JPH09286187A - Ic card, intermediate for producing ic card and production of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card in which damage of an IC module is decreased at the time for producing the card and an antenna or a coil having large area is provided. SOLUTION: This IC card is equipped with a platelike card substrate 3 in which an antenna 2 is embedded. A recessed part 3a is formed in the card substrate 3. The electrode 2a of the antenna 2 is exposed in the recessed part 3a. Further, an IC module 1 performing processing of data is fitted in the recessed part 3a and the electrode 7 of the IC module 1 is connected to the electrode 2a of the antenna 2 in the inside of the recessed part 3a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card having an electronic component as a main component and an IC card having an antenna or a coil arranged in a flat card base, and
The present invention relates to an intermediate for producing a C card and a method for producing the same.

[0002]

2. Description of the Related Art This type of IC card has been put to practical use, for example, as an external storage means of a computer or as a credit card, an ID card, a cash card, or the like. Among them, in the non-contact type IC card, data can be written in the card in a non-contact manner by an electromagnetic wave emitted from an external writing device, and recorded data is also transmitted / received to / from the outside by using the electromagnetic wave. It can be read by the device. Generally, non-contact type I
The internal structure of the C card is an IC including a microprocessor for processing data and a memory unit for storing the data.
It consists of a part called a module and an antenna for transmitting and receiving electromagnetic waves.

The IC module and the antenna are
A non-contact type IC card is formed by being embedded in a plastic card base. The standard of the non-contact type IC card is ISO 10536, and the thickness of the card is defined as 0.76 mm here. Therefore, the thickness of the embedded IC module and antenna is limited.

Here, the IC module has a structure in which an IC chip having a function of a microprocessor or a memory is mounted on a printed board, and the IC chip is covered with an epoxy resin or the like. The IC chip is thinly processed for incorporation into the card, and its thickness is 300μ.
m. By making it thin like this, I
The C chip is fragile and may be cracked by receiving stress during the manufacture of the IC card. Although the mechanical strength of the IC module is improved by covering the IC chip with epoxy resin or the like, the damage of the IC chip cannot be completely prevented.

Further, the antenna may be provided as a winding coil formed by winding a conductive wire in a coil, or may be provided by forming a spiral pattern on a printed board. The reason why the loop is formed in this way is to use the induction electromagnetic field for communication. From this viewpoint,
The larger the loop area of the antenna, the more desirable it is for communication. However, the thickness of the antenna can be made thinner than that of the IC chip by devising the number of windings of the winding coil, the winding method, or using a printed board. The antenna is more resistant to impacts than the IC chip, and especially if a printed circuit board is used, it can be stronger against pressure and temperature than that using a conductive wire. Therefore, non-contact I
When manufacturing C cards, etc., IC rather than antenna
There is a strong need to prevent chip damage.

Conventionally, the following methods have been proposed as a method of manufacturing a non-contact type IC card. (1) The card base is counterbored to form a recess,
A method of fitting the antenna and IC module in the recess and fixing them with an adhesive. In this case, the IC module and the antenna are connected before fitting in the recess.
Then, after fixing the IC module and the antenna to the recess, a resin sheet or a label is attached to the card base to cover the IC module and the antenna. (2) A method in which the antenna and the IC module are sandwiched between two resin sheets, and the resin sheet is integrated by a heating press to simultaneously embed the antenna and the IC module (thermal lamination method). In this case, the two sheets integrated by the press serve as the card base. (3) Place the antenna and IC module in the mold,
Furthermore, a method (injection molding method) of injecting a thermoplastic resin, which is a material of the card base, into the mold. In this case, the antenna and the IC module are connected before placement in the mold.

[0007]

The manufacturing method (1) described above is simple and less likely to damage the IC module and the antenna, but when the thickness of the antenna is large, the card body is counterbored. It may be difficult, and it may be difficult to keep the thickness of the entire card within the limits of the above standard. Further, even when the loop area of the antenna is larger than that of the card base, the spot facing process may be difficult. Further, in the manufacturing method (2), the thin and brittle IC chip is likely to be mechanically and physically damaged by heat and pressure. Further, the manufacturing method (3) has a high possibility of damaging the IC chip by heat and pressure, like the manufacturing method (2). Further, it has been difficult in the past to support the one in which the antenna and the IC module are connected in the mold so that the electrically connected state is maintained.

The present invention has been made in consideration of the above circumstances, and provides an IC card having an antenna or coil having a large area, which can reduce damage to the IC module at the time of manufacturing the card. With the goal.
Further, the present invention can reduce the damage of the IC module, manufacture an IC card having an antenna or coil having a large area, and change the type of the IC card to be manufactured. It is an object to provide a method for manufacturing a card.

[0009]

In order to solve the above problems, an IC card according to the present invention is a flat card base having a recess, and an IC module fitted in the recess for processing data. And an antenna or coil embedded inside the card base and electrically connected to the IC module. In such an IC card, an antenna or a coil, which is less likely to be mechanically or physically damaged, is embedded in the card base, while an IC module, which is more likely to be damaged, is fitted into the recess of the card base. ing. That is, in the manufacture of an IC card, the step of fitting the IC module into the recess of the card base is inevitably adopted, and when the IC module is embedded in the card base as in the thermal lamination method or the injection molding method. In comparison, it is possible to significantly reduce mechanical and physical damage to the IC module. On the other hand, by embedding the antenna or coil in the card base, even an antenna or coil having a large thickness or a large loop area can be easily arranged in the card base. This is clear if a case where the antenna or the coil is arranged in the recessed portion which has been subjected to the counterbore processing is assumed. Further, conventionally, since the antenna or coil and the IC module are electrically connected to each other and then they are embedded in the card base, the electrical connection between the two is disconnected depending on the embedding process. However, it could be difficult to repair. However, it is possible to secure the electrical connection between the two by previously burying the antenna or coil in the card base and then fitting the IC module into the recess of the card base. Moreover, by mounting the IC module after embedding the antenna or the coil in the card base, even if the antenna or the coil is broken before the IC module is mounted, the defective product can be checked. It is possible. Therefore, the expensive IC module is not wasted.

From the viewpoint of facilitating electrical connection between the antenna or coil and the IC module, the electric contact of the antenna or coil is exposed in the recess, and the IC module is connected to the IC module in the recess. It is preferable that the antenna or coil is electrically connected. Further, a substrate having electrical contacts to the antenna or coil is projected on the periphery of the IC module, and when the IC module is fitted in the recess, the electrical contacts of the antenna or coil are It is preferable that the IC module surrounds the IC module and is brought into contact with the electrical contacts of the IC module provided on the substrate.

Further, it is preferable that the IC module can be pulled out from the recess. This makes it possible, for example, to replace the IC module with a new one when the IC module fails, or to replace the IC module with another IC card when the antenna or coil fails. The IC module may have an electrical contact for directly receiving power from an external device, in addition to the electrical contact for the antenna or the coil. In this case, the IC module can directly receive power from the external device as well, for example, exchange signals with the external device and receive power from the external device. In addition to this, the IC module can receive power from an external device via an antenna or a coil, for example, exchange signals with the external device and receive power from the external device. That is, the IC card is used as a so-called hybrid type IC card having both advantages of the non-contact type and the contact type.

The IC card manufacturing intermediate according to the present invention includes a flat plate-shaped card base having a recess, and an antenna or coil embedded in the card base and having an electrical contact exposed in the recess. And an IC module for processing data is fitted in the recess. According to this IC card manufacturing intermediate, when manufacturing an IC card,
Inevitably, the antenna or coil is first embedded in the card base to manufacture the IC card manufacturing intermediate, and then the IC module is fitted into the recess of the card base. Therefore, mechanical and physical damage to the IC module can be significantly reduced, and even an antenna or coil having a large thickness and a large loop area can be easily arranged in the card base. . In addition, if the IC card manufacturing intermediate is defective, by not mounting the IC module on it,
There is no need to waste expensive IC modules. Further, it is possible to ensure the electrical connection between the antenna or coil previously embedded in the card base and the IC module that is later fitted into the recess of the card base. Moreover, by preparing such an IC card manufacturing intermediate, I type of an IC card according to the application of the IC card to be manufactured is prepared.
It is possible to select the C module and mount it on the IC card manufacturing intermediate. That is, when manufacturing a non-contact type IC card, a non-contact type IC module having only electrical contacts to the antenna or coil is selected, and when manufacturing a hybrid type IC card, the antenna or coil is selected. In addition to the electrical contacts for the above, an IC module having electrical contacts for directly receiving power from an external device may be selected.

Further, in the method of manufacturing an IC card according to the present invention, a flat card base having a recess, an IC module fitted in the recess for processing data, and embedded in the card base. A method of manufacturing an IC card, comprising: an antenna or a coil electrically connected to the IC module, wherein the antenna or the coil is embedded in the card base, and the IC module is arranged in the recess. The IC module is connected to the antenna or coil. The effect of adopting such a manufacturing method is as described above.

In this case, in the step of burying the antenna or coil in the card base, the antenna or coil is sandwiched between two material sheets forming the card base, and the material sheets are joined together. Good. In this case, the process is simple and the manufacturing cost is low. In addition, the formation of the recess for fitting the IC module
Although it is possible to perform counterboring after joining the material sheets together, depending on the shape of the material sheets, such as forming a recessed portion in the material sheet in advance, the material sheets can be joined at the same time as the depressions. Can also be formed.

Alternatively, as a step of embedding the antenna or coil in the card base, the antenna or coil may be arranged in a mold, and the material of the card base may be injected into the mold to be solidified. In this case, at the same time when the antenna or the coil is embedded, it is possible to form a recess for fitting the IC module by the mold.

Further, as a step of burying the antenna or coil in the card base, the antenna or coil is formed on the surface of a supporting member, and the antenna or coil is placed in a mold together with the supporting member, and the antenna or coil is placed in the mold. The material of the card substrate may be poured and solidified. By arranging the antenna or coil together with the support member in the mold in this way, the antenna or coil is reinforced,
It is possible to prevent a problem that the antenna or the coil is deformed or flows when the material of the card base material is injected into the mold.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. A. Configuration of Embodiment First, FIGS. 1 (A), 1 (B), and 1 (C) show the I according to the embodiment of the present invention.
The structure of a C card is shown. As shown in the figure, this IC card is composed of a rectangular flat card base 3, an IC module 1 arranged in the card base 3, and an antenna 2 embedded in the card base 3. .

As the material of the card base 3, a vinyl chloride resin, an ABS (acrylonitrile-butadiene-styrene copolymer) resin, a PET (polyethylene terephthalate) resin, an epoxy resin, or the like has been conventionally used as a base for an IC card. Known materials are used. A recess 3a is formed in the card base 3 from one side thereof, and the IC module 1 is fitted in the recess 3a.

As shown in FIGS. 2A and 2B, in the IC module 1, an IC chip 4 having a function of a microprocessor and a memory is mounted on a printed circuit board 6, and the IC chip 4 is mounted.
Is sealed with a resin sealing portion 4a made of an epoxy resin and serving as a protective layer. As the material of the printed circuit board 6,
Although glass epoxy can be used as in the conventional case, a polyimide resin may be used for the purpose of improving heat resistance and bending resistance. In addition, any material generally used for a printed circuit board can be used as a material for the printed circuit board 6. The antenna 2 is mounted on the printed circuit board 6.
Two electrodes 7 for electrical connection between the IC chip 4 and the IC chip 4 are formed.

The connection between the IC chip 4 and the printed circuit board 6 is performed by a wire bonding method, a flip chip method in which the pattern surface of the IC chip is opposed to the pattern surface of the printed circuit board 6, or a tab tape method. FIG. 2 (A) shows a wire bonding method, and reference numeral 5 indicates a connecting wire. Although only one IC chip 4 is provided in the IC module 1 in FIGS. 2A and 2B, a plurality of IC chips 4 may be provided. In this case, for example, 1
One IC chip can be provided with a microprocessor function for data processing, and another IC chip can be provided with a memory function for storing data.

Now, FIG. 3A shows an example of the antenna 2. In this example, the antenna 2 is provided as a winding coil in which the conductive wire 9 is wound in a coil shape or a spiral shape. FIG. 3B shows another example of the antenna 2. In this example, a spiral antenna pattern 10 is provided on a printed circuit board 11, and the antenna pattern 1
0 functions as the antenna 2. In this case, the antenna 2 is embedded in the IC module 1 together with the printed circuit board 11. The printed board 11 is formed of, for example, glass epoxy resin. The antenna pattern 10 may be formed by any of etching, plating and printing.

The material of the conductive wire 9 and the antenna pattern 10 is not particularly limited as long as it has sufficient conductivity.
Copper is preferable because it is inexpensive, and gold, silver, carbon, etc. can be used. The antenna 2 is formed so as to form a loop, and its specific shape is changed depending on the wavelength of the electromagnetic wave used for communication. The larger the loop shape is, the more advantageous it is for efficiently inputting and outputting electromagnetic waves. Both ends of the antenna 2 shown in FIGS. 3A and 3B function as electrodes 2a and are electrically connected to the electrodes 7 of the IC module 1. As a result, data can be transmitted and received between the IC module 1 and the external device via the antenna 2.

As shown in FIGS. 1A and 1B, the electrode 2a of the antenna 2 is exposed in the recess 3a of the card base 3. The electrode 2a and the electrode 7 of the IC module 1 are
They are electrically connected inside the recess 3a. The electrodes 2a and the electrodes 7 may be connected to each other by fixing them with a conductive adhesive, soldering, pressure bonding, or simply by bringing them into contact with each other. In the case of contacting the both without fixing them, a connector or a spring made of a conductive rubber may be provided on at least one of the electrode 2a and the electrode 7 to ensure the connection. Further, as described above, the IC module 1 housed in the concave portion 3a of the card base 3 is fixed to the card base 3 with an epoxy-based, urethane-based, or silicon-based adhesive or thermocompression tape. .

B. Manufacturing Method of Embodiment Next, a method of manufacturing the IC card according to the present embodiment will be described. B-1. Outline of Manufacturing Process (1) Embedding Antenna First, as shown in FIGS. 4 (A) and 4 (B), the antenna 2 is embedded inside the card substrate 3 to obtain an IC card manufacturing intermediate 30. The burying method may be an arbitrary method such as a thermal lamination method or an injection molding method as described later. At this time, the electrode 2a of the antenna 2 is exposed inside the recess 3a.

(2) Pattern Printing Next, as shown in FIGS. 5 (A) and 5 (B), a printing layer 12 having a pattern corresponding to the application of the IC card is formed on both sides of the card base 3. The printing method may be any printing method such as an offset printing method, a gravure printing method, or a screen printing method. Here, a protective layer for protecting the surface of the printing layer 12 may be provided. This pattern printing may be performed before embedding the antenna.

(3) Card outline processing In the previous step, when one sheet to be a plurality of IC cards has been formed, thereafter, the IC card is cut into an arbitrary size. This step is unnecessary when the antenna 2 is embedded in the card substrate 3 which has been processed into a predetermined size in advance. The processing method may be an arbitrary processing method such as a punching method or a milling method. (4) Visual inspection of card base Further, visual inspection such as pattern printing status and external dimensions is performed to remove defective products.

(5) Mounting of IC Module Next, as shown in FIG. 6, the IC module 1 is mounted in the recess 3 a of the card base 3. In the example of FIG. 6, the adhesive 13 is applied to the inside of the recess 3a and the conductive adhesive 14 is applied to the electrode 2a of the antenna 2 before mounting. Then, the electrode 7 of the IC module 1 is made to face the electrode 2a of the antenna 2, and as shown in FIGS.
The C module 1 is fitted in the recess 3a. After that, the IC module 1 is fixed to the card base 3 by solidifying the adhesive. In addition, without using the adhesive 13,
The C module 1 may be fixed to the recess 3a by thermocompression bonding tape. Further, the electrode 7 of the IC module 1 and the electrode 2a of the antenna 2 can be connected by various connection methods as described above without using the conductive adhesive 14. (6) Card inspection In this way, the non-contact type IC card shown in FIGS. 1 (A), 1 (B) and 1 (C) is completed. Note that the print layer 12 is not shown in these drawings. After that, for example, a functional test is performed such as whether or not a signal can be transmitted / received to / from the IC module 1 from the external device through the antenna 2.

B-2. Specific Example 1 of Manufacturing Process Next, a specific example of the manufacturing process will be described. In this example, the card base 3 is formed by joining two material sheets forming the card base 3, and at the same time, the antenna 2 is embedded in the card base 3. First, as shown in FIG. 8, the lower surface sheet 15 which is one of the material sheets is formed from a material such as vinyl chloride resin, ABS resin, PET resin, epoxy resin and the like, and the printing layer 12 is provided on one entire surface of the lower surface sheet 15. . In addition, a printed circuit board 11 on which an antenna pattern 10 to be the antenna 2 is formed as shown in FIG. 3 (B) is prepared.

Then, as shown in FIGS. 9A and 9B, recesses 20 and 21 are formed on the surface of the lower surface sheet 15 opposite to the printing layer 12 by counterboring. The concave portion 20 is a portion that constitutes the concave portion 3a that accommodates the IC module 1,
The concave portion 21 is a portion on which the printed circuit board 11 on which the antenna pattern 10 is formed is placed. Both recesses 20,
21 are formed so as to be continuous with each other. FIG.
As shown in (A) and (B), the upper sheet 16 which is the other material sheet is formed from the same material as the lower sheet 15, and the printing layer 12 is also provided on one entire surface of the upper sheet 16. Then, by punching, this top sheet 1
A hole 22 that penetrates 6 is formed. The hole 22 overlaps the above-mentioned recess 20 to form the recess 3a.

Next, an adhesive such as urethane is applied to the concave portion 21 of the lower surface sheet 15, and the printed circuit board 1 is formed thereon.
1 is placed. Then, an adhesive is applied to the surface of the upper surface sheet 16 opposite to the printed layer 12, the upper surface sheet 16 and the lower surface sheet 15 are superposed, and the printed circuit board 11 is sandwiched therebetween. By solidifying these adhesives, the upper surface sheet 16, the printed circuit board 11, and the lower surface sheet 15 are integrated, and the IC card manufacturing intermediate 30 shown in FIGS.
Is obtained. After that, as in the above, the IC module 1 is housed in the recess 3a of the IC card manufacturing intermediate body 30 to complete the IC card. In this manufacturing process, the formation of the card base 3 and the burying of the antenna 2 are simple, and the manufacturing cost is low.

B-3. Concrete Example 2 of Manufacturing Process It is also possible to manufacture the IC card manufacturing intermediate 30 by an injection molding method using a mold as described below, and then complete the IC card. FIG. 12 shows a mold 23 used in this injection molding method. The mold 23 is composed of split molds 24 and 25, and a convex portion 26 for forming the concave portion 3 a of the card base 3 is formed on the inner surface of the split mold 24. Reference numeral 27 indicates an injection port provided between the split molds 24 and 25.

In the molding method of this example, the antenna 2 shown in FIGS. 13A and 13B is embedded in the card substrate 3. The antenna 2 is provided as a spiral antenna pattern 10 formed on the support sheet 17. The support sheet 17 is, for example, a plastic film, and its material is acrylonitrile-styrene, polyvinyl chloride, polyethylene, polypropylene, polyester,
Polycarbonate or the like is used. The antenna pattern 10 may be formed by any of etching, plating and printing.

The support sheet 17 is formed to have the same length and width as the upper surface inside the mold 23. The support sheet 17 has holes 17a formed therein. This hole 1
Reference numeral 7a is a portion forming the concave portion 3a of the card base 3. The electrode 2a of the antenna 2 is projected into the hole 17a. The electrode 2a may be provided by adhering to the antenna 2. In injection molding, first, the support sheet 17 is placed in the split mold 24 of the mold 23. In this case, the convex portion 26 of the split mold 24 is fitted into the hole 17a of the support sheet 17. Then, the split mold 24 and split mold 25 are combined,
Resin, which is a material of the card base 3, is injected from the inlet 27. Then, by solidifying this material, the support sheet 17 is integrated with the material to form the card base 3,
At the same time, the antenna 2 is embedded in the card base 3.

As a result, the same IC card manufacturing intermediate as the IC card manufacturing intermediate 30 shown in FIGS. 5A and 5B is formed. The printed layer 12 of the IC card manufacturing intermediate 30 may be formed thereafter. In addition, the printing layer 12 may be formed on the surface of the support sheet 17 opposite to the support sheet 17 before placing it in the mold 23. In this case, the printing layer 12 may be formed at the same time as the production of the IC card production intermediate body. The print layer 12 is formed on one surface. After that, as in the above, the IC module 1 is housed in the recess 3a of the IC card manufacturing intermediate body 30 to complete the IC card.

At the time of injection molding, one surface of the portion of the electrode 2a of the antenna 2 protruding into the hole 17a is brought into contact with the convex portion 26 of the split mold 24, as shown in FIG. Therefore, the resin does not adhere to this contact surface, and the IC module 1 can be accommodated in the recess 3a in the state as it is. In this specific example, it is possible to form the concave portion 3a for fitting the IC module 1 by the mold 23 at the same time when the antenna 2 is embedded. In addition, the antenna 2 is provided on the support sheet 17, and the support sheet 17 serves as the mold 23.
Since it is engaged with the convex portion 26 formed on the antenna 2, there is no problem that the antenna 2 flows or deforms when the material is injected.

B-4. Modification of Specific Example of Manufacturing Process In Specific Example 1 described above, the lower sheet 15 and the upper sheet 16 are arranged.
Although and are bonded by an adhesive, they may be bonded by a thermal lamination method. Also in this case, the formation of the card base 3 and the embedding of the antenna 2 are simple, and the manufacturing cost is low. Further, in the specific example 1, the recessed portion 3a is formed by performing the counterbore processing on the lower surface sheet 15, but the lower surface sheet 15 may be formed by injection molding and the recessed portion 3a may be provided at the same time as the formation. Further, in the second specific example, the support sheet 17 does not necessarily have to be fixed to the split mold 24 by adhesion or the like, but the adhesive strength is such that it does not hinder the removal of the IC card manufacturing intermediate from the mold 23. The support sheet 17 may be temporarily stopped with a weak adhesive, and then the material may be poured into the mold 23.

C. Effects of the Embodiment According to the present embodiment, after the antenna 2 having a low risk of mechanical and physical damage is embedded in the card base 3, the IC module 1 having a high risk of damage is fitted into the recess 3 a of the card base 3. In this case, the IC module 1 is compared with the case where the IC module 1 is embedded in the card base 3 as in the conventional thermal lamination method or injection molding method.
Is no longer exposed to heat and stress and is expensive I
It is possible to significantly reduce the mechanical and physical damage of the C module 1.

On the other hand, by embedding the antenna 2 in the card base 3 by adhesion or injection molding, even the antenna 2 having a large thickness and a large loop area can be easily arranged in the card base 3. This is clear if the antenna 2 is arranged in the recessed portion.

Further, the antenna 2 is embedded in the card base 3 in advance, and the IC module 1 is fitted into the recess 3a of the card base 3 later so that the antenna 2 and the IC module 1 are connected from the beginning. Card base 3
It is possible to ensure the electrical connection between the two, as compared with the case where they are arranged inside. Moreover, after the card substrate 3 is provided with the printing layer 12 and the antenna 2 is incorporated,
By mounting the C module 1, even if the antenna 2 is broken or the printing is defective before the IC module 1 is mounted, it is possible to remove the defective IC card manufacturing intermediate by inspection. It is possible. Therefore, the expensive IC module 1 is not wasted.

Further, the electrode 2a of the antenna 2 is projected in the recess 3a of the card base 3, and the electrode 7 of the IC module 1 and the electrode 2a of the antenna 2 are connected in the recess 3a. . As a result, the electrical connection work between the IC module 1 and the antenna 2 can be performed easily and reliably.

Further, in the manufactured IC card, FIG.
As shown in (B), the IC module 1 is exposed on the surface of the card substrate 3. As described above, the upper limit of the thickness of the IC card is defined by ISO 10536, but with this configuration, the thickness of the IC module 1 is increased within the limited thickness of the IC card. It becomes possible to do. That is, the IC chip 4 of the IC module 1
Can be increased in thickness, and the mechanical strength can be increased by increasing the thickness of the printed circuit board 6 protecting the IC chip 4 and the resin sealing portion 4a.

D. Example of Change / Modification of IC Card Configuration (1) FIGS. 15A and 15B show an example of modification of the antenna 2.
The antenna 2 is provided as an antenna pattern 10 formed on the support sheet 17 or the printed board 11, and the basic configuration is the same as that shown in FIGS. 13 (A) and 13 (B). However, here, the electrode 2a of the antenna 2 is formed so as to surround almost the entire periphery of the hole 17a.

As a result, the IC module 1 is placed in the hole 17a.
IC module 1 when the resin sealing portion 4a of
The contact property between the electrode 7 formed on the printed circuit board 6 protruding on the peripheral edge of the antenna 2 and the electrode 2a of the antenna 2 is improved.
That is, after the support sheet 17 is embedded in the card substrate 3 to form the IC card manufacturing intermediate 30 (the card substrate 3 is not shown in FIG. 15B), the IC module is provided in the recess 3a. It is possible to improve the contact property between the electrode 7 and the electrode 2a when 1 is fitted. At this time, the resin-sealed portion 4a of the IC module 1 is attached to the antenna 2
Will be surrounded by the electrode 2a.

(2) FIG. 16 shows another modification of the IC card. Here, the IC module 1 is formed in a rectangular parallelepiped shape as a whole. The rectangular parallelepiped IC module 1 may be formed by embedding an IC chip 4 (not shown in FIG. 16) in the same material as the resin sealing portion 4a.
The board on which the IC chip 4 is mounted may be surrounded by a box. It is also possible to mount the IC chip 4 on the lead frame and provide the IC module 1 without providing the printed circuit board. Electrodes 18 are projectingly provided on the two opposite side surfaces of the IC module 1. On the other hand, in the recess 3a of the card base 3, the two electrodes 2 of the antenna 2 are
a is projected. These electrodes 2a are opposed to each other, and the distance between them is slightly smaller than the distance between the end faces of the electrodes 18 of the IC module 1. The electrodes 2a and the electrodes 18 can be provided by gold plating or the like.

In this structure, the IC module 1 is provided with the recess 3
The IC module 1 is sandwiched between the electrodes 2a only by fitting in the electrode 2a of the antenna 2 and the electrode 2a of the antenna 2 and the IC.
Electrical contact with the electrodes 18 of the module 1 can be ensured. Further, even if an adhesive is not used, the IC module 1 is prevented from moving inside the card base 3 due to vibration or the like. As described above, when the IC module 1 is not completely fixed with the adhesive or the like, the IC module 1 can be freely removed from the card base 3.
Thereby, for example, when the IC module 1 fails, it can be replaced with a new one, or when the antenna 2 fails, the IC module 1 can be transferred to another IC card manufacturing intermediate 30. become.

(3) FIG. 17 shows a modification of the IC module 1. In this IC module 1, an electrode portion 8 for directly receiving power from an external device is formed on the upper surface of the printed circuit board 6 (the surface opposite to the resin sealing portion 4a). That is, the IC module 1 has an electrode portion 8 for directly receiving power from an external device, in addition to the electrode 7 for the antenna 2. In this case, the IC module 1
Can also receive power directly from an external device. For example, it is possible to exchange signals with an external device and receive power supply from the external device. In addition to this, the IC module 1 can receive power from an external device via the antenna 2 and can, for example, exchange a signal with the external device. That is, the IC card 1 is used as a so-called hybrid IC card having both advantages of a non-contact type and a contact type.

By preparing the IC card manufacturing intermediate 30 as described above, an IC module of a type suitable for the application of the IC card to be manufactured is selected, and the IC
It can also be said that it can be mounted on the card manufacturing intermediate 30. That is, when manufacturing a non-contact type IC card, a non-contact type IC module having only the electrode 7 for the antenna 2 is selected, and when manufacturing a hybrid type IC card, the electrode 7 for the antenna 2 is selected. Besides, an IC module having an electrode portion 8 for directly receiving power from an external device may be selected.

(4) FIG. 18 shows another IC card. In this IC card, the surface sheet 28 is adhered to one surface of the card base 3 (the surface on which the recess 3a is formed),
Covers module 1. The topsheet 28 can be provided by adhesion, for example. (5) The above-mentioned IC cards all have the antenna 2 built-in, but the present invention is not limited to this.
IC in which a coil for supplying electric power to the C module 1 is embedded
It can also be applied to cards. In this case, the shape of the coil is similar to that of the antenna 2, and the same effect as described above can be obtained. It is also possible to apply to an IC card provided with both a coil for power supply and an antenna for transmitting and receiving signals.

[0049]

EXAMPLE As an example, I corresponding to the above specific example 1
I made a C card. First, on a white vinyl chloride sheet having a thickness of 450 μm (lower surface sheet 15), a print layer 12 is provided by offset printing so as to have a film thickness of 1 μm, and a protective layer made of epoxy resin is formed thereon by offset printing. The entire surface of the sheet was provided so as to have a thickness of 2 μm. Further, an antenna pattern was provided by etching on a printed circuit board material in which copper foil was attached to both surfaces of a glass epoxy resin to obtain an antenna shown in FIG. 3 (B).

Then, as shown in FIGS. 9A and 9B, the IC module 1 and the printed circuit board 11 are fitted to each other by counterbore processing on the surface of the lower surface sheet 15 opposite to the printed layer 12. The recesses 20 and 21 were formed. Also, thickness 1
The pattern printing layer 12 is provided on the 50 μm white vinyl chloride sheet by offset printing so that the film thickness is 1 μm.
A protective layer made of an epoxy resin was provided on the entire surface of the sheet by offset printing so as to have a film thickness of 2 μm, and a top sheet 16 was obtained as shown in FIGS. 10 (A) and 10 (B). Then, the hole 22 that constitutes the recess 3a is formed by punching.
Was formed.

Next, a urethane type adhesive was applied to the concave portion 21 of the lower surface sheet 15 to adhere the printed board 11.
Further, an adhesive was applied to the surface of the upper surface sheet 16 opposite to the printed layer 12, the upper surface sheet 16 and the lower surface sheet 15 were superposed, and the printed board 11 was sandwiched therebetween. By solidifying these adhesives, the upper surface sheet 16, the printed circuit board 11, and the lower surface sheet 15 are integrated, as shown in FIG.
The intermediate 30 for manufacturing an IC card shown in (A) and (B) was obtained. After that, as shown in FIG. 6, the conductive adhesive 14 was applied to the electrode 2a in the recess 3a of the card base 3, and the epoxy adhesive 13 was applied to the other part of the recess 3a. And
As shown in FIG. 7, the IC module 1 was fitted in the recess 3a to complete the IC card.

[0052]

As described above, according to the present invention,
It is possible to reduce damage to the IC module during the manufacture of the card, and it is possible to use an antenna or coil having a large area even for an IC card having a limited size. Further, in the present invention, the type of IC card to be manufactured can be easily changed.

[Brief description of drawings]

FIG. 1A is a plan view showing an IC card according to an embodiment of the present invention, FIG. 1B is a sectional view taken along the line BB ′ of FIG.
FIG. 8A is a sectional view taken along the line CC ′ of FIG.

FIG. 2A is a front view showing the IC module housed in the IC card, and FIG. 2B is a bottom view of the IC module.

3A is a plan view showing an example of an antenna embedded in the IC card, and FIG. 3B is a plan view showing another example of the antenna.

FIG. 4A is a plan view showing a card base in which the antenna of the IC card is embedded, and FIG. 4B is a sectional view taken along the line BB ′ of FIG.

5A is a plan view showing an IC card manufacturing intermediate in which the printing layer 12 is formed on the IC card of FIG. 4A, and FIG.
It is a BB 'line arrow sectional view of (A).

FIG. 6 shows an intermediate product for manufacturing an IC card shown in FIGS.
It is sectional drawing which shows the state which embeds a C module.

7A is a plan view showing a completed IC card after the state of FIG. 6, and FIG. 7B is a sectional view taken along the line BB ′ of FIG.

FIG. 8: I used in an example of a method for manufacturing an IC card
It is a front view which shows one of the two material sheets which make up the card base of a C card.

9 (A) shows an antenna and I on the material sheet of FIG.
FIG. 4 is a plan view showing a state in which a recess for burying a C module is formed, and FIG. 6B is a sectional view of FIG.

10A is a plan view showing a material sheet that is joined to the material sheet of FIG. 8 to form a card base, and FIG. 10B is a sectional view of FIG.

FIG. 11 is a cross-sectional view showing a state in which the material sheet shown in FIG. 8 and the material sheets shown in FIGS. 10A and 10B are joined to form a card base.

FIG. 12 is a cross-sectional view showing a mold used in another example of the method for manufacturing an IC card.

13A is a sectional view showing an example of an antenna arranged in the mold of FIG. 12, and FIG. 13B is a bottom view showing the antenna.

14 is a cross-sectional view showing a state where the antenna shown in FIGS. 13A and 13B is arranged in the mold of FIG.

15A is a plan view showing another example of an antenna embedded in an IC card, and FIG. 15B is a sectional view taken along the line BB ′ of FIG.

FIG. 16 is a cross-sectional view showing an IC module forming another IC card and the vicinity of the recess of the card base.

FIG. 17 is a front view showing another example of an IC module that can be housed in an IC card.

FIG. 18 shows a modified example of the IC card, where (B) is a cross-sectional view corresponding to the cross section taken along the line BB ′ of FIG. 1 (A), and (C) is C- of FIG. 1 (A). FIG. 9 is a cross-sectional view corresponding to a cross section taken along line C ′.

[Explanation of symbols]

1 IC module, 2 antenna, 2a electrode, 3
Card base, 3a concave portion, 4 IC chip, 4a resin sealing portion, 6 printed circuit board, 7 electrodes (electrical contact),
8 Electrode Part (Electrical Contact), 15 Lower Sheet (Material Sheet), 16 Upper Sheet (Material Sheet), 17 Support Sheet (Support Member), 18 Electrode (Electrical Contact), 23
Type, 30 IC card manufacturing intermediate

Claims (10)

[Claims] 1. A flat card base having a recess, an IC module fitted in the recess for processing data, and embedded in the card base and electrically connected to the IC module. Card provided with an antenna or a coil. 2. An electric contact of the antenna or coil is exposed in the recess, and the IC is formed in the recess.
The IC card according to claim 1, wherein a module is electrically connected to the antenna or the coil. 3. A substrate having electrical contacts to the antenna or coil is projected on the periphery of the IC module, and when the IC module is fitted in the recess, the electrical contacts of the antenna or coil are provided. Is arranged so as to surround the IC module and come into contact with the electrical contact of the IC module provided on the substrate.
C card. 4. The IC module can be pulled out from the recess.
The IC card according to any one of 1. 5. The IC module according to claim 1, further comprising an electrical contact for directly receiving power from an external device, in addition to an electrical contact for the antenna or the coil. IC card. 6. A flat card base having a recess formed therein, and an antenna or coil embedded in the card base and having electrical contacts exposed in the recess, wherein data processing is performed in the recess. An intermediate body for manufacturing an IC card, wherein an IC module for carrying out the above is fittable. 7. A flat card base having a recess, an IC module fitted in the recess for processing data, and embedded in the card base and electrically connected to the IC module. A method of manufacturing an IC card including an antenna or a coil, wherein the antenna or coil is embedded in the card base, the IC module is arranged in the recess, and the IC module and the antenna or coil are connected. A method of manufacturing an IC card, comprising: 8. The antenna or coil is embedded in the card base by sandwiching the antenna or coil between two material sheets forming the card base and bonding the material sheets to each other. The method for manufacturing an IC card according to claim 7. 9. The antenna or coil is placed in a mold, and the antenna or coil is embedded in the card base by pouring and solidifying the material of the card base into the mold. I according to claim 7.
C card manufacturing method. 10. The antenna or coil is formed on the surface of a support member, the antenna or coil is placed together with the support member in a mold, and the material of the card substrate is injected into the mold and solidified. 8. The method of manufacturing an IC card according to claim 7, wherein the antenna or the coil is embedded in the card base together with the supporting member.