JPH07288301A - Radiator fixture - Google Patents

Abstract

PURPOSE:To provide structure capable of replacing either a heat-generating device or a radiator, whichever is defective, without replacing both of them. CONSTITUTION:A wiring board 95 is provided with a semiconductor device and electronic parts 93 which become hot but provided with a radiator 90 for cooling it and a hook 30 on at least two places of the heater 93, and the heater 93 and the radiator 90 are interconnected by a radiator fixture which is provided with a radiator stop part 22 for holding down the radiator 90 and an arc spring part 24 having elasticity between the hook 30 and the radiator stop part 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises an LSI having a high heat generation density such as a high speed drive microcomputer, a semiconductor element such as a medium capacity thyristor and a power transistor, a heat sink for cooling them, and a heat pipe. The present invention relates to a connection with a radiator and a fixture.

[0002]

2. Description of the Related Art QFP (Quad Fla), which is a heating element
In the figure * which shows an example of attaching a heat pipe as a heat radiator to a ceramic package microcomputer by t Package), the heat radiator 90 is made of a material with high heat conductivity such as aluminum or copper. Department
The peripheral portion of 91 is machined so as to have the fin portion 92, and the central portion of the pillar portion 91 is closely mounted on the central plane of the QFP type macro computer which becomes the heating element 93. The generated heat is dissipated by the fin portion 92.

Conventionally, the heat radiating body 90 and the heat generating body 93 are joined and integrated by an epoxy resin, an adhesive or the like.

[0004]

In the above conventional technique, a semiconductor element such as a microcomputer serving as a heating element and a heat radiator are adhered and fixed with an adhesive, and the semiconductor element and the heat radiator are separated from each other. If necessary, for example, even if the semiconductor element is replaced due to a failure of only the semiconductor element, or conversely the radiator is damaged and only the radiator is desired to be replaced, the semiconductor element and the radiator are established as a set of parts. Therefore, it is necessary to exchange both of them.

Further, in the fixing means, work such as control and application of resin and adhesive, and when resin and adhesive are used, some time is required until they are cured, resulting in poor production efficiency. Also, the work is complicated.

The present invention has been made in view of the above problems. Even if a failure occurs in either the heat generating element or the heat radiating element, only one of the failed portions is replaced without replacing both of them. It is intended to have a structure that can be replaced.

[0007]

In order to solve the above-mentioned problems, in the present invention, a semiconductor device and an electronic component to be a heating element 93 are arranged on a wiring board 95, and a radiator 90 for cooling the heating element 93 is provided. In electric and electronic equipment, the hook 30 that hangs at least at two or more locations on the heating element 93, and the heat radiator.
The radiator fixing member includes a radiator pressing portion 22 that holds 90, and an elastic arc spring portion 24 between the hook 30 and the radiator pressing portion 22.

[0008]

[Function] With the above configuration, the heating element 93 or the radiator 90
Even if either one of them fails or is damaged, it is not necessary to replace both of them at the same time, and by removing the radiator fixing tool, the heating element 93 or the radiator 90 can be easily replaced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a side view in which a radiator fixing tool according to an embodiment of the present invention is attached to a heating element, and FIG.
Shown in. In FIGS. 1 and 2, a semiconductor device or a microcomputer serving as a heating element 93 is arranged on a wiring board 95, and a radiator 90 is mounted on the heating element 93 without interposing an epoxy resin, an adhesive, or the like. The heat generating element 93 and the heat radiating element 90 are integrated by using a heat radiating element fixing tool described later.

The above-mentioned heat radiator fixing member is equivalent to the heat radiator fixing portion 20.
As shown in FIG. 4, a side view of the radiator fixing portion 20 is shown in FIG. 3, and a top view of the hook 30 is shown in FIG.
The side views are shown in FIG. 5, respectively.

In FIG. 3, the radiator fixing portion 20 is formed of a metal or a resin material and has a flat radiator holding portion 22 joined to the radiator 90.
There is a circular arc spring portion 24 having elasticity formed so as to draw a semi-circular arc in the vertical direction with respect to this, and further, both side extended portions, that is, both end portions of the radiator fixing portion 20, have a flat plate portion. A hook coupling portion 26 shaped like a letter is provided.

A hook 30 is arranged on the hook coupling portion 26 of the heat radiator fixing portion 20. A top view of the hook 30 is shown in FIG. 4, and a side view thereof is shown in FIG. In FIGS. 4 and 5, the hook 30 has a radiator fixing portion coupling portion 36 into which the “V” -shaped hook coupling portion 26 of the radiator fixing portion 20 is inserted. The hook 30 and the hook 30 are integrated to form a radiator fixing tool. Further, the hook 30 is provided with a heat radiating portion hooking portion 32 that hooks on a part of the heating element 93.

A structure for connecting the heat generating element 93 and the heat radiating element 90 in the above structure will be described. To further describe the configuration described above,
The heat radiating body holding portion 22 of the heat radiating body fixing portion 20 is arranged on the upper surface of the heat radiating body 90, the hooks 30 are hooked on at least two locations of the heat generating body 93, and are provided between the heat radiating body holding portion 22 and the hook 30. The elastic body pressing portion 22 presses the heat radiator 90 against the heat generating body 93 by the elastic force of the circular arc spring portion 24, so that both the heat generating body 93 and the heat radiator 90 are brought into close contact with each other.

In the above-described embodiment, the heating element 93 is placed horizontally on the wiring board 95 so that it is arranged on the radiator 90. However, the heating element is placed vertically on the wiring board 95. If it is, or even if it is placed horizontally, a radiator other than the top surface
If 90 can be fixed, the heat radiator 90 is not necessarily on the upper surface of the heat generator 93.
Also, the radiator fixing tool may not be arranged. Further, the radiator fixing portion 20 and the hook 30 are integrated by fitting each other after forming each, but these are integrated by insert molding, or made of metal, resin, or the like. The material may be integrally formed in advance.

[0015]

With the above structure, if either the conventional heat generating element 93 or the heat radiating element 90 fails or is damaged, the two must be replaced at the same time.
Only one of the damaged parts needs to be replaced, and the elasticity of the heat dissipation part hooking part 32 and the arc spring part 24 causes the heat generating element 93 and the heat dissipation element to be replaced.
90 thermal contact surface can be connected well.

Since the arc spring 24 has little change in the lateral direction with respect to the pressing direction of the radiator 90, the heating element 93 and the radiator 90
Even if there are variations in the dimensions, the proper pressing load can be maintained.

[Brief description of drawings]

FIG. 1 is a side view in which a radiator fixing tool according to an embodiment of the present invention is attached to a heating element.

FIG. 2 is a top view of FIG.

FIG. 3 is a side view of a radiator fixing portion.

FIG. 4 is a top view of a hook.

5 is a side view of FIG.

FIG. 6 is a perspective view of a conventional radiator and heating element.

FIG. 7 is a side view of a conventional radiator and heating element.

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. 20 heat sink fixing part 22 heat sink holding part 24 arc spring part 26 hook coupling part 30 hook 32 heat sink hooking part 36 heat sink fixing part coupling 90 heat sink 93 heat generator 95 wiring board

Claims (1)

[Claims] 1. A radiator for cooling a heating element, a hook that hangs at least at two or more locations on the heating element, a radiator holding portion for holding the radiator, and an elastic member between the hook and the radiator holding portion. A radiator fixing tool provided with an arc spring portion having.