JPH0247056U - - Google Patents
Info
- Publication number
- JPH0247056U JPH0247056U JP12586988U JP12586988U JPH0247056U JP H0247056 U JPH0247056 U JP H0247056U JP 12586988 U JP12586988 U JP 12586988U JP 12586988 U JP12586988 U JP 12586988U JP H0247056 U JPH0247056 U JP H0247056U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- lead frame
- exterior plating
- tie bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
本考案の他の実施例の斜視図、第３図は従来のリ
ードフレームの斜視図である。
１……タイバー、２……樹脂封止域、３……イ
ンナーリード、４……アウターリード、５……外
装めつき、６……タイバー内側の側面、７……タ
イバー外側の側面。
FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of another embodiment of the present invention, and FIG. 3 is a perspective view of a conventional lead frame. 1...Tie bar, 2...Resin sealing area, 3...Inner lead, 4...Outer lead, 5...Exterior plating, 6...Tie bar inner side surface, 7...Tie bar outer side surface.
Claims (1)
型半導体装置用リードフレームにおいて、樹脂封
止域の外側かつタイバー内側にあるメタル部の側
面に外装めつきが施されていない事を特徴とする
樹脂封止型半導体装置用リードフレーム。 A resin-sealed lead frame for a semiconductor device in which external leads are pre-attached with exterior plating, characterized in that no exterior plating is applied to the side surface of the metal part outside the resin-sealed area and inside the tie bar. Lead frame for sealed semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12586988U JPH0247056U (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12586988U JPH0247056U (en) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247056U true JPH0247056U (en) | 1990-03-30 |
Family
ID=31376856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12586988U Pending JPH0247056U (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247056U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113351A (en) * | 2017-01-12 | 2018-07-19 | 大口マテリアル株式会社 | Lead frame and manufacturing method thereof |
-
1988
- 1988-09-26 JP JP12586988U patent/JPH0247056U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113351A (en) * | 2017-01-12 | 2018-07-19 | 大口マテリアル株式会社 | Lead frame and manufacturing method thereof |