JPH0282066U - - Google Patents
Info
- Publication number
- JPH0282066U JPH0282066U JP16166088U JP16166088U JPH0282066U JP H0282066 U JPH0282066 U JP H0282066U JP 16166088 U JP16166088 U JP 16166088U JP 16166088 U JP16166088 U JP 16166088U JP H0282066 U JPH0282066 U JP H0282066U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit boards
- fixed
- tapping screws
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010079 rubber tapping Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は、本考案の結合用パターンで、Ａは、
ガラスエポキシ基板の半田面パターン、Ｂは、低
誘電率基板の部品面パターンである。第２図は、
両基板の結合順を示す斜視図。第３図は、両基板
の結合状態を示す部分断面図である。第４図は、
従来のハトメによる両基板の結合状態を示す部分
断面図である。
１……ねじ締め用スルーホール、２……半田上
げ用スルーホール、３……レジスト、４……ねじ
挿通用スルーホール、５……半田上げ用スルーホ
ール、６……結合パターン、７，９……スルーホ
ールの内径、８……スルーホール配置のピツチ径
、１０……ガラスエポキシ基板、１１……低誘電
率基板、１２……タツピングねじ、１３……両基
板の接触面、２０……半田、３０……ハトメ。
Figure 1 shows the bonding pattern of the present invention, where A is
The solder surface pattern of the glass epoxy substrate, B is the component surface pattern of the low dielectric constant substrate. Figure 2 shows
FIG. 3 is a perspective view showing the order in which both substrates are bonded. FIG. 3 is a partial cross-sectional view showing the bonding state of both substrates. Figure 4 shows
FIG. 2 is a partial cross-sectional view showing a state in which both substrates are joined by a conventional eyelet. 1... Through-hole for screw tightening, 2... Through-hole for soldering, 3... Resist, 4... Through-hole for screw insertion, 5... Through-hole for soldering, 6... Bonding pattern, 7, 9 ... Inner diameter of through hole, 8 ... Pitch diameter of through hole arrangement, 10 ... Glass epoxy substrate, 11 ... Low dielectric constant substrate, 12 ... Tapping screw, 13 ... Contact surface of both substrates, 20 ... Handa, 30...grommets.
Claims (1)
該二枚のプリント基板をタツピングねじにより固
定し、該タツピングねじの頭部周辺近傍の前記二
枚のプリント基板に複数個の半田上げ用のスルー
ホールを設け、該部分を半田付けして固定したこ
とを特徴とするプリント基板の結合構造。 In a structure that connects two printed circuit boards,
The two printed circuit boards were fixed with tapping screws, a plurality of through holes for soldering were provided in the two printed circuit boards near the heads of the tapping screws, and the parts were soldered and fixed. A printed circuit board bonding structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16166088U JPH0282066U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16166088U JPH0282066U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282066U true JPH0282066U (en) | 1990-06-25 |
Family
ID=31444798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16166088U Pending JPH0282066U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282066U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191010A (en) * | 1992-01-13 | 1993-07-30 | Furukawa Electric Co Ltd:The | Large current circuit board |
-
1988
- 1988-12-13 JP JP16166088U patent/JPH0282066U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05191010A (en) * | 1992-01-13 | 1993-07-30 | Furukawa Electric Co Ltd:The | Large current circuit board |
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