JPH11328355A - Ic module for ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure the joining of an IC module and to improve the manufacture yield of the IC card by providing a connecting means which projects acutely at the contact part where the IC module and an antenna terminal are connected together. SOLUTION: The IC module 10 has a printed board 11 and an IC chip 12. On one surface of the printed board 11, an external contact terminal part 13 is provided and on the other surface of the printed board 11, a wiring pattern layer 14 is provided. The external connection terminal part 13 and wiring pattern layer 14 are connected electrically through a through hole 19. An IC chip is mounted on the printed board 11 on the side of the wiring pattern layer, and a die pad of the IC chip and the wiring pattern layer 14 are connected electrically by a bonding wire 18. This IC module has a joining means 15 which projects acutely onto the wiring pattern layer 14 connecting to the antenna. The joining means 15 is made of a conductive metal material or a resin material wherein conductive metal powder is dispersed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC capable of transmitting and receiving data to and from an external device in a non-contact manner.
The present invention relates to an IC module used for a card. In particular, the present invention relates to an IC card IC module capable of securely connecting an antenna terminal and a module contact in a plastic IC card designed to enclose an antenna inside the IC card and mount the IC module from the outside of the card.

[0002]

2. Description of the Related Art In recent years, an IC using a semiconductor device has been developed from the viewpoint of improving data processing efficiency and security.
IC cards on which circuits are mounted have become widespread. Such an IC card includes a contact type in which an external terminal is connected to a terminal of an external device to transmit and receive data, and a non-contact type in which an antenna is provided and which transmits and receives data to and from the external device by electromagnetic waves. is there. Recently, the driving power of an IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card without a built-in battery is increasing. Further, it is required that a non-contact type IC card be provided with a contact type terminal board so that both functions can be used.

The IC module has a structure in which an IC chip having a microprocessor or memory function is mounted on a printed board, and the IC chip is covered with an epoxy resin or the like. The IC chip is formed thinly for embedding in a card, and its thickness is 150 to 300 μm.
It is about. Since it is thin in this way, it is likely to be damaged by external stress. On the other hand, non-contact IC cards are
There is a standard of 10536, and the card thickness is defined as 0.76 mm. Therefore, there is a manufacturing problem in that a fragile IC module is securely loaded in such a thin card base layer to ensure high reliability.

A conventional non-contact type IC card has, for example, a configuration in which an IC module including an IC chip and an antenna is incorporated between a front resin sheet and a back resin sheet. In the non-contact type IC card, in the manufacturing process, for example, the above-mentioned front and back resin sheets are heat-pressed with a transparent oversheet and a pre-printed milky white intermediate sheet by a hot press to form an integrated unit. A concave portion corresponding to the shape of a component such as a contact IC module, a coil, a capacitor, and a battery is cut to manufacture a front resin sheet and a back resin sheet. Next, for example, after applying a thermosetting adhesive to the back resin sheet, components such as an IC chip and an antenna are mounted in accordance with the positions of the recesses, and the front resin sheet is cured until the adhesive is cured. It is bonded by pressing with a press machine.

[0005] However, in the above-described method of manufacturing a non-contact type IC card (thermal lamination method), there is a problem that printing performed on the front resin sheet and the back resin sheet may be defective. This is because, when components such as an IC chip are mounted, irregularities corresponding to these components are formed on the surface of the front resin sheet and the surface of the back resin sheet, and distortion occurs due to the irregularities, thereby deteriorating printing quality. That's why. Also, since the IC chip and the coil or antenna are connected in advance and then buried in the card base for lamination,
There was also a problem that the electrical connection was cut off in the hot-pressing process and the restoration was impossible.

Therefore, a method of forming a card base in which only an antenna is embedded in advance and forming a recess for fitting the IC module in the card base and mounting the IC module has been used. FIG. 7 shows a non-contact type I
It is a figure showing the conventional manufacturing method of C card. First, FIG.
As shown in (A), an antenna 24 and an antenna connection terminal 25 are formed on a core sheet by screen printing or the like, and upper and lower oversheets are laminated on the core sheet by thermal bonding or the like to be integrated to form a card base. Then, FIG.
As described above, the recess 22 is formed in the base by counterboring so that only the connection terminal 25 of the antenna is exposed to the outside, and the required IC chip is mounted in the recess. In this method, an IC module 10 having a connection terminal 26 for connecting to an antenna terminal is fitted and fitted using an adhesive, and the IC module and the antenna terminal are connected to form an IC card (Japanese Patent Laid-Open No. 9-1236).
54, JP-A-9-286187, etc.).

[Problems to be solved by the invention]

However, in the manufacturing method in which the IC module is fitted into the recess, the antenna connection terminal and the module terminal are joined using a conductive adhesive or the like, but reliable joining may not be achieved. , There was a lack of reliability. Therefore, the present invention relates to an IC for an IC card in which reliable bonding is performed even in bonding in such a manufacturing method.
It is intended to provide a module.

[0008]

Means for Solving the Problems The first aspect of the IC card IC module of the present invention for solving the above-mentioned problems is an IC card IC module used in connection with an antenna for data transmission and reception. An IC module for an IC card, characterized in that a sharply protruding joining means is provided at a contact portion connected to an antenna terminal of the IC module. Since such an IC module is used, the connection can be made surely.

A second aspect of the IC module for an IC card according to the present invention for solving the above-mentioned problems is that the antenna for data transmission / reception is incorporated therein and is fitted to a card base having a concave portion for exposing the antenna terminal to the outside. What is claimed is: 1. An IC module for an IC card, wherein the IC module is provided with a sharply projecting joint at a contact portion of the IC module connected to the antenna terminal. ,It is in. Since such an IC module is used, the connection can be made surely.

A third aspect of the IC card IC module according to the present invention for solving the above-mentioned problems is that the IC module has an electric contact capable of directly receiving power from an external device, in addition to an electric contact with an antenna. It is characterized by the following. In this case, the IC module can directly receive power from an external device, for example, supply and receive signals from the external device.

According to a fourth aspect of the present invention, there is provided an IC card IC module according to the present invention, wherein the joining means is made of a conductive metal material. The joining means is made of a resin material in which conductive metal powder is dispersed. In these cases, the electrical connection can be further ensured.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of an IC module for an IC card according to the present invention. FIG. 1 shows a contact / non-contact type IC module having a contact terminal with an external terminal. FIG.
(B) is a back view of the IC chip side, and FIG. 1 (C) is a cross section along a bonding wire connected to newly provided terminals C9 and C10.

The IC module 10 has a printed circuit board 11 and an IC chip 12 mounted on the printed circuit board 11 as shown in FIG. An external contact terminal portion 13 is provided on one surface of the printed board 11, and a wiring pattern layer 14 is provided on the other surface of the printed board 11. The external contact terminal portion 13 and the wiring pattern layer 14 are electrically connected via a through hole 19. On the wiring pattern layer side of the printed board 11, the IC chip 1
2 is mounted, and the die pad of the IC chip and the wiring pattern layer 14 are electrically connected by the bonding wires 18 (FIG. 1B). The IC chip 12 is covered with the mold resin 16 including the bonding wires 18. A feature of the IC module according to the present invention resides in that the IC module has a joining means 15 having a sharply projecting shape on the wiring pattern layer 14 connected to the antenna.

As shown in FIG. 1A, eight terminals C1 to C8 are formed on the contact terminal side surface according to the ISO standard. Of these, the terminals C4 and C8 are for future use and are not actually used at present. Each terminal is separated by a separation groove 17. Terminals connected to the antenna are usually formed at terminals C9 and C10 provided separately from C1 to C8.

FIG. 2 shows another embodiment of the IC module for an IC card according to the present invention. 2A and 2B show a non-contact only type IC module. FIG. 2A is a front view of the module, FIG. 2B is a back view of the IC chip side, and FIG. 2C is along a bonding wire connected to an antenna terminal. FIG. In the case of FIG. 2, since it is a non-contact IC module, there is no external contact terminal portion as shown in FIG. 1C, and only two wiring pattern layers 14 connected to the antenna terminals are provided on the back side. ing. At the end of the wiring pattern, a joining means 15 is formed as in the case of FIG. When the IC module is mounted, the joining means 15 is inserted into the antenna connection terminal to achieve conduction.

FIG. 3 is an enlarged view of the joining means. As shown in FIG. 3A, the joining means may have a shape having a sharp tip in the shape of a cone or a pyramid. like,
The tip portion may have a somewhat circular shape, and may have a shape and hardness such that it penetrates the antenna terminal portion as a whole, does not bite into the card base material, and is not deformed. Although the height h of the joining means 15 depends on the application, a height h of 0.1 to 0.2 mm is sufficient. In order to attach the joining means having a sharply projecting shape to the module, the joining means such as a metal material formed in the shape is fixed on the wiring pattern layer using a conductive adhesive or solder, or a conductive metal is used. It can be formed by directly molding a dispersed resin or the like and fixing it to the wiring pattern layer.

Next, a method of manufacturing an IC card using the joining means 15 will be described. FIG. 4 is a diagram showing a non-contact IC card according to a manufacturing method in which an IC module is fitted in a concave portion. FIG. 4A is a plan view of the IC card,
FIG. 4B is an exploded cross-sectional view along the line AA in FIG. As shown in FIG. 4, a coil 24 is formed in the IC card base 21 and is connected to the IC module 10 via a coil connection terminal 25. The antenna can be provided as a winding coil in which a conductive wire is wound in a coil shape, a spiral pattern can be formed on a printed circuit board by a photo-etching method, or can be formed by silk screen printing using a conductive ink. .
Generally, as shown in FIG. 4B, the antenna 24 is often formed on the surface of the core sheet 213, and is provided at both ends of the antenna and at the portions to be connected to the IC module to ensure the connection. A connection terminal 25 such as a metal piece is often attached. The antenna and the metal piece are bonded with a conductive adhesive or solder. In FIG. 4, the joining means 15 is omitted.

FIG. 5 is an enlarged sectional view showing a process of mounting the IC module, and FIG. 6 is an enlarged sectional view showing a state where the IC module is mounted. When mounting the IC module on the card base, first, the core sheet 213, the intermediate sheets 212 and 214, and the oversheets 211 and 215 are integrated by hot pressing or lamination. Appropriate printing can be performed in advance on the front side of the intermediate sheets 212 and 214 or the back side (inner side) of the oversheets 211 and 215. An antenna 24 is formed on the surface of the core sheet, and connection terminals 25 are also provided.

Next, after punching into individual card sizes, a concave portion for mounting an IC module is counterbored. The counterbore is formed by cutting using an end mill, a drill, an engraving machine, or the like. First, cutting is performed to a depth at which the antenna connection terminal 25 is exposed, and then, a central portion into which the module enters is further cut to a predetermined depth. The IC module is inserted into the concave portion, and the joining means 15 of the IC module penetrates the connection terminal 25 of the antenna, and the tip of the IC module directly penetrates the card base material. It is preferable that a part of the adhesive is not applied to a portion where the antenna connection terminal and the module substrate are in contact with each other. FIG. 6 shows a state after the completion of the hot pressing. In this state, the wiring pattern layer 14 is reliably connected to the antenna 24 via the joining means 15 and the connection terminal 25.

<Embodiments Related to Materials> Module Board As a module board, a board used as various printed circuit boards in addition to a glass epoxy resin board can be used. As the card base material, vinyl chloride resin, ABS resin,
A known material such as a polyethylene terephthalate resin or a polycarbonate resin, which has been conventionally used as a substrate of an IC card, can be used. As a material used for the joining means, a conductive material having a certain degree of hardness is preferable, and metals such as copper, aluminum, gold, silver, chromium, nickel, alloys thereof, and copper,
A resin material or the like that is made conductive by dispersing metal powder such as gold, silver, or aluminum can be used.

[0021]

EXAMPLES (Example 1) <Preparation of IC module> IC module for contactless IC card (“SLE-44R2” manufactured by Siemens Corporation)
S "; a joint formed by cutting metal copper on both connection terminal portions on the back surface of the substrate having a thickness of 0.2 mm so as to have a conical shape with a height of 0.2 mm (diameter at the bottom 0.15 mm). The means 15 was fixed on the wiring pattern layer of the IC module using a conductive adhesive ("Able Bond 8350T" manufactured by Able Stick).

<Preparation of IC Card Base> As a transparent oversheet 211 (FIG. 5), a resin sheet (copolymer of polyvinyl chloride and vinyl acetate) having a thickness of 0.05 mm was used. Used was 0.15 mm thick. After providing a white concealing layer on the surface of the milky white polyvinyl chloride sheet 212, a pattern was formed by offset printing. On the other hand, the core sheet 21
For No. 3, a 0.36 mm thick milky white polyvinyl chloride sheet was used, and an antenna pattern (line width) was formed on the surface of the core sheet 213 fused to the milky white polyvinyl chloride sheet 212 using conductive ink made of aluminum paste. 0.05
mm) by silk screen printing.

At both ends of the antenna pattern,
0.05 thickness at the part to be joined with the joining means of the module
A lead terminal of 25 mm was bonded to the antenna 24 using a conductive adhesive to form a connection terminal 25. The lead foil was die-cut with a double-sided adhesive stuck on release paper (10 mm x
2 pieces having a size of about 4 mm), and peeling the die-cut lead foil pieces from the release paper together with the double-sided adhesive, and joining the IC module terminals on both sides of the portion where the IC module is mounted on the core sheet. It was bonded to the position corresponding to the means 15 and joined to the antenna pattern as described above.

The transparent oversheet 215 was the same and the same thickness as the oversheet 211, and the milky white polyvinyl chloride sheet 214 was the same and the same thickness as the sheet 212. With the core sheet 213 on which the antenna 24 and the connection terminal 25 are formed as the center, two sheets 212 and 211 are stacked on the antenna surface side, and two sheets 214 and 215 are stacked on the back side, and are hot-pressed and integrated into a card base. Was formed. Thereafter, punching was performed for each card size.

First, a recess was machined to a depth of 0.20 mm on the portion of the card base where the IC module 10 was mounted, so that the antenna connection terminal 25 was exposed. Next, set the center part where the module enters to 0.
30mm depth (0.50m in total from the card substrate surface)
m), a counterbore recess 22 was formed.

After applying a heat-reactive adhesive (“Afan UH-203” manufactured by Nippon Matai Co., Ltd.) to the connection terminal portion, the IC module is fitted into the concave portion 22 and heated under pressure (100 to 170 ° C.). , 5-15 kg / cm ² , 5
Sec) and fixed in the recess. At this time, the joining means 15 penetrates through the antenna connection terminal 25 and cuts into the card base.
The continuity between the C module 10 and the antenna 24 was completely achieved.

(Example 2) <Preparation of IC module> IC module for non-contact type IC card ("SLE-44R2" manufactured by Siemens KK)
S "; a conductive adhesive in which silver powder is dispersed (" Able Bond 8350T "manufactured by Able Stick Co., Ltd.) is solidified on both connection terminal portions of the substrate having a thickness of 0.2 mm;
The joining means 15 was formed so as to have a conical shape having a diameter of 0.15 mm (bottom side diameter: 0.15 mm), and fixed on the wiring pattern layer.

<Preparation of IC Card Substrate> An IC card substrate under the same conditions as in Example 1 was prepared, and an IC card substrate having the above joining means was prepared.
The C module is fitted into the recess 22 and heated under pressure (temperature 1).
(0 to 170 ° C., 5 to 15 kg / cm ² , 5 seconds) and fixed in the recess.

In the completed non-contact type IC card, both of Examples 1 and 2 exhibited a good operation, and no malfunction occurred even when the bending test was repeatedly performed. In addition, since the card surfaces were all formed smoothly, the design provided on the milky white polyvinyl chloride sheet layer was not distorted.

[0030]

Conventionally, in a plastic IC card designed to enclose an antenna inside the card and mount the module from the surface of the card, the antenna connection terminal of the antenna mounting card and the contact of the IC module are securely joined. However, this problem can be solved by using the IC module of the present invention. By ensuring the bonding of the IC modules, it is possible to contribute to improving the production yield of the IC card.

[Brief description of the drawings]

FIG. 1 shows an embodiment of an IC module for an IC card according to the present invention.

FIG. 2 shows another embodiment of the IC module for an IC card of the present invention.

FIG. 3 is an enlarged view of a joining unit of the IC module.

FIG. 4 is a view showing a non-contact IC card according to a manufacturing method in which an IC module is fitted into a concave portion.

FIG. 5 is an enlarged sectional view showing a step of mounting an IC module.

FIG. 5 is an enlarged sectional view showing a state where an IC module is mounted.

FIG. 7 is a diagram showing a conventional method of manufacturing a non-contact type IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC module 11 Printed circuit board 12 IC chip 13 External contact terminal part 14 Wiring pattern layer 15 Joining means 16 Mold resin 17 Separation groove 18 Bonding wire 19 Through hole 20 IC card 21 IC card base 22 Depression 24 Antenna 25 Connection terminal 26 Module terminal 211, 215 Transparent over sheet 212, 214 Milky white sheet (intermediate sheet) 213 Core sheet

Claims (5)

[Claims] 1. An IC module for an IC card used by connecting to an antenna for data transmission and reception, the IC module comprising:
An IC module for an IC card, wherein a joining means having a sharply projecting shape is provided at a contact portion connected to an antenna terminal of the module. 2. An IC module for an IC card, wherein an antenna for data transmission / reception is incorporated therein and used by being fitted to a card base having a concave portion for exposing the antenna terminal to the outside. An IC card I characterized in that a sharply protruding joining means is provided at a contact portion of the IC module connected to the antenna terminal.
C module. 3. The IC card according to claim 1, wherein the IC module has an electric contact that can directly receive power from an external device, in addition to the electric contact with the antenna. IC module. 4. The IC according to claim 1, wherein said joining means is made of a conductive metal material.
IC module for cards. 5. The IC module for an IC card according to claim 1, wherein said joining means is formed of a resin material in which conductive metal powder is dispersed.