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JPS5531140A - Pretreatment method of brazing filler metal substrate for electroforming - Google Patents

Pretreatment method of brazing filler metal substrate for electroforming

Info

Publication number
JPS5531140A
JPS5531140A JP10365478A JP10365478A JPS5531140A JP S5531140 A JPS5531140 A JP S5531140A JP 10365478 A JP10365478 A JP 10365478A JP 10365478 A JP10365478 A JP 10365478A JP S5531140 A JPS5531140 A JP S5531140A
Authority
JP
Japan
Prior art keywords
brazing filler
filler metal
solution containing
substrate
electroforming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10365478A
Other languages
Japanese (ja)
Other versions
JPS6250558B2 (en
Inventor
Ryozo Sugimura
Takaya Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP10365478A priority Critical patent/JPS5531140A/en
Publication of JPS5531140A publication Critical patent/JPS5531140A/en
Publication of JPS6250558B2 publication Critical patent/JPS6250558B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To form plated layer of noble metal on brazing filler metal substrate, by dipping the brazing filler metal substrate for electroforming in solution containing high molecular material in which metal compound is added, and applying electroless plating after drying.
CONSTITUTION: A brazing filler metal substrate for electroforming of ornaments and decorations such as pendants is dipped for three minutes in a solution containing 0.05g of palladium chloride, 1g of polyvinyl alcohol, 75ml of isopropyl alcohol, and 25ml of water. This substrate is taken out from the solution, and dried, then a hydrophilic, uniform, adherent thin film is formed on the entire surface thereof. Next, catalyzing with solution containing stannous chloride, and activating with solution containing palladium chloride, electroless copper plating is applied. Thus is formed a conductive film uniform in thickness, excelling in adhesiveness. Thereon is applied a gold plating by a thickness of 300μ, and the brazing filler metal is melted and removed by heating to 150°C. Finally, the substrate is put in a trichloroethane solution to elude residual brazing filler metal and hydrophilic film to obtain a gold pendant.
COPYRIGHT: (C)1980,JPO&Japio
JP10365478A 1978-08-25 1978-08-25 Pretreatment method of brazing filler metal substrate for electroforming Granted JPS5531140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10365478A JPS5531140A (en) 1978-08-25 1978-08-25 Pretreatment method of brazing filler metal substrate for electroforming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10365478A JPS5531140A (en) 1978-08-25 1978-08-25 Pretreatment method of brazing filler metal substrate for electroforming

Publications (2)

Publication Number Publication Date
JPS5531140A true JPS5531140A (en) 1980-03-05
JPS6250558B2 JPS6250558B2 (en) 1987-10-26

Family

ID=14359759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10365478A Granted JPS5531140A (en) 1978-08-25 1978-08-25 Pretreatment method of brazing filler metal substrate for electroforming

Country Status (1)

Country Link
JP (1) JPS5531140A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100406433B1 (en) * 1999-10-12 2003-11-19 주식회사 포스코 Method for coating on the steel sheets for automobile outer panels with polymer compound

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0240371U (en) * 1988-09-09 1990-03-19

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142774A (en) * 1976-05-25 1977-11-28 Yutaka Hosokawa Plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142774A (en) * 1976-05-25 1977-11-28 Yutaka Hosokawa Plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100406433B1 (en) * 1999-10-12 2003-11-19 주식회사 포스코 Method for coating on the steel sheets for automobile outer panels with polymer compound

Also Published As

Publication number Publication date
JPS6250558B2 (en) 1987-10-26

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