JPS5531141A - Pretreatment method of brazing filler metal substrate for electroforming - Google Patents
Pretreatment method of brazing filler metal substrate for electroformingInfo
- Publication number
- JPS5531141A JPS5531141A JP10365578A JP10365578A JPS5531141A JP S5531141 A JPS5531141 A JP S5531141A JP 10365578 A JP10365578 A JP 10365578A JP 10365578 A JP10365578 A JP 10365578A JP S5531141 A JPS5531141 A JP S5531141A
- Authority
- JP
- Japan
- Prior art keywords
- electroforming
- metal substrate
- filler metal
- brazing filler
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To improve the wettability by forming film excelling in adhesiveness on the surface and facilitate forming of electroless plating, by dipping the brazing filler metal substrate for electroforming first in a solution containing aliphatic chlorine compound, and then dipping in a solution containing high molecular material.
CONSTITUTION: A brazing filler metal substrate for electroforming of ornaments and decorations such as pendants is dipped in a solution containing aliphatic chlorine compound. This solution is prepared by dissolving 25ml of aliphatic chlorine compound such as ethyl chloride, ethylene chloride and trichloroethane into 75ml of solvent such as acetone and isopropyl alcohol. After dipping in this solution for three minutes, it is dipped for another three minutes in a solution consisting of 1g of high molecular material such as polyvinyl alcohol and epoxy resin, 75ml of isopropyl alcohol, and 25ml of water. Then, after drying, a thin film excelling in hydrophilic property and adhesiveness is formed on the surface. Thereon is formed a copper plating as the base plating for gold plating easily by electroless plating.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365578A JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10365578A JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5531141A true JPS5531141A (en) | 1980-03-05 |
| JPS6146554B2 JPS6146554B2 (en) | 1986-10-15 |
Family
ID=14359787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10365578A Granted JPS5531141A (en) | 1978-08-25 | 1978-08-25 | Pretreatment method of brazing filler metal substrate for electroforming |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531141A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6128434A (en) * | 1984-07-19 | 1986-02-08 | Nippon Paint Co Ltd | Dispersion stabilizer and its use |
| JPS63203774A (en) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | Electroless plating method for electrically nonconductive substance |
-
1978
- 1978-08-25 JP JP10365578A patent/JPS5531141A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6128434A (en) * | 1984-07-19 | 1986-02-08 | Nippon Paint Co Ltd | Dispersion stabilizer and its use |
| JPS63203774A (en) * | 1987-02-20 | 1988-08-23 | Electroplating Eng Of Japan Co | Electroless plating method for electrically nonconductive substance |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6146554B2 (en) | 1986-10-15 |
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