JPH11285887A - Method for removing pollutant - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove, without damaging a workpiece, a pollutant (byproduct) firmly stuck to the workpiece at the time of abrasion, film-forming or other working which is performed by emitting a laser beam to resin. SOLUTION: In forming plural grooves 2 in a workpiece (base material) 1 made of resin by abrasion or other working which is performed by irradiation of a laser beam, a vibration block 11 connected to a piezo-actuator 12 is abutted on the workpiece 1, in which the byproduct (pollutant) 3 formed in accordance with the working is stuck to the inside of the groove 2 or its wall part 2a, so that the workpiece 1 is vibrated, with a pollutant 3 separated from it; then, by blowing off nitrogen gas 17, the pollutant 3 is completely removed from the workpiece 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to contaminants (by-products) adhering to the surface of a workpiece due to ablation, film formation, or other processing in which a resin or the like is irradiated with a laser beam. And a method for removing contaminants.

[0002]

2. Description of the Related Art When a resin is irradiated with a laser beam to perform ablation processing, film formation or other processing,
The resin material is decomposed by the laser beam, and a part of the resin material becomes a contaminant which is a by-product such as carbon or carbide and adheres and deposits on and around the irradiated portion. These contaminants hindered the processing of fine shapes, and further caused problems such as exfoliation and dust.

Therefore, various methods for removing contaminants adhering to the surface of a workpiece (substrate) have been conventionally proposed, and the following methods have been proposed. (1) Cleaning with a liquid that dissolves contaminants (2) Cleaning with an aqueous solution containing a surfactant (3) Ultrasonic cleaning (4) UV / O ₃ cleaning (5) Plasma asher (6) Mechanical shaving (Or wipe)

[0004]

However, in the above-described conventional removing method, the workpiece (substrate) is not provided.
In particular, in the case of a top plate or the like constituting a liquid jet recording head, the member to be processed is made of resin, and the processed shape is very fine, so that the following problem has occurred.

[0005] That is, the above-described cleaning with a liquid that dissolves contaminants involves dissolving the contaminants with the cleaning liquid.
This method can be used only when the member to be processed is not damaged. Cleaning with an aqueous solution containing a surfactant is effective only when the contaminant is oil or protein. In addition, ultrasonic cleaning cannot be employed when the workpiece is made of a resin or metal having a fine structure because the fine structure of the workpiece is destroyed by ultrasonic waves.
In the case of UV / O ₃ cleaning or plasma asher, when the workpiece is a resin, the workpiece is damaged. In addition, mechanical shaving (or wiping) also damages a workpiece such as a scratch.

Accordingly, the present invention has been made in view of the above-mentioned unsolved problems of the prior art, and has been made in consideration of the problems such as ablation, film formation, and other processing in which a resin is irradiated with a laser beam to perform processing. When the contaminants (by-products) firmly adhered to the workpiece are exfoliated by applying vibration or laser irradiation, the contaminants are separated, and the gas is blown to damage the workpiece. It is an object of the present invention to provide a method for removing contaminants that can remove contaminants without any problem.

[0007]

In order to achieve the above object, a method for removing contaminants according to the present invention comprises: vibrating a substrate to which contaminants are adhered; The method is characterized in that a contaminant is separated from a base material by irradiating a laser beam, and then the gas is blown to remove the contaminant.

Further, the method for removing contaminants according to the present invention comprises:
Irradiation of resin with laser light for processing Ablation that causes contaminants to adhere to the surface of the workpiece with laser light having a higher energy density than the laser light used for the ablation. The material is exfoliated, and then gas is blown to remove contaminants.

In the method for removing contaminants according to the present invention, ablation processing by laser light irradiation and peeling of the contaminants by laser light irradiation are alternately performed a plurality of times, and then the gas is blown to remove the contaminants. It is characterized by doing.

In the method for removing contaminants according to the present invention,
Preferably, the vibration of the substrate is performed using a piezo element.

In the method for removing contaminants of the present invention, it is preferable to use excimer laser light as laser light.

In the method of removing contaminants according to the present invention, the gas blown for removing contaminants is preferably nitrogen gas.

[0013]

[Function] A workpiece (substrate) to which contaminants (by-products) generated by ablation, film formation, or other processing performed by irradiating a laser beam to a resin or the like adhere. Vibration or laser light irradiation to separate contaminants from the workpiece (substrate),
By spraying gas such as nitrogen gas to remove contaminants, without damaging the processed part of the workpiece,
Contaminants can be removed and a clean processed surface can be obtained.

Further, with the ablation for processing by irradiating the resin with excimer laser light, a laser light having a higher energy density than the laser light used for the ablation is applied to the surface of the workpiece to which contaminants are attached. After removing the contaminants from the workpiece, the contaminants can also be removed by blowing gas,
Alternatively, ablation processing by laser light irradiation and separation of contaminants by laser light irradiation are alternately performed a plurality of times, and thereafter, the contaminants can be removed by blowing gas.

[0015]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic view showing a first embodiment of a method for removing contaminants according to the present invention in the order of steps. In FIG. 1, when a plurality of recesses or grooves 2 are formed on a resin-made workpiece (base material) 1 by ablation processing by laser beam irradiation or other processing, by-products generated by the processing are formed. As shown in FIG. 1 (a), the small fragments (contaminants) 3 are adhered and deposited on the processed surface and firmly adhere to the inside of the groove 2 and the groove wall (non-groove) 2a.

Therefore, in the present embodiment, first, in order to separate the contaminant 3 from the workpiece 1, the groove wall 2a of the processing surface of the workpiece 1 to which the contaminant 3 is firmly adhered.
The exciter block 11 is brought into contact with the surface (see FIG. 1B). The excitation block 11 is connected to a piezo actuator 12 having a piezo element, and the piezo actuator 12 is connected to a signal generator 14 via an amplifier 13 as shown in FIG. The piezo actuator 12 is driven by an electric signal output from a signal generator 14 to cause the vibration block 11 to vibrate and to further vibrate the workpiece 1. Due to this vibration, the contaminant 3 firmly attached to the workpiece 1 is removed.
From the groove portion 2 and the groove wall portion 2a, or partly in a branch shape. This state is exemplarily shown in FIG. 1C and FIG.

Then, as shown in FIG. 1 (c), when nitrogen (N ₂ ) gas is blown onto the processing surface of the workpiece 1, the contaminants are peeled off and partially peeled off. The contaminants 3 are blown off and the contaminants are
Can be completely removed.

In the present embodiment, the amount of vibration applied to the workpiece 1 can be easily and freely adjusted by changing the voltage of an electric signal to the piezo actuator 12, and the processed shape is extremely large. Even in a fine case, it is possible to remove contaminants without damaging the processed part.

Further, even if the contaminant adhering portion extends not only on the surface but also on the inside of a very fine groove, the contaminant can be blown off by blowing nitrogen gas after vibrating, so that the entire area can be blown. Pollutants can be removed from the wastewater.

Further, the use of nitrogen gas having high purity can prevent dust from being attached by spraying. The gas used for spraying may be either a simple substance or a mixture, and it is effective to use another gas such as air.Furthermore, if the gas is passed through a filter or the like, it is possible to prevent dust from adhering to dust. Can be.

As described above, the vibrating block is brought into contact with the workpiece (substrate) to which the contaminant adheres, and the contaminant is separated by vibrating the workpiece (substrate), and then a gas is sprayed. Thus, the contaminants can be completely removed from the workpiece (substrate).

Next, the present embodiment will be further described by taking a resin top plate constituting a liquid jet recording head as an example of a member to be processed.

As shown in FIG. 3A, the resin top plate constituting the liquid jet recording head is provided with only a groove serving as a common liquid chamber 32 by injection molding or the like. It is resin-molded in a shape 30a not provided,
By irradiating the resin molded top plate 30a with a laser beam, a plurality of ink flow channel grooves 31 as shown in FIG. 3B are formed. In addition, top plate 3
Although the material of No. 0 was polysulfone, other resin materials such as polyethersulfone, polyphenylene oxide, and polypropylene may be used. In FIG. 3B, d is the depth of the ink flow channel groove 31, and h and ho
Is the width of the ink flow channel groove and the width of the groove wall (non-groove portion),
p is the pitch of the ink flow channel.

A laser processing apparatus used for processing the ink flow channel 31 in the top plate 30 as a member to be processed will be described with reference to FIG.

In FIG. 4, the laser processing apparatus 100
A workpiece W made of resin or the like is irradiated with excimer laser light to form the workpiece W into a predetermined shape, and 101 is an excimer laser oscillator as a laser light source that emits excimer laser light. Its outgoing optical axis a
A moving stage 103 that can move in a horizontal direction orthogonal to the horizontal direction is provided on an apparatus frame 104. A workpiece W is mounted on the moving stage 103 via a jig (not shown) so that a processing surface is orthogonal to the optical axis a. And an optical system 105 for shaping the laser light on the optical axis a of the laser light oscillated from the excimer laser oscillator 101 and uniformly irradiating the mask 106 with the laser light on the device frame 104; A mask 106 on which a processing pattern provided with a laser beam transmitting region corresponding to a predetermined shape such as a groove or a hole to be processed is formed, and a mask processing pattern image emitted through the mask 106 is applied to the workpiece W. Projection optical systems 107 for projecting are sequentially arranged.

In order to measure the processing position of the workpiece W on the moving stage 103, illumination optical systems 108, 110, 110 and measuring systems 111, 111 are provided. Is used as a sensor, which is composed of a lens barrel, a pair of measuring instruments opposed to the objective lens via an auto-focusing means, and two mirrors arranged on the optical axis a. Is built into the measuring instrument. The illumination optical system 108 is disposed between the workpiece W and the projection optical system 107, irradiates light from a light source from a direction orthogonal to the optical axis a, and uses the air cylinder 109 by the air cylinder 109 only during measurement. Light is placed on the optical axis a by a mirror that moves upward, and is irradiated toward the workpiece W.

The measurement results by the measuring systems 111, 111 are as follows:
It is provided to the image processing system 116, and the result of the signal processing in the image processing system 116 is sent to the control system 117. Control system 117
Calculates the moving distance of the workpiece W based on the measurement result, and outputs the moving stage 103
The stage is moved.

The output of the excimer laser oscillator 101 is measured by the power sensor 113 via the half mirror 114, and this output information is fed back to the control system 117 and applied to the excimer laser oscillator 101 via the interface 115 and the like. The output of the excimer laser oscillator 101 can be adjusted by changing the voltage or the like.

The resin molded top plate 30 (FIG. 3A)
When the plurality of ink flow channel grooves 31 (FIG. 3B) are formed in the laser processing apparatus 10,
5 and a transparent portion 36 which is a laser light transmitting region and a non-transparent portion 37 which is a laser light non-transmitting region corresponding to the ink flow channel groove 31 to be processed, as shown in FIG. 3 having processing pattern provided
5 is set, and an excimer laser beam L is irradiated. As a result, the processing surface of the top plate 30 is disassembled and removed by the laser light L passing through the transparent portion 36 of the mask 35, and the ink flow channel 31 corresponding to the processing pattern of the mask 35 is processed. At the time of irradiation with the excimer laser light L, the excimer laser light L emitted from the laser oscillator 101 is processed on the processing surface by controlling the laser oscillator 101 and the optical system device by the control system 117 of the laser processing apparatus 100 shown in FIG. Laser energy density at 700 mJ / cm ² · pu
The laser frequency is set to 100 Hz, and 230 pulses are irradiated. As a result, an ink flow channel groove 31 as shown in FIG. 3B is formed in the resin top plate 30 as a workpiece, the depth d of the ink flow channel is 40 μm, and the width of the ink flow channel is h. Is 3
4 μm, the width ho of the ink flow channel groove wall (non-groove portion) is 8 μm,
The pitch p was 42 μm, and 336 lines could be arranged.

However, as shown in FIG. 6, the small debris (contaminant) 33, which is a by-product generated by the ablation process by the laser beam irradiation, adheres and accumulates on the processed surface, and the ink flow path groove is formed. 31 and is firmly fixed to the groove wall portion (non-groove portion) 31a.

Therefore, according to the present invention, as shown in FIG. 1B and FIG. 2, the groove wall portion 31 of the processing surface of the top plate 30 which is the workpiece to which the contaminant 33 is firmly adhered.
The vibration block 11 is vibrated by bringing the vibration block 11 into contact with the vibration block 11a and applying an electric signal from the signal generator 14 to the piezo actuator 12 connected to the vibration block 11, thereby causing the top plate 30 Vibration. Due to this vibration, the contaminants 3 strongly adhered to the top plate 30
As shown in FIG. 1C and FIG. 7, 3 is peeled off from the ink passage groove 31 and the groove wall 31a of the top plate 30, or is partially peeled off in a branch shape.

Thereafter, when nitrogen gas is blown onto the laser-processed surface of the top plate 30, the separated contaminants and the contaminants 33 partially separated in a branch shape are blown off, and the contaminants are completely removed. Can be.

In this embodiment, the vibration applied to the top plate is
The amount of vibration can be easily and freely adjusted by changing the voltage of the electric signal to the piezo actuator 12, and even if the processing shape is very fine, the contaminant is peeled off without damaging the processing portion. It is possible to do.

Further, the ink flow channel groove on the top plate of the liquid jet recording head has a very fine groove shape, and the contaminant adhering portion extends not only on the surface but also inside the very fine groove. However, by blowing nitrogen gas after vibration, it is possible to blow off pollutants,
Contaminants can be removed from all areas.

As described above, the vibrating block is brought into contact with the workpiece to which the contaminant has adhered, the contaminant is peeled off by vibrating the workpiece, and then the gas is blown to completely remove the contaminant. Can be removed.

Next, a second embodiment of the method for removing contaminants according to the present invention will be described.

In this embodiment, as shown in FIG. 8, instead of vibrating the workpiece, the laser beam, particularly the laser beam having a high energy density, is used to irradiate the contamination on the workpiece. The substance is exfoliated and then a gas such as nitrogen gas is blown to completely remove the contaminants.

In the laser processing apparatus 100 shown in FIG. 4, a laser beam L is irradiated on a resin top plate 30 which is a member to be processed, using a mask 35 shown in FIG. By controlling the laser oscillator 101 and the optical system device by the control system 117, the laser light L is used to convert the excimer laser light L emitted from the laser oscillator 101 into a laser energy density of 700 mJ / cm ² on the processing surface.
・ Pulse, the frequency of the laser is 100 Hz, and 230 pulses are irradiated. Thereby, as described in the first embodiment, the resin top plate 30, which is the workpiece, is
(B), the depth d of the ink flow channel is 40 μm, the width h of the ink flow channel is 34 μm,
The width ho of the ink flow channel groove wall (non-groove portion) is 8 μm, and the pitch p
Is 42 μm, and 336 can be arranged.

Then, small fragments (contaminants) 33 composed of by-products generated by ablation processing by laser beam irradiation are shown in FIG. 8B in the same manner as described in the first embodiment. Then, the ink is deposited on the processing surface, and is formed in the ink flow channel 31 and the groove wall (non-groove) 3.
1a is firmly fixed.

Therefore, in this embodiment, the laser processing apparatus 100 controls the laser oscillator 101 and the optical system apparatus by the control system 117 so that the excimer laser beam L emitted from the laser oscillator 101 is emitted from the laser beam on the processing surface. The energy density is increased to 1 J / cm ² · pulse, the laser frequency is set to 100 Hz, and 15 pulses are irradiated. At this time, as shown in FIG. 8B, it is possible to irradiate the laser beam L to both the groove 31 and the groove wall 31a (that is, the portion where the contaminant is attached) by changing the mask. The laser beam L is irradiated using a mask 35a that can be formed.

Thus, even when the resin layer that can be ablated by the excimer laser beam is covered with the contaminant 33 that is not ablated by the excimer laser beam, as shown in FIG. By increasing the energy density of the laser beam and irradiating it, the power of the excimer laser beam can be transmitted to the resin layer 34 shown in FIG. Therefore, the layer of the contaminant 33 is thin and the energy density of the laser is 1
Since it is increased to J / cm ² · pulse, the resin layer 34 near the surface undergoes ablation as shown in FIG. 8B. As a result, the resin material of the resin layer 34 is decomposed into minute fragments composed of by-products such as carbon or carbide,
The spout is ejected at a high speed from the processing surface, and the contaminant 33 is peeled off at the time of ejection of the minute fragments, and the state shown in FIG. 8C and FIG.

Next, as shown in FIG. 8C, when nitrogen gas 17 is blown onto the laser-processed surface of the top plate 30,
As described in the first embodiment, the separated contaminants and the partially contaminated contaminants 33 are blown off, and the contaminants can be completely removed.

In this embodiment, the movement of the mask, the energy density of the laser beam, the frequency, the number of pulses, and the like can all be controlled by the control system of the laser processing apparatus. By changing these parameters, the re-ablation amount of the resin layer 34 shown in FIG. 8B can be easily and freely adjusted, and even if the shape of the workpiece is fine, It is possible to strip contaminants with a very small amount of reablation so as not to damage the shape.

Further, also in the present embodiment, the ink flow path groove on the top plate of the liquid jet recording head has a very fine groove shape, and the contaminant adhering portion is not only on the surface but also inside the very fine groove. Even if it spreads to, by irradiating a laser beam with high energy density and then blowing nitrogen gas, it is possible to blow off pollutants,
Contaminants can be removed from all areas. In addition, the use of high-purity nitrogen gas can prevent dust from being attached by spraying, and the gas used for spraying may be either a single substance or a mixture, and is effective even when other gases such as air are used. It is. Further, if the gas is passed through a filter or the like, adhesion of dust due to gas blowing can be prevented.

Further, in the laser irradiation after the contaminant is attached, the contaminant can be peeled off even if the irradiation area is any part of the groove, the non-groove or the like of the workpiece, or the whole area. .

As described above, the contaminant is completely removed by re-irradiating the portion of the workpiece to which the contaminant has adhered with laser light having a high energy density, and then by blowing gas. Can be removed.

Next, a third embodiment of the method for removing contaminants according to the present invention will be described with reference to FIG.

In this embodiment, the processing amount of the ablation processing by laser beam irradiation is divided to reduce the amount of contaminants adhering with each ablation processing, and further, after each ablation processing, The contaminants adhered to the workpiece are peeled off by light irradiation, and thereafter, a gas such as nitrogen gas is blown to completely remove the contaminants.

In the laser processing apparatus 100 shown in FIG. 4, as shown in FIG. 9, using a mask 35 (a mask similar to the mask 35 shown in FIG. 5 and FIG. By controlling the laser oscillator 101 and the optical system device by the control system 117 with respect to the resin-made top plate 30, the excimer laser beam L emitted from the laser oscillator 101 is changed to a laser energy density of 700 mJ / cm ² · puls, laser frequency 10
At 0 Hz, 117 pulses are irradiated. The groove that has been ablated by the irradiation of the laser beam is shown by a chain line 31x in FIG. Small fragments (contaminants), which are by-products generated by the ablation processing by the irradiation of the laser beam, adhere to and accumulate on the processing surface and adhere to the inside of the groove and the groove wall (non-groove part). By reducing the amount of processing
Low amount of pollutants.

Next, excimer laser light having the same laser energy density of 700 mJ / cm ² · pulse is irradiated to both the groove portion and the groove wall portion (ie, the portion where the contaminant is adhered) by changing the mask, by 8 pulses. . Then, even if the resin layer that can be ablated by the laser light is covered with a contaminant that is a substance that is not ablated by the excimer laser light, even if the amount of the contaminant attached is small, without increasing the power of the excimer laser light, The power passes through the contaminants to the resin layer near the surface, which causes ablation,
The resin material of this resin layer is decomposed into fine fragments made of carbon or carbide, etc., and is ejected at a high speed from the processing surface. At the time of ejection of the small fragments, contaminants are peeled off, and the state shown in FIG. 7 is obtained.

Then, the mask is returned to the groove processing again,
Similar laser energy density of 700 mJ / cm ² · pulse
Then, 117 pulses are irradiated. The groove ablated by the laser beam irradiation again is shown by a dashed line 31y in FIG. Further, by changing the mask, both the groove portion and the groove wall portion (that is, the portion to which the contaminant is adhered) are similarly irradiated with eight pulses to strip the contaminant.

In this manner, an ink flow channel 31 as shown in FIG. 3B is formed on the resin top plate 30 as a member to be processed, the ink flow channel has a depth d of 40 μm, and the ink flow channel has a depth d of 40 μm. The flow channel groove width h is 34 μm, and the width of the ink flow channel groove wall (non-groove portion) ho
Is 8 μm and the pitch p is 42 μm, and 336 can be arranged.

Next, when nitrogen gas is blown onto the laser-processed surface of the top plate 30, the separated contaminants and the contaminants separated in a partial branch are blown off, and the contaminants are completely removed. be able to.

Also in this embodiment, the movement of the mask, the energy density of the laser beam, the frequency, the number of pulses, and the like can all be controlled by the control system of the laser processing apparatus.

In this embodiment, the processing amount of the groove is divided into two times, and the laser irradiation on the contaminant adhering portion is also performed twice. However, these may be performed once or more than once. And control the amount of contaminants attached.

Further, by changing these parameters, the amount of ablation can be easily and freely adjusted, and even if the processing shape is fine, the contaminant is peeled off so as not to damage the processing portion. It is possible to do.

Further, also in the present embodiment, the ink flow channel groove on the top plate of the liquid jet recording head has a very fine groove shape, and the contaminant adhering portion is not only on the surface but also inside the very fine groove. Even if it spreads out, the pollutant can be blown off by blowing nitrogen gas, and the pollutant can be removed from the whole area.
In addition, by using high-purity nitrogen gas, it is possible to prevent dust from being attached by spraying. The gas used for spraying may be either a simple substance or a mixture, and it is effective to use another gas such as air.Furthermore, if the gas is passed through a filter or the like, it is possible to prevent dust from adhering to dust. Can be.

Further, in the laser irradiation after the contaminant is adhered, the contaminant can be peeled off even if the irradiation area is any part of the groove portion, the non-groove portion or the like of the workpiece, or the entire region. .

As described above, the processing amount of the ablation processing by laser light irradiation is divided to reduce the amount of contaminants adhering at one time, and the laser light is irradiated to the contaminant adhering portion after each ablation processing. Thus, the contaminants adhered to the workpiece can be peeled off, and then the gas is blown, whereby the contaminants can be completely removed.

[0061]

Since the present invention is constructed as described above, it adheres firmly to the surface of the member to be processed by ablation, film formation or other processing in which a resin or the like is irradiated with a laser beam. Vibration or laser irradiation is applied to the contaminants (by-products) to separate the contaminants and spray gas to remove the contaminants without damaging the processed part of the workpiece. It can be removed and a clean processed surface can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a first embodiment of a method for removing contaminants according to the present invention in the order of steps.

FIG. 2 is a schematic diagram of a vibration device according to a first embodiment of the present invention.

3A and 3B show the shape of a resin top plate constituting a liquid jet recording head as a workpiece to which the present invention is applied, and FIG.
FIG. 3 is a perspective view of a resin-formed top plate before processing, and FIG. 4B is a perspective view of a top plate with processed ink flow channel grooves.

FIG. 4 is a schematic configuration diagram of a laser processing apparatus.

FIG. 5 is a schematic diagram showing a processing mode of a resin top plate by irradiating a laser beam through a mask.

FIG. 6 is a schematic view showing a state in which a contaminant (by-product) generated by processing by laser light irradiation adheres to a processed surface.

FIG. 7 is a schematic view exemplarily illustrating a state of a separated contaminant.

FIG. 8 is a schematic diagram illustrating steps of ablation processing by laser beam irradiation, peeling of a contaminant, and removal of a contaminant based on a second embodiment of the contaminant removing method according to the present invention.

FIG. 9 is a schematic diagram illustrating a state in which the processing amount of the ablation processing by laser light irradiation is divided into two and processed based on the third embodiment of the method for removing contaminants according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Processed member (base material) 2 Groove part 3 Contaminant (by-product) 11 Vibration block 12 Piezo actuator 13 Signal generator 17 Gas (nitrogen gas) 30 (made of resin) Top plate 31 Ink channel groove 33 Contaminant 35, 35a Mask 100 Laser processing apparatus 101 (Excimer) laser oscillator 103 Moving stage 106 Mask 107 Projection optical system 117 Control system

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masaki Inaba 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Toshinori Hasegawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inside (72) Inventor Masafumi Takimoto 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Masaaki Furukawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc.

Claims (8)

[Claims] 1. A method for removing a contaminant, comprising: vibrating a substrate to which the contaminant has adhered to separate the contaminant from the substrate; and then blowing the gas to remove the contaminant. 2. The method for removing contaminants according to claim 1, wherein the substrate is vibrated using a piezo element. 3. A method for removing contaminants, comprising: irradiating a laser beam to a substrate to which contaminants have adhered to separate the contaminants from the substrate; and then blowing the gas to remove the contaminants. Method. 4. The contaminant according to claim 1, wherein the contaminant is a by-product adhering to the surface of the member to be processed by ablation for performing processing by irradiating the resin with laser light. The method for removing contaminants according to claim 1. 5. A laser beam having a higher energy density than the laser beam used for the ablation is applied to the surface of the workpiece to which the contaminant adheres in accordance with the ablation for performing the process by irradiating the resin with the laser beam. A method for removing contaminants, comprising removing contaminants from a workpiece and then blowing the gas to remove the contaminants. 6. Removal of contaminants, wherein ablation processing by laser light irradiation and peeling of contaminants by laser light irradiation are alternately performed a plurality of times, and thereafter, the gas is blown to remove the contaminants. Method. 7. The method for removing contaminants according to claim 3, wherein an excimer laser beam is used as the laser beam. 8. A gas blown to remove contaminants is nitrogen gas.
The method for removing contaminants according to any one of claims 1 to 6.