JPS5573868A - Coating method for thin aluminum-silicon alloy film - Google Patents
Coating method for thin aluminum-silicon alloy filmInfo
- Publication number
- JPS5573868A JPS5573868A JP14591278A JP14591278A JPS5573868A JP S5573868 A JPS5573868 A JP S5573868A JP 14591278 A JP14591278 A JP 14591278A JP 14591278 A JP14591278 A JP 14591278A JP S5573868 A JPS5573868 A JP S5573868A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- silicon alloy
- thin aluminum
- alloy film
- coating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591278A JPS5573868A (en) | 1978-11-22 | 1978-11-22 | Coating method for thin aluminum-silicon alloy film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14591278A JPS5573868A (en) | 1978-11-22 | 1978-11-22 | Coating method for thin aluminum-silicon alloy film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5573868A true JPS5573868A (en) | 1980-06-03 |
Family
ID=15395937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14591278A Pending JPS5573868A (en) | 1978-11-22 | 1978-11-22 | Coating method for thin aluminum-silicon alloy film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5573868A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4681852A (en) * | 1980-07-18 | 1987-07-21 | Austgen-Biojet International Pty, Ltd. | Novel microorganism and method |
| JP2009010421A (ja) * | 2008-10-01 | 2009-01-15 | Toyota Motor Corp | 半導体装置を回路基板に実装する方法 |
| US7936065B2 (en) | 2006-06-12 | 2011-05-03 | Toyota Jidosha Kabushiki Kaisha | Semiconductor devices and method of manufacturing them |
| US8558381B2 (en) | 2009-03-23 | 2013-10-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
-
1978
- 1978-11-22 JP JP14591278A patent/JPS5573868A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4681852A (en) * | 1980-07-18 | 1987-07-21 | Austgen-Biojet International Pty, Ltd. | Novel microorganism and method |
| US7936065B2 (en) | 2006-06-12 | 2011-05-03 | Toyota Jidosha Kabushiki Kaisha | Semiconductor devices and method of manufacturing them |
| JP2009010421A (ja) * | 2008-10-01 | 2009-01-15 | Toyota Motor Corp | 半導体装置を回路基板に実装する方法 |
| US8558381B2 (en) | 2009-03-23 | 2013-10-15 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
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