JPS6350169U - - Google Patents
Info
- Publication number
- JPS6350169U JPS6350169U JP14375786U JP14375786U JPS6350169U JP S6350169 U JPS6350169 U JP S6350169U JP 14375786 U JP14375786 U JP 14375786U JP 14375786 U JP14375786 U JP 14375786U JP S6350169 U JPS6350169 U JP S6350169U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- penetrates
- chip component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１実施例を示す断面図、第
２図は本考案の第２実施例を示す断面図、第３図
は従来例を示す断面図である。
１は縦円柱形ケミコンチツプ、１ｂはリード、
２，２′は印刷配線板、２ａ，２′ａは絶縁基板
、２ｂ，２′ｂは導体部、４はクリームハンダ、
５はランド部、６，６′は穴である。
FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment of the present invention, and FIG. 3 is a sectional view showing a conventional example. 1 is a vertical cylindrical Chemi-Con chip, 1b is a lead,
2 and 2' are printed wiring boards, 2a and 2'a are insulating substrates, 2b and 2'b are conductor parts, 4 is cream solder,
5 is a land portion, and 6 and 6' are holes.
Claims (1)
チツプ部品を半田づけするランド夫々に、該チツ
プ部品のリードに対向して該印刷配線板を貫く穴
を穿設したことを特徴とする印刷配線板。 前記印刷配線板の絶縁基板が、透明材料から
なり、前記穴が、前記印刷配線板の導体部のみを
貫くことを特徴とする実用新案登録請求の範囲第
１項記載の印刷配線板。[Scope of claim for utility model registration] In printed wiring boards on which chip parts are mounted,
1. A printed wiring board characterized in that each land to which a chip component is soldered is provided with a hole that penetrates the printed wiring board and faces the leads of the chip component. 2. The printed wiring board according to claim 1, wherein the insulating substrate of the printed wiring board is made of a transparent material, and the hole penetrates only the conductor portion of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14375786U JPS6350169U (en) | 1986-09-19 | 1986-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14375786U JPS6350169U (en) | 1986-09-19 | 1986-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6350169U true JPS6350169U (en) | 1988-04-05 |
Family
ID=31053730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14375786U Pending JPS6350169U (en) | 1986-09-19 | 1986-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350169U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303356A (en) * | 2005-04-25 | 2006-11-02 | Ricoh Microelectronics Co Ltd | Packaging method of electronic component |
| WO2007074594A1 (en) * | 2005-12-27 | 2007-07-05 | Sharp Kabushiki Kaisha | Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board |
| JP2010103166A (en) * | 2008-10-21 | 2010-05-06 | Canon Inc | Mounting method and mounting structure for lead-less electronic component |
| WO2014157716A1 (en) * | 2013-03-29 | 2014-10-02 | 日清紡メカトロニクス株式会社 | Printed wiring board and manufacturing method for mounting substrate using printed wiring board |
| WO2014185543A1 (en) * | 2013-05-17 | 2014-11-20 | 日清紡メカトロニクス株式会社 | Apparatus for mounting electronic component |
| WO2021176758A1 (en) * | 2020-03-06 | 2021-09-10 | 株式会社村田製作所 | Electronic device and method for manufacturing same |
-
1986
- 1986-09-19 JP JP14375786U patent/JPS6350169U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303356A (en) * | 2005-04-25 | 2006-11-02 | Ricoh Microelectronics Co Ltd | Packaging method of electronic component |
| WO2007074594A1 (en) * | 2005-12-27 | 2007-07-05 | Sharp Kabushiki Kaisha | Soldering mounting structure, production method and device for the same, electronic apparatus, and wiring board |
| JP2010103166A (en) * | 2008-10-21 | 2010-05-06 | Canon Inc | Mounting method and mounting structure for lead-less electronic component |
| WO2014157716A1 (en) * | 2013-03-29 | 2014-10-02 | 日清紡メカトロニクス株式会社 | Printed wiring board and manufacturing method for mounting substrate using printed wiring board |
| WO2014185543A1 (en) * | 2013-05-17 | 2014-11-20 | 日清紡メカトロニクス株式会社 | Apparatus for mounting electronic component |
| WO2021176758A1 (en) * | 2020-03-06 | 2021-09-10 | 株式会社村田製作所 | Electronic device and method for manufacturing same |
| JP6989070B1 (en) * | 2020-03-06 | 2022-01-05 | 株式会社村田製作所 | Electronic devices and their manufacturing methods |
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