

Connection member of circuit

Info

Publication number
JPS6459786A
JPS6459786A JP21675587A JP21675587A JPS6459786A JP S6459786 A JPS6459786 A JP S6459786A JP 21675587 A JP21675587 A JP 21675587A JP 21675587 A JP21675587 A JP 21675587A JP S6459786 A JPS6459786 A JP S6459786A
Authority
JP
Japan
Prior art keywords
layer
particles
adhesive
adhesive layer
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21675587A
Other languages
Japanese (ja)
Other versions
JPH0773067B2 (en
Inventor
Isao Tsukagoshi
Yutaka Yamaguchi
Atsuo Nakajima
Kuniteru Muto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP21675587A priority Critical patent/JPH0773067B2/en
Publication of JPS6459786A publication Critical patent/JPS6459786A/en
Publication of JPH0773067B2 publication Critical patent/JPH0773067B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE:To obtain excellent long-term connection reliability by using an adhesive layer containing metallic particles with no deformability to cover a surface of an adhesive layer containing coating particles with heat deformability. CONSTITUTION:A connection member is composed on a separator 6, which is used as needed, by using an adhesive layer B to cover one surface or both surfaces of an adhesive layer A. The layer A consists of metallic particles 3 of a metallic thin layer 2, which essentially coats a surface of a high-molecular core material 1, and an insulating adhesive 5. The layer B consists of metallic particles 4 and an insulating adhesive 5'. The amount of addition of the particles 3 to the layer A and the amount of addition of the particles 4 to the layer B are both made to be 0.1-15volume% in the whole solid part of the adhesives 5 and 5'. Hence, initial and long-term excellent connection reliability can be obtained for a contaminated layer, particularly even for a circuit with conductivity lowered due to oxidation or the like on the surface.
JP21675587A 1987-08-31 1987-08-31 Circuit connection member Expired - Lifetime JPH0773067B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21675587A JPH0773067B2 (en) 1987-08-31 1987-08-31 Circuit connection member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21675587A JPH0773067B2 (en) 1987-08-31 1987-08-31 Circuit connection member

Publications (2)

Publication Number Publication Date
JPS6459786A true JPS6459786A (en) 1989-03-07
JPH0773067B2 JPH0773067B2 (en) 1995-08-02

Family

ID=16693412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21675587A Expired - Lifetime JPH0773067B2 (en) 1987-08-31 1987-08-31 Circuit connection member

Country Status (1)

Country Link
JP (1) JPH0773067B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08508610A (en) * 1994-01-27 1996-09-10 ロックタイト（アイルランド）リミテッド Compositions and methods for providing anisotropically conductive channels and conjugates between two conductor sets
JP2008153208A (en) * 2007-11-19 2008-07-03 Hitachi Chem Co Ltd Connecting member, and electrode-connecting construction using the same
WO2013129437A1 (en) * 2012-03-02 2013-09-06 デクセリアルズ株式会社 Method for manufacturing connection element, and anisotropic electroconductive adhesive
WO2014046093A1 (en) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 Anisotropic conductive adhesive
WO2015056754A1 (en) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 Anisotropic conductive adhesive and connection structure
WO2017061539A1 (en) * 2015-10-07 2017-04-13 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
WO2018151131A1 (en) * 2017-02-17 2018-08-23 日立化成株式会社 Adhesive film
JPWO2019131923A1 (en) * 2017-12-28 2021-01-07 昭和電工マテリアルズ株式会社 Adhesive film

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08508610A (en) * 1994-01-27 1996-09-10 ロックタイト（アイルランド）リミテッド Compositions and methods for providing anisotropically conductive channels and conjugates between two conductor sets
JP2008153208A (en) * 2007-11-19 2008-07-03 Hitachi Chem Co Ltd Connecting member, and electrode-connecting construction using the same
WO2013129437A1 (en) * 2012-03-02 2013-09-06 デクセリアルズ株式会社 Method for manufacturing connection element, and anisotropic electroconductive adhesive
JP2013182823A (en) * 2012-03-02 2013-09-12 Dexerials Corp Manufacturing method of connection body and anisotropic conductive adhesive
US9676066B2 (en) 2012-09-24 2017-06-13 Dexerials Corporation Anisotropic conductive adhesive
WO2014046093A1 (en) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 Anisotropic conductive adhesive
WO2015056754A1 (en) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 Anisotropic conductive adhesive and connection structure
KR20180040675A (en) * 2015-10-07 2018-04-20 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and connection structure
WO2017061539A1 (en) * 2015-10-07 2017-04-13 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
CN108028477A (en) * 2015-10-07 2018-05-11 迪睿合株式会社 Anisotropic conductive film and connection structural bodies
TWI737634B (en) * 2015-10-07 2021-09-01 日商迪睿合股份有限公司 Anisotropic conductive film and connection structure
US11685137B2 (en) 2015-10-07 2023-06-27 Dexerials Corporation Anisotropic conductive film and connection structure
WO2018151131A1 (en) * 2017-02-17 2018-08-23 日立化成株式会社 Adhesive film
CN110312770A (en) * 2017-02-17 2019-10-08 日立化成株式会社 Adhesive film
KR20190113956A (en) * 2017-02-17 2019-10-08 히타치가세이가부시끼가이샤 Adhesive film
JPWO2018151131A1 (en) * 2017-02-17 2019-12-12 日立化成株式会社 Adhesive film
US11242472B2 (en) 2017-02-17 2022-02-08 Showa Denko Materials Co., Ltd. Adhesive film
JP2023029350A (en) * 2017-02-17 2023-03-03 株式会社レゾナック adhesive film
JPWO2019131923A1 (en) * 2017-12-28 2021-01-07 昭和電工マテリアルズ株式会社 Adhesive film

Also Published As

Publication number Publication date
JPH0773067B2 (en) 1995-08-02

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