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JPS5573868A - Coating method for thin aluminum-silicon alloy film - Google Patents

Coating method for thin aluminum-silicon alloy film

Info

Publication number
JPS5573868A
JPS5573868A JP14591278A JP14591278A JPS5573868A JP S5573868 A JPS5573868 A JP S5573868A JP 14591278 A JP14591278 A JP 14591278A JP 14591278 A JP14591278 A JP 14591278A JP S5573868 A JPS5573868 A JP S5573868A
Authority
JP
Japan
Prior art keywords
silicon
silicon alloy
thin aluminum
alloy film
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14591278A
Other languages
Japanese (ja)
Inventor
Tatsuya Enomoto
Hiroji Harada
Shinichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14591278A priority Critical patent/JPS5573868A/en
Publication of JPS5573868A publication Critical patent/JPS5573868A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To form thin aluminum-silicon alloy film coating excellent in penetration- inhibiting property and in bonding property, by keeping a silicon substrate in a specific temp. range. CONSTITUTION:A silicon substrate, which is used for internal wiring of an LSI, is kept at a temp. range from 80-300 deg.C. Under this condition, aluminum-silicon alloy coating film is formed at prescribed positions by sputtering method, or resistance heating metallizing method etc. to form internal wiring. This method makes it possible to form alloy coating of prescribed silicon concn. suitably.
JP14591278A 1978-11-22 1978-11-22 Coating method for thin aluminum-silicon alloy film Pending JPS5573868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14591278A JPS5573868A (en) 1978-11-22 1978-11-22 Coating method for thin aluminum-silicon alloy film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14591278A JPS5573868A (en) 1978-11-22 1978-11-22 Coating method for thin aluminum-silicon alloy film

Publications (1)

Publication Number Publication Date
JPS5573868A true JPS5573868A (en) 1980-06-03

Family

ID=15395937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14591278A Pending JPS5573868A (en) 1978-11-22 1978-11-22 Coating method for thin aluminum-silicon alloy film

Country Status (1)

Country Link
JP (1) JPS5573868A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4681852A (en) * 1980-07-18 1987-07-21 Austgen-Biojet International Pty, Ltd. Novel microorganism and method
JP2009010421A (en) * 2008-10-01 2009-01-15 Toyota Motor Corp Method for mounting semiconductor device on circuit board
US7936065B2 (en) 2006-06-12 2011-05-03 Toyota Jidosha Kabushiki Kaisha Semiconductor devices and method of manufacturing them
US8558381B2 (en) 2009-03-23 2013-10-15 Toyota Jidosha Kabushiki Kaisha Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4681852A (en) * 1980-07-18 1987-07-21 Austgen-Biojet International Pty, Ltd. Novel microorganism and method
US7936065B2 (en) 2006-06-12 2011-05-03 Toyota Jidosha Kabushiki Kaisha Semiconductor devices and method of manufacturing them
JP2009010421A (en) * 2008-10-01 2009-01-15 Toyota Motor Corp Method for mounting semiconductor device on circuit board
US8558381B2 (en) 2009-03-23 2013-10-15 Toyota Jidosha Kabushiki Kaisha Semiconductor device

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