JPH01206696A - Manufacture of electrical laminated board - Google Patents
Manufacture of electrical laminated boardInfo
- Publication number
- JPH01206696A JPH01206696A JP63032286A JP3228688A JPH01206696A JP H01206696 A JPH01206696 A JP H01206696A JP 63032286 A JP63032286 A JP 63032286A JP 3228688 A JP3228688 A JP 3228688A JP H01206696 A JPH01206696 A JP H01206696A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- resin
- plating layer
- prepreg
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 25
- 239000003513 alkali Substances 0.000 claims abstract description 11
- 239000002253 acid Substances 0.000 claims abstract description 10
- 238000005553 drilling Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
本発明は、金属板を基板として用いた多層の電気積層板
に関するものである。The present invention relates to a multilayer electrical laminate using a metal plate as a substrate.
金属板を基板とする電気積層板においては、スルーホー
ルを形成するために孔明きの金属板が基板として′用い
られる。すなわち、金属板にスルーホールを形成すべき
箇所においてスルーホールの径よりも天外な通孔を設け
ておき、この複数枚の金属板をプリプレグを介して重ね
て加熱加圧成形をおこなうことによって、プリプレグに
含浸した樹脂を硬化させて各金属板を積層接着すると共
にプリプレグに含浸した樹脂を金属板の各通孔に流入充
填させて硬化させる。そしてこの通孔に充填させた樹脂
の部分においてスルーホールを穿孔加工することによっ
て、通孔内の樹脂で金属板との間の絶縁性が確保された
スルーホールを形成することができるのである。そして
スルーホールの内周にはメツキを施してスルーホールメ
ッキ層が形成される。In an electrical laminate using a metal plate as a substrate, a perforated metal plate is used as the substrate in order to form through holes. In other words, a hole larger than the diameter of the through hole is provided at the location where the through hole is to be formed in the metal plate, and by stacking these multiple metal plates with prepreg interposed therebetween and performing heat and pressure forming, The resin impregnated into the prepreg is cured to bond the respective metal plates in a laminated manner, and the resin impregnated into the prepreg is flowed and filled into each through hole of the metal plate and cured. By drilling a through hole in the portion of the resin filled in the through hole, it is possible to form a through hole in which insulation between the resin in the through hole and the metal plate is ensured. Then, the inner periphery of the through hole is plated to form a through hole plating layer.
しかし、金属板の通孔に充填した樹脂の部分に加工して
形成したスルーホールの内周面は樹脂面であるためにス
ルーホールメッキ層の密着性が悪く１．スルーホール信
頼性が低下するおそれがあるという問題がある。そこで
、プリプレグを調製する樹脂中にＡ１（ＯＨ）、やＡｐ
２０３、Ｅガラスなどの充填剤を含有させておくことに
よって、スルーホールの内周面にこの充填剤で凹凸が形
成されるようにし、スルーホールメッキ層の密着性を高
める試みもなされているが、十分な効果を得ることはで
きないものである。
本発明は上記の点に鑑みて為されたものであり、スルー
ホールメッキ層の密着性を高めることができる電気積層
板の製造方法を提供することを目的とするものである。However, since the inner circumferential surface of the through hole formed by processing the resin filled in the through hole of the metal plate is a resin surface, the adhesion of the through hole plating layer is poor.1. There is a problem that through-hole reliability may deteriorate. Therefore, A1 (OH) and Ap are added to the resin used to prepare prepreg.
203. Attempts have also been made to increase the adhesion of the through-hole plating layer by incorporating a filler such as E-glass so that the filler forms irregularities on the inner peripheral surface of the through-hole. , it is not possible to obtain sufficient effects. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing an electrical laminate that can improve the adhesion of a through-hole plating layer.
【課題を解決するための手段】′
上記課題を解決するために本発明は、通孔１を設けた複
数枚の金属板２をプリプレグ３を介して重ね、加熱加圧
成形してプリプレグ３に含浸した樹脂を硬化させて各金
属板２を積層接着すると共にプリプレグ３に含浸した樹
脂を金属板２の各通孔１に流入充填させて硬化させ、通
孔１内の樹脂４の部分においてスルーホール５を穿孔加
工するにｈたって、プリプレグ３に含浸する樹脂として
三酸化アンチモンを配合したものを用い、スルーホール
５を穿孔加工したのちに酸もしくはアルカリでスルーホ
ール５内を処理し、しかるのちにスルーホール５の内周
にスルーホールメッキ層６を形成するようにしたことを
特徴とするものである。
以下本発明の詳細な説明する。プリプレグ３はガラスペ
ーパー（がラス不繊布）やガラスクロス（ｌｆテラス布
）などの基材にエポキシ樹脂などの熱硬化性樹脂を含浸
して乾燥することによって調製されるものであるが、ガ
ラスペーパーはガラスクロスに比べて組織が疎であって
、含浸される樹脂を浸透させて十分な量で保有すること
ができるために、ガラスペーパーを基材としてプリプレ
グ３を調製するようにするのがよい。また基材に含浸す
る樹脂には三酸化アンチモンの粉末を配合したものを用
いる。三酸化アンチモンの配合量は２０〜１５０ＰＨＲ
の範囲に設定するのが好ましい。配合量が２０ＰＨＲ未
満であると三酸化アンチモンを配合した効果が十分に得
られないものであり、また１５０ＰＨＲを超えると後述
する積層成形の際の樹脂の流動性が低下して金属板２の
通孔１への充填性が悪くなり、ボイドが発生してスルー
ホール５と金属板２との間の絶縁性を確保することがで
鯵なくなるおそれがある。また三酸化アンチモン粒子の
粒径は特に限定されるものではなく、現在提供されてい
る０、５μ〜１．０μの大きさのもので十分な効果を得
ることができる。
しかしてこのように三酸化アンチモンを配合した樹脂を
含浸して調製したプリプレグ３を用い、金属板２を基板
とする電気積層板を製造するにあたっては、まず、銅板
など金属板２にスルーホール５を形成する箇所において
パンチ加工やドリル加工などで通孔１を形成する。通孔
１はスルーホール５の直径よりも大きな直径で形成され
るものである。そして第１図（、）のようにプリプレグ
３を介して金属板２を５枚〜８枚重ね、さらに上下にプ
リプレグ３を介して銅箔なと金属箔９を重ねる。これを
加熱加圧成形することによって、プリプレグ３に含浸し
た樹脂を硬化させて各金属板２を積層接着させると共に
、プリプレグ３に含浸した樹脂の一部を金属板２の各通
孔１内に流入させて第１図（ｂ）のようにこの樹脂４を
通孔１内に充填させる。このようにして金属板２の通孔
１に樹１１’、４を充填させた状態で各金属板２を積層
すると共に上下にそれぞれ金属箔９を積層したのちに、
ドリル加工やパンチ加工などでスルーホール５を穿孔加
工する。スルーホール５は第２図（、）に示すように、
通孔１に充填した樹脂４の部分において通孔１の直径よ
りも小さい直径で形成されるものであり、従ってスルー
ホール５の内周と金属板２どの間の電気絶縁性は樹脂４
によって確保されることになる。尚、第２図の実施例で
は一部の金属板２にスルーホール５を貫通させてアース
などをとることができるようにしである。
上記のようにスルーホール５を加工したのちに、酸もし
くはアルカリによってスルーホール５の内周を処理する
。この酸やアルカリとしては、三酸化アンチモンを溶解
することができるものであればよく、例えば酸としては
硫酸や塩酸などの水溶液を用いることができ、アルカリ
としては水酸化ナトリヴムなどの水溶液を用いることが
できる。
このようにして＊＋アルカリでスルーホール５の内周を
処理すると、スルーホール５の内周面に露出する三酸化
アンチモンが溶解され、第２図（Ｉ））のように三酸化
ア□ンチモンが溶脱された部分が凹となって、スルーホ
ール５の内周面には複雑な凹凸が形成されることになる
。そしてこののちに、スルーホール５の内周にスルーホ
ールメッキを施してスルーホールメツ１１６を形成し、
また金属箔９をエツチング処理して回路を形成したりな
どすることによって、金属板２を基板とした電気積層板
に仕上げるのである。このようにして得られる電気積層
板において、スルーホール５の内周に形成されるスルー
ホールメッキ層６は第２図に示すように、一部がスルー
ホール５の内周の凹みに食い込んだ状態で形成されるこ
とになり、アンカー効果によってスルーホール５の内周
に対するス、−７−
ルーホールメツキ層６の密着性を高めることができるも
のである。尚、スルーホールメッキをおこなう前にスル
ーホール５の内周に露出する三酸化アンチモンは酸やア
ルカリの処理で除去されてνするために、三酸化アンチ
モンがメツキ液に溶解してメツキ液を汚染してしまうと
いうような問題はないものである。
（実施例］
以下本発明を実施例によって具体的に説明する。
丸１性
ビスフェノールＡ型エポキシ樹脂８５重量部、フェノー
ルノボラック型エポキシ樹脂１５重量部、ジシアンジア
ミド１当量、ベンジルジメチルジアミン１当量、ＭＥＫ
２０重量部の配合のエポキシ樹脂（Ｆ Ｒ−４）に粒径
が０．５〜１．０μの三酸化アンチモンを１００ＰＨＲ
配合することによってエポキシ樹脂ワニスを調製し、こ
のエポキシ樹脂ワニスに基材としてガラスペーパー（日
本バイリーン製ＥＰ４０７５：かさ密度７５ｇ／ω２）
を浸漬し、次いで乾燥することによって、厚み０ 、２
ｍｍのプリプレグを作成した。ここで乾燥の条件はプ
リプレグ中の樹脂の熔融粘度が６００〜８００ボイズに
なるように設定した。またプリプレグのレジンコンテン
トは９１〜９２％であった。
次ぎに、厚みが０．５１で直径が１ 、５ ｖｎの通孔
を多数設けた銅板をプリプレグを介して６枚重ねると共
に上下にプリプレグを介して銅箔を重ね、２０ｋｇ／ｃ
Ｉ１１２の加圧条件で１４０℃で２０分間、１７０ ’
Ｃで９０分間加熱して積層成形をおこなって金属板を基
板とし表面に銅箔を張った積層板を得た。こののちに金
属板の通孔の部分において積層板に直径が０ 、８ ｔ
６ｍのスルーホールをドリル加工した。スルーホールを
加工したのちに、積層板を６０℃に調整した硫酸の２０
％水溶液に１０分間浸漬し、スルーホールの内周に硫酸
を作用させた。そしてスルーホールの内周にスルーホー
ルメッキを施した。
−このものにあって、２６０℃の半田浴に１分間浮かべ
る半田耐熱性試験をしたところ、スルーホールメッキ層
に剥がれや７クレなどの不良は全く発生しなかった。
比較例
三酸化アンチモンを配合しないでエポキシ樹脂ワニスを
調製し、このエポキシ樹脂ワニスを用（１てプリプレグ
を作成するようにした他は、実施例と同様にして積層成
形をおこなうと共にスルーホールを加工し、さらにスル
ーホールメッキを施した。このものにあって、半田耐熱
性試験をしたところ、スルーホールメッキ層に剥がれや
７クレの不良が発生した。
【発明の効果］
上述のように本発明覧こあっては、プリプレグ−こ含浸
する樹脂として三酸化アンチモンを配合したものを用い
、スルーホールを穿孔加工したのちに酸もしくはアルカ
リでスルーホール内を処理し、しかるのちにスルーホー
ルの内周にスルーホールメッキ層を形成するようにした
ので、酸やアルカリでスルーホールの内周を処理すると
、スル−ホールの内周面に露出する三酸化アンチモンが
溶解されてスルーホールの内周面には深（１凹凸が形成
されることになり、スルーホールの内周に形成されるス
ルーホールメッキ層は一部がスルーホールの内周の凹み
に食い込んで、アンカー効果によってスルーホールの内
周面へのスルーホールメッキ層の密着性を高めることが
でかるものである。[Means for Solving the Problems]' In order to solve the above-mentioned problems, the present invention stacks a plurality of metal plates 2 provided with through holes 1 with prepregs 3 interposed therebetween, and forms the prepregs 3 with heat and pressure. The impregnated resin is cured and each metal plate 2 is laminated and bonded, and the resin impregnated into the prepreg 3 is flowed into and filled into each through hole 1 of the metal plate 2 and hardened, and the resin 4 in the through hole 1 is through-filled. Before drilling the holes 5, a resin containing antimony trioxide is used as a resin to impregnate the prepreg 3, and after drilling the through holes 5, the inside of the through holes 5 is treated with acid or alkali, and then A through-hole plating layer 6 is formed on the inner periphery of the through-hole 5. The present invention will be explained in detail below. Prepreg 3 is prepared by impregnating a base material such as glass paper (glass nonwoven fabric) or glass cloth (LF terrace fabric) with thermosetting resin such as epoxy resin and drying it. Prepreg 3 is preferably prepared using glass paper as a base material because it has a looser structure than glass cloth and can penetrate and retain a sufficient amount of the resin to be impregnated. . Furthermore, the resin used to impregnate the base material contains antimony trioxide powder. The amount of antimony trioxide is 20 to 150 PHR.
It is preferable to set it within the range of . If the blending amount is less than 20 PHR, the effect of blending antimony trioxide will not be sufficiently obtained, and if it exceeds 150 PHR, the fluidity of the resin during lamination molding, which will be described later, will decrease and the metal plate 2 will not pass through. There is a risk that the filling of the holes 1 will be poor and voids will occur, making it impossible to ensure insulation between the through holes 5 and the metal plate 2. Further, the particle size of the antimony trioxide particles is not particularly limited, and a sufficient effect can be obtained with currently available particles having a size of 0.5 μm to 1.0 μm. However, when manufacturing an electrical laminate using a metal plate 2 as a substrate using a prepreg 3 impregnated with a resin containing antimony trioxide, first, a through hole 5 is formed in a metal plate 2 such as a copper plate. A through hole 1 is formed by punching, drilling, etc. at the location where the through hole 1 is to be formed. The through hole 1 is formed with a diameter larger than that of the through hole 5. Then, as shown in FIG. 1(,), five to eight metal plates 2 are stacked with prepregs 3 interposed therebetween, and metal foils 9, such as copper foils, are stacked above and below with prepregs 3 interposed therebetween. By heating and press-molding this, the resin impregnated into the prepreg 3 is cured and each metal plate 2 is laminated and bonded, and a part of the resin impregnated into the prepreg 3 is poured into each through hole 1 of the metal plate 2. The resin 4 is caused to flow into the through hole 1 as shown in FIG. 1(b). After the through holes 1 of the metal plates 2 are filled with trees 11' and 4 in this manner, the metal plates 2 are laminated, and the metal foils 9 are laminated on the top and bottom, respectively.
The through hole 5 is formed by drilling or punching. The through hole 5 is as shown in Fig. 2 (,),
The resin 4 filled in the through hole 1 is formed with a smaller diameter than the diameter of the through hole 1, and therefore the electrical insulation between the inner periphery of the through hole 5 and the metal plate 2 is lower than that of the resin 4.
This will be ensured by In the embodiment shown in FIG. 2, a through hole 5 is passed through a part of the metal plate 2 so that it can be grounded. After processing the through-hole 5 as described above, the inner periphery of the through-hole 5 is treated with acid or alkali. The acid or alkali may be anything that can dissolve antimony trioxide; for example, the acid may be an aqueous solution such as sulfuric acid or hydrochloric acid, and the alkali may be an aqueous solution such as sodium hydroxide. Can be done. When the inner periphery of the through-hole 5 is treated with *+ alkali in this way, the antimony trioxide exposed on the inner periphery of the through-hole 5 is dissolved, and the antimony trioxide shown in FIG. The leached portion becomes concave, and the inner circumferential surface of the through hole 5 is formed with complicated irregularities. After this, through-hole plating is applied to the inner periphery of the through-hole 5 to form a through-hole mesh 116,
Further, by etching the metal foil 9 to form a circuit, an electrical laminate using the metal plate 2 as a substrate is completed. In the electrical laminate thus obtained, the through-hole plating layer 6 formed on the inner periphery of the through-hole 5 is partially dug into the recess on the inner periphery of the through-hole 5, as shown in FIG. The anchor effect can improve the adhesion of the through-hole plating layer 6 to the inner periphery of the through-hole 5. Furthermore, before performing through-hole plating, the antimony trioxide exposed on the inner periphery of the through-hole 5 is removed by acid or alkali treatment, so the antimony trioxide dissolves in the plating solution and contaminates the plating solution. There is no problem in doing so. (Example) The present invention will be specifically explained below with reference to Examples. 85 parts by weight of round monobisphenol A type epoxy resin, 15 parts by weight of phenol novolac type epoxy resin, 1 equivalent of dicyandiamide, 1 equivalent of benzyldimethyldiamine, MEK
Add 100 PHR of antimony trioxide with a particle size of 0.5 to 1.0μ to 20 parts by weight of epoxy resin (FR-4).
An epoxy resin varnish is prepared by blending, and glass paper (EP4075 manufactured by Nippon Vilene: bulk density 75 g/ω2) is added to this epoxy resin varnish as a base material.
By soaking and then drying, thicknesses of 0 and 2
A prepreg of mm in size was prepared. Here, the drying conditions were set so that the melt viscosity of the resin in the prepreg was 600 to 800 voids. The resin content of the prepreg was 91-92%. Next, six copper plates with a thickness of 0.51 and a number of through holes with a diameter of 1.5 mm were stacked via prepreg, and copper foil was stacked on top and bottom via prepreg, and a 20 kg/c
170' for 20 minutes at 140°C under the pressure condition of I112.
C for 90 minutes and laminated molding was performed to obtain a laminate having a metal plate as a substrate and a copper foil on the surface. After this, the diameter of the laminated plate is 0.8t at the through hole part of the metal plate.
A 6m through hole was drilled. After processing the through-holes, the laminate was heated to 60℃ using 20% sulfuric acid.
% aqueous solution for 10 minutes, and sulfuric acid was applied to the inner periphery of the through hole. Then, through-hole plating was applied to the inner circumference of the through-hole. - When this product was subjected to a solder heat resistance test by floating it in a 260° C. solder bath for 1 minute, no defects such as peeling or 7 cracks occurred in the through-hole plating layer. Comparative Example: An epoxy resin varnish was prepared without adding antimony trioxide, and this epoxy resin varnish was used (layer molding was carried out in the same manner as in the example except that prepreg was prepared first), and through-holes were processed. Then, through-hole plating was applied.When a solder heat resistance test was conducted on this product, peeling and defects of 7 cracks occurred in the through-hole plating layer. [Effects of the Invention] As described above, the present invention In this case, a resin containing antimony trioxide is used to impregnate the prepreg, and after drilling the through hole, the inside of the through hole is treated with acid or alkali, and then the inner periphery of the through hole is treated. Since a through-hole plating layer is formed on the through-hole, when the inner periphery of the through-hole is treated with acid or alkali, the antimony trioxide exposed on the inner periphery of the through-hole is dissolved and coated on the inner periphery of the through-hole. is deep (1).The through hole plating layer formed on the inner periphery of the through hole partially bites into the recess on the inner periphery of the through hole, and due to the anchor effect, the inner periphery of the through hole is This makes it possible to improve the adhesion of the through-hole plating layer to the surface.
第１図（ａ）（ｂ）は電気積層板の製造の各工程を示す
断面図、第２図（ａ）（ｂ）（ｃ）は同上の他の各工程
を示す一部の拡大断面図である。
１は通孔、２は金属板、３はプリプレグ、４は通孔内の
樹脂、５はスルーホール、６はスルーホールメッキ層で
ある。Figures 1 (a) and (b) are cross-sectional views showing each process of manufacturing an electric laminate, and Figures 2 (a), (b), and (c) are partial enlarged cross-sectional views showing other processes of the same. It is. 1 is a through hole, 2 is a metal plate, 3 is a prepreg, 4 is a resin in the through hole, 5 is a through hole, and 6 is a through hole plating layer.
Claims (1)
て重ね、加熱加圧成形してプリプレグに含浸した樹脂を
硬化させて各金属板を積層接着すると共にプリプレグに
含浸した樹脂を金属板の各通孔に流入充填させて硬化さ
せ、通孔内の樹脂の部分においてスルーホールを穿孔加
工するにあたって、プリプレグに含浸する樹脂として三
酸化アンチモンを配合したものを用い、スルーホールを
穿孔加工したのちに酸もしくはアルカリでスルーホール
内を処理し、しかるのちにスルーホールの内周にスルー
ホールメッキ層を形成することを特徴とする電気積層板
の製造方法。(1) Layer multiple metal plates with through holes through prepreg, heat and pressure mold them to harden the resin impregnated in the prepreg, and laminate and bond each metal plate, and apply the resin impregnated in the prepreg to the metal. The resin is injected into each hole in the plate and cured, and when drilling the through hole in the resin part of the hole, a resin containing antimony trioxide is used as the resin impregnated into the prepreg, and the through hole is drilled. A method for producing an electrical laminated board, which comprises: thereafter treating the inside of the through-hole with acid or alkali, and then forming a through-hole plating layer on the inner periphery of the through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63032286A JPH01206696A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electrical laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63032286A JPH01206696A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electrical laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01206696A true JPH01206696A (en) | 1989-08-18 |
Family
ID=12354719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63032286A Pending JPH01206696A (en) | 1988-02-15 | 1988-02-15 | Manufacture of electrical laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01206696A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6323439B1 (en) | 1998-09-24 | 2001-11-27 | Ngk Spark Plug Co., Ltd. | Metal core multilayer resin wiring board with thin portion and method for manufacturing the same |
| WO2011027558A1 (en) * | 2009-09-02 | 2011-03-10 | パナソニック株式会社 | Printed wiring board, build-up multi-layer board, and production method therefor |
-
1988
- 1988-02-15 JP JP63032286A patent/JPH01206696A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6323439B1 (en) | 1998-09-24 | 2001-11-27 | Ngk Spark Plug Co., Ltd. | Metal core multilayer resin wiring board with thin portion and method for manufacturing the same |
| WO2011027558A1 (en) * | 2009-09-02 | 2011-03-10 | パナソニック株式会社 | Printed wiring board, build-up multi-layer board, and production method therefor |
| CN102484951A (en) * | 2009-09-02 | 2012-05-30 | 松下电器产业株式会社 | Printed circuit board, multilayer substrate, and method for manufacturing the same |
| US8866022B2 (en) | 2009-09-02 | 2014-10-21 | Panasonic Corporation | Printed wiring board, build-up multi-layer board, and production method therefor |
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