JPH0737949A - Lead frame, of semiconductor device semiconductor device testing contactor, and manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To conduct a test on a semiconductor device surely even when the semiconductor has outer leads spaced on a small pitch, by forming a cross-stitch- shaped test pad wider than the outer lead and located between an elongated part from the outer lead and the lead frame. CONSTITUTION:A cross-stitch-shaped test pad part 9 outside a sealing part 2 of a semiconductor device 4 is provided between an elongated part from an outer lead 3 and a frame 1a of a lead frame 1A. The test pad part put in contact with a test contactor is wider than the outer lead 3. After a semiconductor chip is wire-bonded on a lead frame 1A and sealed with resin, the test pad part 9 is cut from the frame 1a so that each semiconductor device 4 put in a row on the lead frame is tested. A symbolic mark is made on the semiconductor device, and the outer lead 3 is cut to a given length, while the test pad part 9 is removed. Then, the semiconductor device 4 is separated from the frame 1a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for manufacturing a semiconductor device, a test contactor, and a method for manufacturing a semiconductor device using the same.

[0002]

2. Description of the Related Art A conventional lead frame of a semiconductor device will be described with reference to FIGS. FIG. 42 is a plan view showing a state in which a plurality of semiconductor devices are connected to a lead frame in the process of manufacturing the conventional semiconductor device. Further, FIG. 43 is a front view showing a lead frame of the conventional semiconductor device of FIG. Furthermore, FIG.
It is an enlarged view which shows the A section of FIG.

FIG. 45 is a plan view showing a substantially completed state of a conventional semiconductor device. Further, FIG. 46 is a front view showing the conventional semiconductor device of FIG. FIG. 47 is a plan view showing a state before bending the external leads of the conventional semiconductor device into a predetermined shape. Further, FIG. 48 is a front view showing the conventional semiconductor device of FIG.

42 to 48, 1 is a lead frame used in the process of assembling the semiconductor device 4, 2 is a sealing portion of the semiconductor device 4 formed by resin molding, and 3 is the semiconductor device 4.
Is an external lead. Further, 1a is a frame of the lead frame 1, 1b is a support portion of the lead frame 1, and X1 and X2 are cutting lines.

From the state shown in FIG. 42, each semiconductor device 4
A cutting line X1 indicated by a dashed line on the extension of the external lead 3 of
After cutting on X2 and separating it from the frame 1a of the lead frame 1, the external lead 3 is bent into a predetermined shape, and the external lead 3 is bent as shown in FIG.
5 and the semiconductor device 4 having the shape shown in FIG.

Here, the sealing portion 2 is held on the frame 1a of the lead frame 1 by the support portion 1b of the lead frame 1 shown in FIG. 44, and when the external lead 3 is cut, the support portion 1b is also attached. It is necessary to separate it from the frame 1a.

Most of the semiconductor devices 4 are shown in FIGS.
In the state shown in FIG. 2, that is, in a state in which the external lead 3 of the semiconductor device 4 is bent into a predetermined shape, a trademark / trademark is applied to a test process such as an electrical characteristic and an environmental test of the semiconductor device 4 and the sealing portion 2 of the semiconductor device 4. The semiconductor device 4 is completed through a manufacturing process such as a printing process for printing the model name / manufacturing number and the like.

In some cases, the external leads 3 of the semiconductor device 4 are subjected to the same manufacturing process in the state shown in FIG. 47 and FIG. Bending process 3 may be performed.

Here, as an example of the manufacturing process, a test process for conducting an electrical characteristic test of the semiconductor device 4 will be described with reference to FIGS. 49 to 52. FIG. 49 corresponds to FIG.
47 is a plan view showing a basic state in which an electrical characteristic test of the semiconductor device 4 in which the external lead 3 shown in FIG. 46 is preliminarily bent is performed. Further, FIG. 50 is a front view thereof.

In FIGS. 49 and 50, reference numeral 7 is a test contactor having a contact piece 5, which is connected to a test device (not shown) for contacting the external lead 3 of the semiconductor device 4 for testing. Is a holder for holding the contact piece 5, and 8 is a cradle for positioning and holding the semiconductor device 4.

Further, FIG. 51 is a plan view showing a basic state in which an electrical characteristic test is similarly performed on the semiconductor device 4 in which the external lead 3 shown in FIGS. 47 and 48 is not bent. is there. Further, FIG. 52 is a front view thereof.

A semiconductor device 4 in which the external lead 3 is bent in advance,
Alternatively, in any of the semiconductor devices 4 which are not bent, the contact piece 5 is brought into contact with the same lead pitch size of the semiconductor device 4 and the width of the external lead 3.
An electrical characteristic test of the semiconductor device 4 is performed by a connected test device (not shown) for testing.

[0013]

In recent years, there have been remarkable advances in high integration, high functionality, and miniaturization of semiconductor devices.
Along with the miniaturization, the number of pins and the pitch of external leads are rapidly increasing. As a result, in the manufacturing of semiconductor devices, particularly in the test process of conducting electrical characteristic tests of semiconductor devices, it is becoming difficult to obtain a reliable contact state.

That is, when the test contactor is brought into contact with the external leads of a semiconductor device having a large number of pins and a small pitch, the contact area for contacting the test contactor is small because the external leads have a small pitch and the width of the external leads is narrow. Since the contact piece is not wide, and the contact piece does not interfere with the adjacent external leads, the contact piece is fitted to the external lead of the semiconductor device having a narrow width and a small pitch. There is a problem in that it is necessary to perform assembling with a high degree of accuracy using a high technology, and further, it is necessary to position the semiconductor device with respect to the test contactor with high accuracy.

Further, external leads of the semiconductor device are preliminarily subjected to solder plating or the like in order to improve solderability at the time of mounting on a printed circuit board or the like, and a contact piece of a test contactor used in a test process. This is a semiconductor device test in which the solder plating gradually accumulates on the contact area between the lead and the external lead and grows to such an extent that it interferes with the adjacent contact piece, or the deposited and grown solder falls off from the contact piece. However, there is a problem in that it is necessary to frequently perform cleaning such as cleaning of the dropped solder scraps and removal of solder attached to the contact piece, as well as adversely affecting the above.

The invention according to claim 1 has been made to solve the above-mentioned problems. Even if the external leads of the semiconductor device have a small pitch, the portion where the test contactor contacts is the original external lead. Wider than the width of the contact contactor, the contact area can be increased with respect to the test contactor.
An object of the present invention is to obtain a lead frame of a semiconductor device that can surely test the semiconductor device.

The invention according to claim 2 is made in order to solve the above-mentioned problems, and when a semiconductor device is tested, it is possible to prevent the solder plating from adhering to the contact piece. The purpose is to obtain the lead frame of.

The invention according to claim 3 has been made to solve the above-mentioned problems, and in the lead frame state according to claim 1, each manufacturing process such as a test process and a printing process of a semiconductor device, An object of the present invention is to obtain a method of manufacturing a semiconductor device, which can increase productivity by manufacturing the semiconductor device.

The invention according to claim 4 is made in order to solve the above-mentioned problems, and the lead frame is cut for each semiconductor device from the state of the lead frame according to claim 1, leaving the frame portion of the lead frame. An object of the present invention is to obtain a method of manufacturing a semiconductor device, which can improve productivity by manufacturing the semiconductor device through each manufacturing process such as a test process and a printing process of the semiconductor device in a state.

The invention according to claim 5 has been made in order to solve the above-mentioned problems, and in the state where the lead frame according to claim 1 is separated from the frame of the lead frame into semiconductor device units, the semiconductor An object of the present invention is to obtain a method for manufacturing a semiconductor device, which is capable of increasing the economical efficiency by manufacturing a semiconductor device through each manufacturing process such as a device testing process and a printing process.

The invention according to claim 6 is made in order to solve the above-mentioned problems. Even if the external leads of the semiconductor device have a small pitch, the pitch of each contact piece is outside the semiconductor device. An object of the present invention is to obtain a contactor for testing a semiconductor device, which can be made to have a size twice the lead pitch and which is easy to manufacture and assemble.

The invention according to claim 7 is made in order to solve the above-mentioned problems, and a test process, a printing process, and a lead are performed in a state where a semiconductor device is housed in a tray that houses and holds a plurality of semiconductor devices. An object of the present invention is to obtain a method of manufacturing a semiconductor device, which can improve productivity by manufacturing the semiconductor device through a manufacturing process such as a processing process.

The invention according to claim 8 is to solve the above-mentioned problems, and in a tray for storing and holding a plurality of semiconductor devices, the semiconductor devices are positioned on the mounting portions of the respective semiconductor devices. Also, it is an object of the present invention to provide a method of manufacturing a semiconductor device that can reduce damage to external leads by providing a through hole through which a member that pushes up the semiconductor device from the tray can pass and that can improve productivity. .

[0024]

According to a first aspect of the present invention, there is provided a semiconductor device lead frame, wherein an external lead is provided outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame. The test pads are wider than the width of the leads and are arranged in a zigzag pattern, and are provided with a test pad portion with which a test contactor can come into contact.

A lead frame of a semiconductor device according to a second aspect of the present invention is wider than the width of the external lead between the extension of the external lead and the frame of the lead frame outside the sealing portion of the semiconductor device. The test pad portion is provided in a zigzag pattern, is not solder-plated, and can be contacted by a test contactor.

A method of manufacturing a semiconductor device according to a third aspect of the present invention includes the following steps. [1] A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. [2] A semiconductor device forming step in which a semiconductor chip is die-bonded and wire-bonded on the lead frame to perform resin sealing. [3] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [4] A test process in which each semiconductor device is tested in a lead frame state in which a plurality of semiconductor devices are connected. [5] A printing step of printing a mark on the semiconductor device in a lead frame state in which a plurality of the semiconductor devices are connected. [6] A lead processing step of cutting the test pad portion and cutting the semiconductor device to the original length of the external leads at the same time as removing the semiconductor device from the frame of the lead frame.

A method of manufacturing a semiconductor device according to a fourth aspect of the present invention includes the following steps. [1] A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. [2] A semiconductor device forming step in which a semiconductor chip is die-bonded and wire-bonded on the lead frame to perform resin sealing. [3] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [4] A test step of performing a test of each semiconductor device in a state where the lead frame is cut in units of semiconductor devices while leaving the frame of the lead frame. [5] A printing step of printing a mark on the semiconductor device in a state where the lead frame is cut in units of semiconductor devices while leaving the frame of the lead frame. [6] A lead processing step of cutting the test pad portion and cutting the semiconductor device to the original length of the external leads at the same time as removing the semiconductor device from the frame of the lead frame.

A method of manufacturing a semiconductor device according to a fifth aspect of the present invention includes the following steps. [1] A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. [2] A semiconductor device forming step in which a semiconductor chip is die-bonded and wire-bonded on the lead frame to perform resin sealing. [3] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [4] A test step of performing a test of each semiconductor device in a state where the semiconductor device is separated from the frame of the lead frame. [5] A printing step of printing a mark on the semiconductor device in a state of being separated from the frame of the lead frame for each semiconductor device. [6] A lead processing step of removing the test pad portion and cutting the semiconductor device into the original external lead length at the same time.

A test contactor for a semiconductor device according to a sixth aspect of the present invention is provided outside the sealing portion of the semiconductor device, on the extension of the external lead, wider than the width of the external lead, and in a staggered pattern. The test piece of the semiconductor device is in contact with the test pad portion, and the contact piece is arranged so as to alternately face each other.

A method of manufacturing a semiconductor device according to a seventh aspect of the present invention includes the following steps. [1] A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. [2] A semiconductor device forming step in which a semiconductor chip is die-bonded and wire-bonded on the lead frame to perform resin sealing. [3] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [4] A test step in which the lead frame is cut into semiconductor device units, and a test is performed on each semiconductor device in a state where a plurality of the semiconductor devices are stored in a tray. [5] A printing step of printing a mark on the semiconductor device in a state where a plurality of the semiconductor devices are stored in the tray. [6] A lead processing step in which a plurality of the semiconductor devices are stored in the tray and the test pad portion is removed, and at the same time, the semiconductor device is cut into the original length of the external lead.

A method of manufacturing a semiconductor device according to an eighth aspect of the present invention includes the following steps. [1] A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. [2] A semiconductor device forming step in which a semiconductor chip is die-bonded and wire-bonded on the lead frame to perform resin sealing. [3] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [4] A test step in which the lead frame is cut in units of semiconductor devices, a plurality of the semiconductor devices are stored in a tray, and each semiconductor device is tested with each semiconductor device being pushed up. [5] A printing step of printing a mark on the semiconductor device in the pushed state. [6] A lead processing step in which the test pad portion is removed and the semiconductor device is cut into the original external lead length in the pushed-up state.

[0032]

In the lead frame of the semiconductor device according to the first aspect of the present invention, even if the external leads of the semiconductor device have a small pitch, the contacting portion of the test contactor should be wider than the original width of the external lead. The contact area is wider than that of the test contactor, and reliable contact is possible without the need for high precision.

In the lead frame of the semiconductor device according to the second aspect of the present invention, since the test pad portion with which the contact piece of the test contactor contacts is not solder-plated, when the semiconductor device is tested, It is possible to prevent solder from adhering to the contact piece.

In the method of manufacturing a semiconductor device according to a third aspect of the present invention, the test pad portion and the frame of the lead frame are cut while leaving the test pad portion from a lead frame state in which a plurality of semiconductor devices are connected. By manufacturing a semiconductor device through a test process and a printing process in a lead frame state in which a plurality of semiconductor devices are connected in series, a plurality of semiconductor devices can be handled at the same time, and the lead frame is not restricted by the size and shape of the sealing part. Therefore, the semiconductor device can be positioned easily by the frame of the lead frame because the semiconductor device can be positioned by the frame of the lead frame, and the frame of the lead frame can protect the external lead from damage such as bending of the external leads to some extent. It is possible to obtain a production method with high productivity.

In the method of manufacturing a semiconductor device according to a fourth aspect of the present invention, the test pad portion and the frame of the lead frame are cut while leaving the test pad portion in a lead frame state in which a plurality of semiconductor devices are connected. In addition, by manufacturing the semiconductor device through the test process and the printing process in the state where the lead frame is cut in the unit of the semiconductor device while leaving the frame of the lead frame, the lead frame is not restricted by the size and shape of the sealing part. Therefore, the semiconductor device can be handled easily, and the semiconductor device can be easily positioned by the frame of the lead frame.
A highly productive manufacturing method in which the frame of the lead frame can be protected to some extent from damage such as bending of the external lead can be obtained.

In the method of manufacturing a semiconductor device according to the fifth aspect of the present invention, the test pad portion is left and the frame of the lead frame is cut off from the lead frame state in which a plurality of semiconductor devices are connected. , Furthermore, in the state of being separated into semiconductor device units from the frame of the lead frame,
By manufacturing the semiconductor device through the test process and the printing process, it is possible to manufacture the semiconductor device with almost the conventional technology and the conventional equipment, and a highly economical manufacturing method can be obtained.

In the contactor for testing a semiconductor device according to a sixth aspect of the present invention, even if the external leads of the semiconductor device have a small pitch, the pitch of each contact piece is twice the pitch of the external leads of the semiconductor device. Because of its size, it does not require high technology and high precision, and is easy to manufacture and assemble.

In the method of manufacturing a semiconductor device according to a seventh aspect of the present invention, a test process and a printing process are performed in a state where the semiconductor device is housed in a tray that houses and holds a plurality of semiconductor devices each having a lead frame cut for each semiconductor device. By consistently using it in manufacturing processes such as manufacturing process, lead processing process, etc., it is possible to reduce damage to external leads because the semiconductor device is not directly handled, and the transportation mode can be the same so that the transportation means is It is possible to obtain a manufacturing method with high productivity, which can be used in common and can be handled simultaneously.

In the method of manufacturing a semiconductor device according to the eighth aspect of the present invention, the semiconductor device stored in the semiconductor device is pushed up to a tray for storing and holding a plurality of semiconductor devices each having a cut lead frame. By providing through holes through which members can pass, it is possible to perform testing, printing, lead processing work, etc. near the above tray without taking out the semiconductor device to the outside, reducing damage to external leads. In addition, since the transportation mode can be the same, the transportation means can be made common, and moreover, a highly productive manufacturing method in which a plurality of transportation devices can be handled at the same time can be obtained.

[0040]

EXAMPLES Example 1. Embodiment 1 of the present invention will be described below with reference to FIGS. 1 and 2. 1 is a plan view showing a lead frame of a semiconductor device according to a first embodiment of the present invention. 2 is a front view showing the lead frame of the semiconductor device according to the first embodiment of the present invention.
In each figure, the same reference numerals indicate the same or corresponding parts.

In FIGS. 1 and 2, 1A is a lead frame used in the process of assembling the semiconductor device 4, 2 is a sealing portion of the semiconductor device 4 formed by resin molding or the like, and 3 is the semiconductor device 4.
The external leads 9 are wider than the original width of the external leads 3 between the extension of the portion forming the external leads 3 and the frame 1a of the lead frame 1A, and the test pads are formed in a staggered pattern. Is. The shape of the test pad portion 9 is not limited to a quadrangle, and may be circular or the like.

When the external lead 3 of the semiconductor device 4 is extended from the state shown in FIG. 1, the cutting lines X1 and X2 shown by the one-dot chain line are shown.
Test device for testing after cutting on top (not shown)
The contact piece connected to is brought into contact with the test pad portion 9 to perform an electrical characteristic test. After passing through manufacturing processes such as a test process, finally, a cutting line X3 indicated by a dashed line on the external lead 3
By cutting the upper portion, the unnecessary test pad portion 9 is removed at the same time, and the external lead 3 is bent into a predetermined shape, so that the semiconductor device 4 has the final shape.

The first embodiment of the present invention, as described above,
After assembling the semiconductor chip, in the lead frame 1A of the semiconductor device 4 which is resin-sealed or the like, the extension of the portion of the semiconductor device 4 forming the external lead 3 outside the sealing portion 2 and the lead frame 1A. Between the frame 1a part,
The test pads 9 are formed wider than the original width of the external leads 3 and alternately (staggered). Therefore, even if the external leads 3 of the semiconductor device 4 have a small pitch, the contact area for the test contactor can be made wider by making the contacting portion of the test contactor wider than the original width of the external lead 3. It is also possible to make reliable contact without the need for high precision. In addition, when the semiconductor device is tested, the yield can be significantly reduced without lowering the yield due to contact failure or the like.

Example 2. The second embodiment of the present invention will be described with reference to FIG. 3 is a plan view showing a lead frame of a semiconductor device according to a second embodiment of the present invention.

In FIG. 3, the basic structure of the lead frame 1B is the same as that of the first embodiment described above. In general, when the semiconductor device 4 is mounted on a printed circuit board or the like, solder plating is performed on the external leads 3 in order to improve solderability, but at least the test pad portion 9A indicated by the shaded portion is not solder-plated, or When conducting the electrical characteristic test of the semiconductor device 4, another plating that is hard to adhere to the contact piece connected to the test device (not shown) for testing is applied.

Similar to the first embodiment, the electrical characteristics of the semiconductor device 4 are obtained after cutting the cutting lines X1 and X2 indicated by the alternate long and short dash line on the extension of the external lead 3 of the semiconductor device 4 from the state shown in FIG. When performing a test, a contact piece connected to a test device (not shown) for the test is brought into contact with the test pad portion 9A to perform the test, but the test contactor is brought into contact with the external lead 3 for performing the test. The contact piece of (3) comes into contact with a portion not solder-plated or another plated portion that is difficult to adhere. After passing through the manufacturing process such as the test process, the cutting line X3 indicated by the one-dot chain line on the external lead 3 is finally cut to remove the unnecessary test pad portion 9A at the same time and form the external lead 3 into a predetermined shape. The semiconductor device 4 becomes the final shape by bending it.

The second embodiment of the present invention, as described above,
External leads 3 of the semiconductor device 4 outside the sealing portion 2
On the extension of the part forming the lead frame 1a of the lead frame 1B
In the lead frame 1B of the semiconductor device 4 in which the width of the external lead 3 is wider than that of the original external lead 3 and the test pads 9A are alternately formed, at least the external lead 3 of the original semiconductor device 4 is excluded. The test pad portion 9A is a lead frame of a semiconductor device in which solder plating is not applied. Therefore, neither the adhesion of solder to the contact piece nor the generation or dropping of solder scraps, the cleaning of the contact portion of the contact piece of the test contactor can be significantly reduced, and a stable contact state can be obtained, and the life of the contact piece can be shortened. It is possible to obtain a long test contactor.

Example 3. A third embodiment of the present invention will be described with reference to FIGS. 4 to 11. FIG. 4 is a cross-sectional view of the external lead 3 of the semiconductor device extending from the lead frame state according to the first embodiment described above, showing a cutting line X indicated by a dashed line.
It is a top view which shows the state which cut | disconnected on 1 and X2. Further, FIG. 5 is a front view thereof.

In addition, FIG. 6 is a cross-sectional view taken along the broken lines X1 and X2 indicated by the alternate long and short dash line on the extension of the external lead 3 of the semiconductor device from the lead frame state according to the first embodiment.
Further, it is a plan view showing a state where the external lead 3 is bent into a predetermined shape. Further, FIG. 7 is a front view thereof.

FIG. 8 is a plan view showing a state in which an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. 4 and 5. Further, FIG. 9 is a front view thereof. In addition, FIG.
FIG. 8 is a plan view showing a state where an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. 6 and 7. In addition, FIG.
FIG.

In FIGS. 4 to 11, reference numeral 7 is a holder for contacting the test pad portion 9 for testing the semiconductor device 4 and holding and fixing the contact piece 5 connected to the test device (not shown). A test contactor composed of 6 is a sealing portion 2 of the semiconductor device 4, or 8 and 8A.
A pedestal in which the sealing portion 2 of the semiconductor device 4 and the bent outer lead 3 are formed so as to fit in, and the semiconductor device 4 is positioned and held by the pin 8a or the like using the hole 1c or the like in the lead frame 1A. is there.

The plurality of semiconductor devices 4 in a lead frame state are handled by using the frame 1a of the lead frame 1A, are sequentially positioned and held, and undergo the manufacturing process such as a test process. Manufactured.

That is, in the semiconductor device manufacturing method according to the third embodiment of the present invention, the semiconductor device 4 is provided outside the sealing portion 2.
Of the semiconductor device in which the test pads 9 are formed wider than the original width of the external leads 3 and between the extension of each external lead 3 forming part and the frame 1a part of the lead frame 1A. After the semiconductor chip is die-bonded and wire-bonded on the lead frame and sealed with resin, the external leads 3 of the semiconductor device 4 are cut and bent (lead processing step).
In the manufacturing process of the semiconductor device such as performing individual electrical characteristics and environmental test of (1) (test process) and printing the trademark / type name / serial number on the sealing portion 2 of the semiconductor device 4 (printing process) , The test pad portion 9 is left and the portion between the test pad portion 9 and the frame 1a of the lead frame 1A is cut (at this time, the semiconductor device 4 is supported by the lead frame 1A by the support portion 1b, but outside the semiconductor device 4). The lead 3 is electrically insulated from the frame 1a portion of the lead frame 1A, and a test operation for each semiconductor device is possible.) Or, after cutting, the external lead 3 is bent into a predetermined shape. Then, in the lead frame state in which a plurality of semiconductor devices 4 are connected, the test process, the printing process, and the test pad portion 9 are removed, and at the same time, the external lead 3 is cut to the original length and bent into a predetermined shape, or Carried cut to a length of the test original external lead 3 at the same time as the removal of the pad portion 9 only, furthermore,
The semiconductor device is manufactured through a lead processing step of separating the semiconductor device 4 from the frame 1a of the lead frame 1A.

From the lead frame state shown in FIGS. 1 and 2, the test pad portion 9 is left and the test pad portion 9 and the frame 1a portion of the lead frame 1A are cut, or
After cutting, the external lead 3 is bent into a predetermined shape, and in a lead frame state in which a plurality of semiconductor devices 4 are connected, a test process, a printing process, separation from the frame 1a of the lead frame 1A, and a final length of the external lead 3 are performed. Since the semiconductor device is manufactured through a manufacturing process such as a lead processing process such as cutting and bending into a shape, a plurality of semiconductor devices 4 can be handled at the same time, and the lead frame 1A can be used regardless of the size and shape of the sealing portion 2. Therefore, handling can be performed and the transportation mode can be the same, so that the transportation unit can be shared, and the semiconductor device 4 can be positioned by the frame 1a of the lead frame 1A. The frame 1a can protect the external leads 3 from damage such as bending, to some extent, and thus a highly productive manufacturing method can be obtained. That.

Example 4. A fourth embodiment of the present invention will be described with reference to FIGS. 12 to 19. 12
Is cut along the cutting lines X1 and X2 indicated by the alternate long and short dash line from the lead frame state according to the first embodiment on the extension of the external lead of the semiconductor device, and further cut into the semiconductor device units while leaving the frame of the lead frame. It is a top view showing the state where it did. Further, FIG. 13 is a front view thereof.

In addition, FIG. 14 is a view showing the extension of the external lead of the semiconductor device from the lead frame state according to the above-described first embodiment, and cutting along the cutting lines X1 and X2 indicated by the alternate long and short dash line and forming the external lead into a predetermined shape. FIG. 6 is a plan view showing a state in which the semiconductor device is bent and then cut into semiconductor device units while leaving the frame of the lead frame. Well, FIG. 15 is a front view thereof.

FIG. 16 is a plan view showing a state where an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. 12 and 13. Further, FIG. 17 is a front view thereof. Further, FIG. 18 is a plan view showing a state in which an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. Also,
FIG. 19 is a front view thereof.

12 to 19, a holder 7 is brought into contact with the test pad portion 9 for testing the semiconductor device 4 and holds and fixes the contact piece 5 connected to the test device (not shown). A test contactor composed of 6 is a sealing portion 2 of the semiconductor device 4, or 8 and 8A.
A pedestal in which the sealing portion 2 of the semiconductor device 4 and the bent outer lead 3 are formed so as to fit in, and the semiconductor device 4 is positioned and held by the pin 8a or the like using the hole 1c or the like in the lead frame 1A. is there.

The semiconductor device 4 in the lead frame state, which is a unit of the semiconductor device 4, is handled by using the frame 1a of the lead frame 1A, sequentially transferred and positioned and held, and manufactured in a test process or the like. The semiconductor device 4 is manufactured through the steps.

That is, in the method of manufacturing a semiconductor device according to the fourth embodiment of the present invention, the semiconductor device 4 is provided outside the sealing portion 2.
Of the semiconductor device in which the test pads 9 are formed wider than the original width of the external leads 3 and between the extension of each external lead 3 forming part and the frame 1a part of the lead frame 1A. After the semiconductor chip is die-bonded and wire-bonded on the lead frame and sealed with resin, the external leads 3 of the semiconductor device 4 are cut and bent (lead processing step).
In the manufacturing process of the semiconductor device such as performing individual electrical characteristics and environmental test of (1) (test process) and printing the trademark / type name / serial number on the sealing portion 2 of the semiconductor device 4 (printing process) , The test pad portion 9 is left and the test pad portion 9 and the frame 1a portion of the lead frame 1A are cut, or after cutting, the outer lead 3 is bent into a predetermined shape to form the frame 1a of the lead frame 1A. In a state where the lead frame 1A is cut in a unit of the semiconductor device while leaving the portion, at the same time as the test process / printing process and the removal of the test pad portion 9, the external lead 3 is cut to the original length and bent into a predetermined shape, or Simultaneously with the removal of the test pad portion 9, only the original length of the external lead 3 is cut, and further, a semiconductor device is processed through a lead processing step of separating the semiconductor device from the frame 1a of the lead frame 1A. It is intended to produce.

With the frame 1a portion of the lead frame 1A left, the lead frame 1A is cut into semiconductor device units,
Since the semiconductor device is manufactured through a manufacturing process such as a test process, a printing process, and a lead processing process such as separation from the frame 1a of the lead frame 1A and cutting and bending into the final length and shape of the external lead 3, sealing is performed. Regardless of the size and shape of the portion 2, the lead frame 1A can be used for handling, and since the transportation mode can be the same, the transportation means can be made common,
Further, since the semiconductor device 4 can be positioned by the frame 1a of the lead frame 1A, the positioning property is high.
There is an effect that a highly productive manufacturing method can be obtained in which the frame 1a of the lead frame 1A can be protected to some extent from damage such as bending of the external lead 3.

Example 5. A fifth embodiment of the present invention will be described with reference to FIGS. 20 to 27. Figure 20
Is a state in which the cutting lines X1 and X2 indicated by alternate long and short dash lines are cut on the extension of the external lead of the semiconductor device from the lead frame state according to the above-described first embodiment, and further separated from the lead frame in semiconductor device units. It is a top view shown.
Further, FIG. 21 is a front view thereof.

In addition, FIG. 22 is a cross-sectional view taken along the cutting lines X1 and X2 indicated by the alternate long and short dash line in the extension of the external leads of the semiconductor device from the lead frame state according to the above-described first embodiment.
Further, it is a plan view showing a state in which the semiconductor device is separated from the lead frame and the external leads are bent into a predetermined shape. Further, FIG. 23 is a front view thereof.

FIG. 24 is a plan view showing a state where an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. 20 and 21. Further, FIG. 25 is a front view thereof. Further, FIG. 26 is a plan view showing a state in which an electrical characteristic test is being performed in the manufacturing process of the semiconductor device of FIGS. 22 and 23. Also,
FIG. 27 is a front view thereof.

20 to 27, a holder 7 is brought into contact with the test pad portion 9 for testing the semiconductor device 4 and holds and fixes the contact piece 5 connected to the test device (not shown). The test contactors 8B and 8C composed of 6 are formed such that the sealing portion 2 of the semiconductor device 4 or the sealing portion 2 of the semiconductor device 4 and the bent external lead 3 are fitted, and It is a pedestal for positioning and holding by a groove 8b or the like for guiding the sealing portion 2 which is a unit of the device 4.

The semiconductor device 4 is handled by guiding the sealing portion 2 through the groove 8b and the like, sequentially transferred and positioned and held, and the semiconductor device 4 is manufactured through a manufacturing process such as a test process. .

That is, in the method of manufacturing the semiconductor device according to the fifth embodiment of the present invention, the semiconductor device 4 is provided outside the sealing portion 2.
Of the semiconductor device in which the test pads 9 are formed wider than the original width of the external leads 3 and between the extension of each external lead 3 forming part and the frame 1a part of the lead frame 1A. After the semiconductor chip is die-bonded and wire-bonded on the lead frame and sealed with resin, the external leads 3 of the semiconductor device 4 are cut and bent (lead processing step).
In the manufacturing process of the semiconductor device such as performing individual electrical characteristics and environmental test of (1) (test process) and printing the trademark / type name / serial number on the sealing portion 2 of the semiconductor device 4 (printing process) , The test pad portion 9 is left and the test pad portion 9 and the frame 1a portion of the lead frame 1A are cut, or after cutting, the external lead 3 is bent into a predetermined shape, and the lead frame 1A In a state where the semiconductor device is separated from the frame 1a, at the same time as the test process / printing process and the removal of the test pad part 9, the external lead 3 is cut to the original length and bent into a predetermined shape, or the test pad part 9 is formed. The semiconductor device is manufactured through a lead processing step in which only the original length of the external lead 3 is cut at the same time as the removal.

In a state of being separated from the frame 1a of the lead frame 1A for each semiconductor device, a manufacturing process such as a test process, a printing process, and a lead processing process such as cutting and bending to the length and shape of the final external lead 3 is performed. Since the semiconductor device is manufactured, there is an effect that it can be manufactured by almost conventional technology and equipment, and a highly economical manufacturing method can be obtained.

Example 6. A sixth embodiment of the present invention will be described with reference to FIGS. 28 and 29. FIG. 28 is a plan view showing a test contactor for a semiconductor device according to a sixth embodiment of the present invention, showing a state in which the semiconductor device is being tested. Further, FIG. 29 is a front view thereof.

In FIGS. 28 and 29, reference numeral 5 denotes a contact piece connected to a test device (not shown) for testing the external lead 3 of the semiconductor device 4 and protruding from one surface of the semiconductor device 4. The external leads 3 are arranged so as to alternately face the test pad portions 9 on the extension of the external leads 3.

Here, the pitch of each contact piece 5 is twice the pitch of the external leads 3 of the semiconductor device 4. 6 is a holder for holding the contact piece 5, 7A and 7B
Is a test contactor composed of the contact piece 5 and the holder 6, and 8B is a pedestal for positioning and holding the semiconductor device 4.

Regarding the operation, the semiconductor device 4 is positioned and held on the pedestal 8B, and the contact pieces 5 of the test contactors 7A and 7B are all at the same time, and the test pad portion 9 on the extension of the external lead 3 of the semiconductor device 4 is tested. The semiconductor device 4 is brought into contact with the semiconductor device 4 and an electrical characteristic test is performed with the test device.

As described above, the test contactor according to the sixth aspect of the present invention has the original external lead 3 on the extension of the portion forming the external lead 3 of the semiconductor device 4 outside the sealing portion 2. In the test contactor for conducting the electrical characteristic test of the semiconductor device 4 in which the test pad portions 9 are formed in a staggered manner, the extension of the external lead 3 in units of the external lead protruding from one surface of the semiconductor device 4 The contact piece 5 to be brought into contact with the test pad section 9 is alternately arranged to face each other.

Contact piece 5 to be brought into contact with the test pad section 9
Are arranged so as to face each other and the pitch of the contact pieces 5 is twice as large as that of the external leads 3. Therefore, even if the external leads 3 of the semiconductor device 4 have a small pitch, high technology and high precision are required. The effect is to obtain a test contactor that is easy to manufacture and assemble.

Example 7. Embodiment 7 of the present invention will be described with reference to FIGS. 30 to 37. 30 and 32 are plan views showing a state in which the semiconductor device shown in FIGS. 12 and 14 is housed in a tray that houses and positions and holds the semiconductor device. 31 and 33 are front views thereof.

30 to 37, 10 and 10A are trays that can accommodate a plurality of semiconductor devices 4 shown in FIGS. The trays 10 and 10A are provided with pockets 10a capable of positioning the sealing portion 2 of the semiconductor device 4, and the lead frame 1A of the semiconductor device 4 is provided with pins 10c.
It is positioned by the hole 1c. Also, the tray 10
And holes 10b are provided for handling and positioning 10A itself.

FIGS. 34 and 36 are plan views showing a state in which the semiconductor device shown in FIGS. 20 and 22 is stored in a tray for storing and positioning and holding the semiconductor device. Further, FIG. 35 and FIG. 37 are front views thereof.

34 to 37, similarly,
Reference numerals 10B and 10C are trays that can accommodate a plurality of semiconductor devices 4 shown in FIGS. The trays 10B and 10C have pockets 10a capable of semi-positioning the sealing portion 2 of the semiconductor device 4, and the groove 10d positions the sealing portion 2 of the semiconductor device 4. Also, similarly, tray 10B
And 10C themselves are provided with holes 10b for handling and positioning.

In operation, the tray 10 as described above,
10A, 10B and 10C are used consistently in the manufacturing process of the semiconductor device 4.

As described above, in the method of manufacturing a semiconductor device according to the seventh embodiment of the present invention, the test pad portion 9 is left and the test pad portion 9 and the frame 1a portion of the lead frame 1A are cut off, or After cutting, the outer lead 3 is bent into a predetermined shape, and the frame 1 of the lead frame 1A is cut.
A semiconductor device in which the lead frame 1A is cut for each semiconductor device with the portion a left, or between the test pad portion 9 and the frame 1a portion of the lead frame 1A with the test pad portion 9 left, or after cutting , External lead 3
Is bent into a predetermined shape, and further, trays 10 and 10A for accommodating and holding a plurality of semiconductor devices separated from the lead frame 1A in units of semiconductor devices, respectively.
The semiconductor device is manufactured through a test process, a printing process, and a lead processing process while the semiconductor device is housed in 10B and 10C.

The semiconductor devices are housed in the trays 10, 10A, 10B and 10C for housing and holding a plurality of semiconductor devices 4, and are used for manufacturing consistently in manufacturing processes such as a test process, a printing process and a lead processing process. Therefore, since the semiconductor device 4 is not directly handled, damage to the external leads 3 can be reduced, and since the transporting form can be the same, the transporting means can be shared, and a plurality of semiconductor devices can be simultaneously handled. There is an effect that a high manufacturing method can be obtained.

Example 8. Embodiment 8 of the present invention will be described with reference to FIGS. 38 to 41. Figure 38
FIG. 15 is a plan view showing a state in which the semiconductor device shown in FIGS. 12 and 14 is housed in a tray that houses and positions and holds the semiconductor device. Further, FIG. 39 is a view showing a cross section of a main part of a test in a test process of a semiconductor device. Further, FIGS. 40 and 41 are a plan view and a front view showing a state where an actual test is performed using the tray of this embodiment.

38 to 41, 11 is a tray which can accommodate a plurality of semiconductor devices 4 shown in FIGS. 12 and 14. The tray 11 is the sealing unit 2 of the semiconductor device 4.
Is provided with a pocket 11a that can be positioned, and the sealing portion 2 of the semiconductor device 4 is positioned by the groove 11d. Also,
12 is a pin 12a of the semiconductor device 4 from the outside of the tray 11.
Is a pusher for positioning and holding the hole 1c of the lead frame 1A of the semiconductor device 4 and pushing up from the lower side of the tray 11. A through hole 11e through which the pusher 12 can pass is formed in the pocket 11a. Also, the hole 1 for handling and positioning the tray 11 itself.
1b is provided.

As an operation, after the tray 11 which has been handled is positioned by the hole 11b of the tray 11, the pusher 12 is moved upward and the pin 12a of the pusher 12 is used to move the hole 1c of the lead frame 1A of the semiconductor device 4.
Then, the semiconductor device 4 is positioned and held and pushed up, and the contact piece 5 of the test contactor 7 is pressed against the test pad portion 9 on the extension of the external lead 3 of the semiconductor device 4 for testing. In addition, the tray 11 as described above is consistently used for manufacturing in the manufacturing process of the semiconductor device 4.

In the method of manufacturing the semiconductor device according to the eighth embodiment of the present invention, as described above, the semiconductor device 4 can be quasi-positioned by each pocket 11a, and the semiconductor device 4 is positioned so that the semiconductor device 4 is positioned. Tray 1 provided with a through hole 11e through which a pusher 12 for pushing up can pass
1 is used to manufacture a semiconductor device.

The semiconductor device 4 is positioned on the mounting portion of each semiconductor device of the tray 11, and a predetermined through hole 11e through which the pusher 12 pushing up the semiconductor device 4 from the tray 11 can pass is provided. Processing such as test / printing and lead processing work can be performed near the upper part of the tray 11 without taking it out to the outside, and a mechanism for transporting the semiconductor device 4 to the outside of the tray 11 is not required, which enables high-speed processing and is simple. It is effective in obtaining inexpensive manufacturing equipment.

[0087]

As described above, the lead frame of the semiconductor device according to the first aspect of the present invention has the above-mentioned structure between the extension of the external lead and the frame of the lead frame outside the sealing portion of the semiconductor device. Wider than the width of the external leads, and arranged in a staggered pattern, and equipped with a test pad that can be contacted by the test contactor, it is possible to secure a large contact area for the test contactor without the need for high precision. There is an effect that it is possible to make contact, and it is possible to significantly reduce the defect rate without lowering the yield due to contact failure or the like when the semiconductor device is tested.

As described above, the lead frame of the semiconductor device according to the second aspect of the present invention has the external lead between the extension of the external lead and the frame of the lead frame outside the sealing portion of the semiconductor device. Wider than the width of the test contact, the zigzag pattern is provided, and the solder plating is not applied, and the test contactor has a contact pad that allows contact with the test contactor. Further, there is an effect that the contactor of the contactor piece of the test contactor can be significantly reduced without dropping off, a stable contact state can be obtained, and a test contactor having a long life can be obtained.

As described above, the method of manufacturing a semiconductor device according to a third aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. Wider than the width of the test pad portion, and forming a test pad portion in a staggered pattern, a semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and a test pad portion. A lead cutting step of cutting between the test pad portion and the frame of the lead frame,
A test step of performing an individual test of each semiconductor device in a lead frame state in which a plurality of semiconductor devices are connected, a printing step of printing a mark on the semiconductor device in a lead frame state in which a plurality of semiconductor devices are connected, and the test pad At the same time as the removal of the portion, a lead processing step of cutting the semiconductor device to the original length of the external lead and separating the semiconductor device from the frame of the lead frame is included. Regardless of the size and shape of the stop, handling can be done by the lead frame, the carrying mode can be similar, and the carrying means can be shared, and the positioning of the semiconductor device can be performed by the frame of the lead frame. It can be made high, and the lead frame frame protects external leads from bending and other damage to some extent. An effect that theft can be.

As described above, the method of manufacturing a semiconductor device according to a fourth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. Wider than the width of the test pad portion, and forming a test pad portion in a staggered pattern, a semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and a test pad portion. A lead cutting step of cutting between the test pad portion and the frame of the lead frame,
A test step of performing an individual semiconductor device test in a state in which the lead frame is cut in semiconductor device units leaving the lead frame frame, and a state in which the lead frame is cut in semiconductor device units leaving the lead frame frame And a step of printing a mark on the semiconductor device, and at the same time as removing the test pad portion, cutting to the original length of the external lead of the semiconductor device, and separating the semiconductor device from the frame of the lead frame. Since it includes a processing step, it can be handled by the lead frame regardless of the size and shape of the sealing portion, and the transportation mode can be the same, so that the transportation means can be made common and the frame of the lead frame can be used for the semiconductor device. Since the positioning of the lead frame can improve the positioning performance, the lead frame frame can damage the external leads such as bending. An effect that it is possible to some extent protected against.

As described above, the method of manufacturing a semiconductor device according to a fifth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. Wider than the width of the test pad portion, and forming a test pad portion in a staggered pattern, a semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and a test pad portion. A lead cutting step of cutting between the test pad portion and the frame of the lead frame,
A test step of performing an individual semiconductor device test in a state of being separated from the lead frame frame into semiconductor device units, and a printing step of printing a mark on the semiconductor device in a state of being separated from the lead frame frame into semiconductor device units And a lead processing step of cutting the test pad portion and cutting to the original external lead length of the semiconductor device at the same time,
Since it can be manufactured by almost the conventional technology and equipment, it is possible to improve the economical efficiency.

As described above, the test contactor for a semiconductor device according to a sixth aspect of the present invention is, outside the sealing portion of the semiconductor device, extending the external lead, wider than the width of the external lead, and staggered. Since the contact pieces arranged in contact with the test pad portion of the semiconductor device arranged alternately and facing each other are provided, even if the external leads of the semiconductor device have a small pitch, advanced technology and high accuracy are provided. The effect of being easy to manufacture and assemble without the need for.

As described above, the method of manufacturing a semiconductor device according to a seventh aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. Wider than the width of the test pad portion, and forming a test pad portion in a staggered pattern, a semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and a test pad portion. A lead cutting step of cutting between the test pad portion and the frame of the lead frame,
A test step of cutting the lead frame in units of semiconductor devices and performing a test of each semiconductor device in a state where a plurality of the semiconductor devices are stored in a tray, and the semiconductor device in a state where a plurality of the semiconductor devices are stored in the tray And a lead processing step of removing the test pad portion and cutting the semiconductor device to the original length of the external leads while the plurality of semiconductor devices are stored in the tray. Since it does not directly handle the semiconductor device, damage to the external leads can be reduced, and since the transport mode can be similar, the transport means can be made common,
Further, there is an effect that it is possible to increase the productivity such as handling a plurality of pieces at the same time.

As described above, the semiconductor device manufacturing method according to the eighth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. Wider than the width of the test pad portion, and forming a test pad portion in a staggered pattern, a semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and a test pad portion. A lead cutting step of cutting between the test pad portion and the frame of the lead frame,
A test step of cutting the lead frame into semiconductor device units, accommodating a plurality of the semiconductor devices in a tray, and performing a test of each semiconductor device with the semiconductor device being pushed up, and the semiconductor device being pushed up. Since it includes a printing process of printing a mark on the semiconductor device and a lead processing process of cutting the test pad portion in the pushed-up state at the same time as cutting to the original external lead length of the semiconductor device, the semiconductor device is exposed to the outside. It is possible to perform processing such as testing, printing, and lead processing work near the top of the tray without taking it out, and a mechanism for transporting the semiconductor device to the outside of the tray is not required, and high-speed processing is possible. The effect is that it can be realized with inexpensive manufacturing equipment.

[Brief description of drawings]

FIG. 1 is a plan view showing a lead frame of a semiconductor device in which a plurality of semiconductor devices according to a first embodiment of the present invention are connected in series.

FIG. 2 is a front view showing a lead frame of a semiconductor device in which a plurality of semiconductor devices according to the first embodiment of the present invention are connected in series.

FIG. 3 is a plan view showing a lead frame of a semiconductor device in which a plurality of semiconductor devices according to a second embodiment of the present invention are connected in series.

FIG. 4 is a plan view showing a lead frame used in a method of manufacturing a semiconductor device according to a third embodiment of the invention.

FIG. 5 is a front view showing a lead frame used in a method of manufacturing a semiconductor device according to a third embodiment of the invention.

FIG. 6 is a plan view showing another lead frame used in the method of manufacturing a semiconductor device according to the third embodiment of the invention.

FIG. 7 is a front view showing another lead frame used in the method for manufacturing the semiconductor device according to the third embodiment of the present invention.

FIG. 8 is a plan view showing a test process of a semiconductor device manufacturing method according to a third embodiment of the present invention.

FIG. 9 is a front view showing a test step of the method for manufacturing the semiconductor device according to the third embodiment of the invention.

FIG. 10 is a plan view showing a test step of the semiconductor device manufacturing method according to the third embodiment of the present invention.

FIG. 11 is a front view showing a test step of the method for manufacturing the semiconductor device according to the third embodiment of the invention.

FIG. 12 is a plan view showing a lead frame used in a method of manufacturing a semiconductor device according to a fourth embodiment of the invention.

FIG. 13 is a front view showing a lead frame used in a method of manufacturing a semiconductor device according to a fourth embodiment of the invention.

FIG. 14 is a plan view showing another lead frame used in the method of manufacturing a semiconductor device according to the fourth embodiment of the invention.

FIG. 15 is a front view showing another lead frame used in the method for manufacturing a semiconductor device according to the fourth embodiment of the present invention.

FIG. 16 is a plan view showing a test step of the semiconductor device manufacturing method according to the fourth embodiment of the present invention.

FIG. 17 is a front view showing a test step of the method for manufacturing the semiconductor device according to the fourth embodiment of the invention.

FIG. 18 is a plan view showing a test step of the method for manufacturing the semiconductor device according to the fourth embodiment of the invention.

FIG. 19 is a front view showing a test step of the method for manufacturing the semiconductor device according to the fourth embodiment of the invention.

FIG. 20 is a plan view showing a semiconductor device used in a method for manufacturing a semiconductor device according to a fifth embodiment of the present invention.

FIG. 21 is a front view showing a semiconductor device used in the method for manufacturing a semiconductor device according to the fifth embodiment of the present invention.

FIG. 22 is a plan view showing another semiconductor device used in the method for manufacturing a semiconductor device according to the fifth embodiment of the present invention.

FIG. 23 is a front view showing another semiconductor device used in the method for manufacturing a semiconductor device according to the fifth embodiment of the present invention.

FIG. 24 is a plan view showing a test step of the semiconductor device manufacturing method according to the fifth embodiment of the present invention.

FIG. 25 is a front view showing a test step of the semiconductor device manufacturing method according to the fifth embodiment of the present invention.

FIG. 26 is a plan view showing a test step of the method for manufacturing the semiconductor device according to the fifth embodiment of the present invention.

FIG. 27 is a front view showing a test step of the method for manufacturing the semiconductor device according to the fifth embodiment of the invention.

FIG. 28 is a plan view showing a test contactor for a semiconductor device according to Embodiment 6 of the present invention.

FIG. 29 is a front view showing a test contactor for a semiconductor device according to a sixth embodiment of the present invention.

FIG. 30 is a plan view showing a tray used in the method of manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 31 is a front view showing a tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 32 is a plan view showing another tray used in the method of manufacturing a semiconductor device according to the seventh embodiment of the invention.

FIG. 33 is a front view showing another tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 34 is a plan view showing another tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 35 is a front view showing another tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 36 is a plan view showing another tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 37 is a front view showing another tray used in the method for manufacturing a semiconductor device according to the seventh embodiment of the present invention.

FIG. 38 is a plan view showing a tray used in the method for manufacturing a semiconductor device according to the eighth embodiment of the present invention.

FIG. 39 is a sectional view showing a tray used in the method of manufacturing a semiconductor device according to the eighth embodiment of the present invention.

FIG. 40 is a front view showing a test step of the semiconductor device manufacturing method according to the eighth embodiment of the present invention.

FIG. 41 is a cross-sectional view showing a test step of the method for manufacturing the semiconductor device according to the eighth embodiment of the present invention.

FIG. 42 is a plan view showing a lead frame of a conventional semiconductor device.

FIG. 43 is a front view showing a lead frame of a conventional semiconductor device.

FIG. 44 is an enlarged view showing a portion A in FIG. 42.

FIG. 45 is a plan view showing a semiconductor device used in a conventional method for manufacturing a semiconductor device.

FIG. 46 is a front view showing a semiconductor device used in a conventional method for manufacturing a semiconductor device.

FIG. 47 is a plan view showing another semiconductor device used in the conventional method for manufacturing a semiconductor device.

FIG. 48 is a front view showing another semiconductor device used in the conventional method for manufacturing a semiconductor device.

FIG. 49 is a plan view showing a test process of a conventional semiconductor device manufacturing method.

FIG. 50 is a front view showing a test step of the conventional method for manufacturing a semiconductor device.

FIG. 51 is a plan view showing a test process of a conventional semiconductor device manufacturing method.

FIG. 52 is a front view showing a test step of the conventional semiconductor device manufacturing method.

[Explanation of symbols]

 1A Lead frame 1a Frame 1b Supporting part 1c Hole 2 Sealing part 3 External lead 4 Semiconductor device 5 Contact piece 6 Holder 7, 7A, 7B Test contactor 8, 8A, 8B, 8C Receptacle 8a Pin 8b Groove 9 Test pad Part 10, 10A, 10B, 10C Tray 10a Pocket 10b Hole 10c Pin 10d Groove 11 Tray 11a Pocket 11b Hole 11c Pin 11d Groove 11e Through Hole 12 Pusher 12a Pin X1 Cutting Line X2 Cutting Line X3 Cutting Line X4 Cutting Line

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[Procedure amendment]

[Submission date] September 29, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 4

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 5

[Correction method] Change

[Correction content]

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 7

[Correction method] Change

[Correction content]

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 8

[Correction method] Change

[Correction content]

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

A method of manufacturing a semiconductor device according to a third aspect of the present invention includes the following steps. [1] A test pad portion, which is wider than the width of the external lead and is staggered, is formed outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame.
A semiconductor device forming process in which a semiconductor chip is die-bonded and wire-bonded on a frame to be resin-sealed. [ 2 ] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [ 3 ] A test process in which each semiconductor device is tested in a lead frame state in which a plurality of semiconductor devices are connected. [ 4 ] A printing step of printing a mark on the semiconductor device in a lead frame state in which a plurality of the semiconductor devices are connected. [ 5 ] A lead processing step in which the semiconductor device is separated from the frame of the lead frame by cutting to the original length of the external lead of the semiconductor device simultaneously with the removal of the test pad portion.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0027

[Correction method] Change

[Correction content]

A method of manufacturing a semiconductor device according to a fourth aspect of the present invention includes the following steps. [1] A test pad portion, which is wider than the width of the external lead and is staggered, is formed outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame.
A semiconductor device forming process in which a semiconductor chip is die-bonded and wire-bonded on a frame to be resin-sealed. [ 2 ] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [ 3 ] A test step of performing a test of each semiconductor device in a state where the lead frame is cut into semiconductor device units while leaving the frame of the lead frame. [ 4 ] A printing step of printing a mark on the semiconductor device in a state where the lead frame is cut in units of semiconductor devices while leaving the frame of the lead frame. [ 5 ] A lead processing step in which the semiconductor device is separated from the frame of the lead frame by cutting to the original length of the external lead of the semiconductor device simultaneously with the removal of the test pad portion.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Change

[Correction content]

A method of manufacturing a semiconductor device according to a fifth aspect of the present invention includes the following steps. [1] A test pad portion, which is wider than the width of the external lead and is staggered, is formed outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame.
A semiconductor device forming process in which a semiconductor chip is die-bonded and wire-bonded on a frame to be resin-sealed. [ 2 ] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [ 3 ] A test step of performing a test on each semiconductor device in a state where the semiconductor device is separated from the frame of the lead frame. [ 4 ] A printing step of printing a mark on the semiconductor device in a state of being separated from the frame of the lead frame for each semiconductor device. [ 5 ] A lead processing step of removing the test pad portion and simultaneously cutting it into the original length of the external lead of the semiconductor device.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

A method of manufacturing a semiconductor device according to a seventh aspect of the present invention includes the following steps. [1] A test pad portion, which is wider than the width of the external lead and is staggered, is formed outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame.
A semiconductor device forming process in which a semiconductor chip is die-bonded and wire-bonded on a frame to be resin-sealed. [ 2 ] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [ 3 ] A test step in which the lead frame is cut into semiconductor device units, and individual semiconductor device tests are performed in a state where a plurality of semiconductor devices are stored in a tray. [ 4 ] A printing step of printing a mark on the semiconductor device in a state where a plurality of the semiconductor devices are stored in the tray. [ 5 ] A lead processing step in which a plurality of the semiconductor devices are stored in the tray and the test pad portion is removed, and at the same time, the semiconductor device is cut into the original external lead length.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

A method of manufacturing a semiconductor device according to an eighth aspect of the present invention includes the following steps. [1] A test pad portion, which is wider than the width of the external lead and is staggered, is formed outside the sealing portion of the semiconductor device and between the extension of the external lead and the frame of the lead frame.
A semiconductor device forming process in which a semiconductor chip is die-bonded and wire-bonded on a frame to be resin-sealed. [ 2 ] A lead cutting step of cutting between the test pad portion and the frame of the lead frame while leaving the test pad portion. [ 3 ] A test step in which the lead frame is cut into semiconductor device units, a plurality of the semiconductor devices are housed in a tray, and each semiconductor device is tested while the semiconductor device is being pushed up. [ 4 ] A printing step of printing a mark on the semiconductor device in the pushed state. [ 5 ] A lead processing step in which the test pad portion is removed and the semiconductor device is cut into the original external lead length in the pushed-up state.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0089

[Correction method] Change

[Correction content]

As described above, the method of manufacturing a semiconductor device according to a third aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. A semiconductor device forming step of die-bonding and wire-bonding a semiconductor chip onto a lead frame having a staggered test pad portion wider than the width of the test pad portion and leaving the test pad portion A lead cutting step for cutting between the lead frame and the frame of the lead frame; a test step for testing individual semiconductor devices in a lead frame state in which a plurality of semiconductor devices are connected; and a lead frame state in which a plurality of semiconductor devices are connected. In the printing process of printing a mark on the semiconductor device, the test pad portion is removed, and at the same time, the original external lead of the semiconductor device is removed. Since it includes a lead processing step of cutting the semiconductor device from the frame of the lead frame by cutting into a length of 1, the semiconductor device can handle a plurality of semiconductor devices at the same time, and the lead frame can be used regardless of the size and shape of the sealing portion. Handling can be done, and the transportation mode can be the same, so that the transportation means can be made common, and the positioning of the semiconductor device can be enhanced by the lead frame frame, and the positioning of the external lead can be improved by the lead frame frame. The effect that it can be protected to some extent from damage such as bending is obtained.

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0090

[Correction method] Change

[Correction content]

As described above, the method of manufacturing a semiconductor device according to a fourth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. A semiconductor device forming step of die-bonding and wire-bonding a semiconductor chip onto a lead frame having a staggered test pad portion wider than the width of the test pad portion and leaving the test pad portion A lead cutting step of cutting between the lead frame and the frame of the lead frame; a test step of performing a test of each semiconductor device in a state where the lead frame is cut in a semiconductor device unit while leaving the frame of the lead frame; A printing step of printing a mark on the semiconductor device in a state where the lead frame is cut in units of semiconductor devices leaving a frame frame; At the same time as removing the test pad portion, a lead processing step of cutting the semiconductor device to the original length of the external lead and separating the semiconductor device from the frame of the lead frame is included. Regardless of the shape, handling can be done by the lead frame, the transportation mode can be the same, the transportation means can be shared, and the positioning of the semiconductor device can be performed by the frame of the lead frame. There is an effect that the frame can protect the external leads to some extent from damage such as bending.

[Procedure Amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0091

[Correction method] Change

[Correction content]

As described above, the method of manufacturing a semiconductor device according to a fifth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. A semiconductor device forming step of die-bonding and wire-bonding a semiconductor chip onto a lead frame having a staggered test pad portion wider than the width of the test pad portion and leaving the test pad portion A lead cutting step of cutting between the lead frame and the lead frame; a test step of testing individual semiconductor devices in a state where the lead frame frame is separated into semiconductor device units; and a lead frame frame of the semiconductor device. A printing step of printing a mark on the semiconductor device in a state where the semiconductor device is separated into units, and the semiconductor device at the same time when the test pad portion is removed. Because it includes a read processing step of cutting the length of the original outer leads, it may be prepared by generally conventional techniques and equipment, an effect that it is possible to increase the economic efficiency.

[Procedure Amendment 14]

[Document name to be amended] Statement

[Correction target item name] 0093

[Correction method] Change

[Correction content]

As described above, the method of manufacturing a semiconductor device according to a seventh aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. A semiconductor device forming step of die-bonding and wire-bonding a semiconductor chip onto a lead frame having a staggered test pad portion wider than the width of the test pad portion and leaving the test pad portion And a lead cutting step of cutting between the frame of the lead frame, and a test step of cutting the lead frame for each semiconductor device and performing a test of each semiconductor device in a state where a plurality of the semiconductor devices are accommodated in a tray. A printing step of printing a mark on the semiconductor device with a plurality of the semiconductor devices housed in the tray; Because it includes a read processing step of cutting the length of the original external lead removal simultaneously with the semiconductor device of the test pad portion in a state in which a plurality accommodating location,
Since the semiconductor device is not directly handled, damage to external leads can be reduced, and since the transportation mode can be the same, it is possible to use a common transportation means, and further, it is possible to enhance productivity such as simultaneous handling of a plurality of devices. It has the effect of being able to.

[Procedure Amendment 15]

[Document name to be amended] Statement

[Correction target item name] 0094

[Correction method] Change

[Correction content]

As described above, the semiconductor device manufacturing method according to the eighth aspect of the present invention is arranged such that the external lead is provided outside the sealing portion of the semiconductor device between the extension of the external lead and the frame of the lead frame. A semiconductor device forming step of die-bonding and wire-bonding a semiconductor chip onto a lead frame having a staggered test pad portion wider than the width of the test pad portion and leaving the test pad portion And a lead cutting step of cutting between the frame of the lead frame and the lead frame, cutting the lead frame for each semiconductor device, accommodating a plurality of the semiconductor devices in a tray, and pushing each semiconductor device up. A test process of performing individual tests, a printing process of printing a mark on the semiconductor device in the pushed state, and a pushed process in the pushed state. At the same time as the removal of the test pad portion, a lead processing step of cutting the semiconductor device to the original length of the external lead is included. There is an effect that processing such as processing work can be performed, a mechanism for transferring the semiconductor device to the outside of the tray is not required, high-speed processing can be performed, and it can be realized by a simple and inexpensive manufacturing facility.

Claims (8)

[Claims] 1. A tester contactor is provided outside the sealing portion of the semiconductor device, between the extension of the external lead and the frame of the lead frame, wider than the width of the external lead and staggered. A lead frame for a semiconductor device, comprising a test pad portion. 2. A zigzag pattern, which is wider than the width of the external lead and is provided outside the encapsulation portion of the semiconductor device, between the extension of the external lead and the frame of the lead frame, and is not subjected to solder plating. A lead frame for a semiconductor device, comprising a test pad portion that a test contactor can contact. 3. A lead forming step of forming a test pad portion in a zigzag pattern wider than the width of the external lead and between the extension of the external lead and the frame of the lead frame outside the sealing portion of the semiconductor device. , A semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and lead cutting for cutting between the test pad portion and the frame of the lead frame leaving the test pad portion. A test step of conducting individual semiconductor device tests in a lead frame state in which a plurality of semiconductor devices are connected, a printing step of printing a mark on the semiconductor device in a lead frame state in which a plurality of semiconductor devices are connected,
And a lead processing step of separating the semiconductor device from the frame of the lead frame by cutting the test pad portion at the same time as cutting to the original length of the external lead of the semiconductor device. Method. 4. A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. , A semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and lead cutting for cutting between the test pad portion and the frame of the lead frame leaving the test pad portion. Step, a test step of conducting an individual semiconductor device test in a state where the lead frame is cut into semiconductor device units leaving the lead frame frame, and the lead frame is cut into semiconductor device units leaving the lead frame frame In the state of printing a mark on the semiconductor device, and removing the test pad portion, and simultaneously printing the semiconductor device book. A method of manufacturing a semiconductor device, comprising a lead processing step of cutting the semiconductor device to a conventional length of an external lead and separating the semiconductor device from a frame of the lead frame. 5. A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. , A semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and lead cutting for cutting between the test pad portion and the frame of the lead frame leaving the test pad portion. Step, a test step for conducting an individual semiconductor device test in a state where the semiconductor device is separated from the lead frame frame, a printing process in which a mark is printed on the semiconductor device in a state where the semiconductor device is separated from the lead frame frame And a lead processing step of removing the test pad portion and cutting to the original external lead length of the semiconductor device at the same time. A method for manufacturing a semiconductor device, comprising: 6. A test pad portion of a semiconductor device, which is wider than the width of the external lead and is staggered on the extension of the external lead outside the sealing portion of the semiconductor device,
A contactor for testing a semiconductor device, comprising contact pieces arranged so as to alternately face each other. 7. A lead forming step of forming a test pad portion in a zigzag shape wider than the width of the external lead and between the extension of the external lead and the frame of the lead frame outside the sealing portion of the semiconductor device. , A semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, and lead cutting for cutting between the test pad portion and the frame of the lead frame leaving the test pad portion. Step, a test step of cutting the lead frame in units of semiconductor devices and testing individual semiconductor devices in a state in which a plurality of semiconductor devices are stored in a tray, the semiconductor in a state in which a plurality of semiconductor devices are stored in the tray A printing step for printing a mark on the device, and a removal of the test pad portion in a state where a plurality of the semiconductor devices are stored in the tray. At the same time, a method of manufacturing a semiconductor device, which includes a lead processing step of cutting the semiconductor device to the original length of the external lead. 8. A lead forming step of forming test pad portions in a zigzag pattern wider than the width of the external leads between the extension of the external leads and the frame of the lead frame outside the sealing portion of the semiconductor device. , A semiconductor device forming step of die-bonding / wire-bonding a semiconductor chip on the lead frame and resin-sealing, lead cutting for cutting between the test pad portion and the frame of the lead frame leaving the test pad portion Process, cutting the lead frame in units of semiconductor devices, accommodating a plurality of the semiconductor devices in a tray, and performing a test of each semiconductor device in a state of pushing up the semiconductor device, a test process in which the semiconductor device is pushed up The printing process of printing a mark on the device, and the removal of the test pad portion in the pushed-up state and the original semiconductor device A method of manufacturing a semiconductor device, comprising: a lead processing step of cutting the external lead to a length.