JPH0252446U - - Google Patents
Info
- Publication number
- JPH0252446U JPH0252446U JP13114288U JP13114288U JPH0252446U JP H0252446 U JPH0252446 U JP H0252446U JP 13114288 U JP13114288 U JP 13114288U JP 13114288 U JP13114288 U JP 13114288U JP H0252446 U JPH0252446 U JP H0252446U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed semiconductor
- package
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002274 desiccant Substances 0.000 claims description 2
Landscapes
- Drying Of Gases (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは、本考案の一実施例の外形の斜視図
、第１図ｂは、第１図ａのＡ―Ａ線縦断面図、第
２図ａは、本考案の他の実施例の外形の斜視図、
第２図ｂは、第２図ａのＢ―Ｂ線縦断面図、第３
図は、従来の樹脂封止型半導体の縦断面図である
。
１……樹脂、２……乾燥剤、３……樹脂、４…
…リード・フレーム、５……半導体チツプ、６…
…ボンデイングワイヤ、７……外部リード。
FIG. 1a is a perspective view of the external appearance of one embodiment of the present invention, FIG. 1b is a longitudinal cross-sectional view taken along line A--A of FIG. 1a, and FIG. 2a is another embodiment of the present invention. A perspective view of the external shape of
Figure 2b is a longitudinal cross-sectional view taken along the line B--B in Figure 2a, and
The figure is a longitudinal cross-sectional view of a conventional resin-sealed semiconductor. 1...Resin, 2...Drying agent, 3...Resin, 4...
...Lead frame, 5...Semiconductor chip, 6...
...Bonding wire, 7...External lead.
Claims (1)
設けたことを特徴とする樹脂封止型半導体装置。 A resin-sealed semiconductor device characterized in that a desiccant layer is provided inside a resin forming a package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13114288U JPH0252446U (en) | 1988-10-05 | 1988-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13114288U JPH0252446U (en) | 1988-10-05 | 1988-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252446U true JPH0252446U (en) | 1990-04-16 |
Family
ID=31386932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13114288U Pending JPH0252446U (en) | 1988-10-05 | 1988-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2439855B (en) * | 2005-02-23 | 2009-09-16 | Kikuo Sugita | Turnover preventive sheet |
-
1988
- 1988-10-05 JP JP13114288U patent/JPH0252446U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2439855B (en) * | 2005-02-23 | 2009-09-16 | Kikuo Sugita | Turnover preventive sheet |