JPH07288303A - Radiator fixing device - Google Patents

Abstract

PURPOSE:To provide structure capable of replacing either a heat-generating device or a radiator, whichever is defective, without replacing both of them, and also to simplify the operation of connecting and fixing the device and the radiator. CONSTITUTION:A wiring base board is provided with a semiconductor device and electronic parts which become a heat-generating device 12 and a radiator 20 for cooling, and the heater 12 and the radiator 20 are formed into one body without using a bonding agent by a radiator fixing device 30, and the radiator fixing device 30 is formed of a bottom surface and a side surface having elasticity about the bottom surface, and the end of a side surface 30b is made into an opening, and a radiator arrangement part is formed over the bottom surface from the lower part of the opening, and the side surface is in contact with the corner of the radiator 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises an LSI having a high heat generation density such as a high speed drive microcomputer, a semiconductor element such as a medium capacity thyristor and a power transistor, a heat sink for cooling them, and a heat pipe. The present invention relates to a device for connecting and fixing a radiator.

[0002]

2. Description of the Related Art QFP (Quad Fla), which is a heating element
FIG. 7 shows an example in which a heat sink serving as a heat radiator is attached to a ceramic package microcomputer at t Package), and a side view thereof is shown in FIG. Figure 7
8 and 8, the heat radiator 90 is machined using a material having high heat conductivity such as aluminum or copper so as to have the fin portion 92 around the heat conduction column portion 91, and the center of the column portion 91. The portion is closely mounted on the central plane of the QFP type macro computer which becomes the heating element 93, and the heat generated by the heating element 93 is radiated by the fin portion 92.

Conventionally, the heat radiating body 90 and the heat generating body 93 are joined and integrated by an epoxy resin, an adhesive or the like.

[0004]

In the above-mentioned prior art, when a semiconductor element which is a heat generating element and a heat radiating element are closely fixed to each other and separation is required between them, for example, a semiconductor element due to a failure of only the semiconductor element. However, even if the radiator is damaged and it is necessary to replace only the radiator, it is necessary to replace both of them because the semiconductor element and the radiator are established as a set of parts.

Further, in the fixing means, work such as control and application of resin and adhesive, and when resin and adhesive are used, some time is required until these are cured, resulting in poor production efficiency. Also, the work is complicated.

The present invention has been made in view of the above problems. Even if a failure occurs in either the heat generating element or the heat radiating element, it is sufficient to replace only the failed part without replacing both of them. The structure is intended to further simplify the work of connecting and fixing the heating element and the radiator.

[0007]

In order to solve the above-mentioned problems, according to the present invention, a semiconductor device and an electronic component to be a heating element 12 and a radiator 20 for cooling the heating element 12 are provided. In an electric / electronic component in which the radiator 20 is integrated by a radiator fixing device 30 without using an adhesive, the radiator fixing device 30 has a bottom surface 30a and a side surface having elasticity around the bottom surface 30a. 30b, the end of the side surface 30b is defined as an opening 50, and the bottom of the opening 50 extends from the bottom 30a.
A radiator disposing unit 52 is formed over the heat dissipating member 52, and the side surface 30b is in contact with the corner portion 20a of the heat dissipating member 20 to form a heat dissipator fixing device.

[0008]

With the above construction, even if either the heat generating body 12 such as an electronic component or the heat radiating body 20 such as a heat sink fails or is damaged, it is not necessary to replace both of them at the same time. Parts can be easily replaced by removing the heat radiator from the heat radiator fixing device that integrates the heat radiator 20 with the heat radiator 20.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a side view of a heat radiator fixing device as an embodiment of the present invention mounted on a heating element, and FIG. 2 shows a perspective view thereof. In FIGS. 1 and 2, a microcomputer serving as a heating element 12-12 is provided on the wiring board 10, and a heat pipe serving as a radiator 20 is arranged on the heating element 12-12. This heat pipe is a flat heat pipe,
The heat generated in the heating element 12 is released to suppress the temperature rise of the heating element 12 and its surroundings. In this embodiment, the heating elements 12-12 are connected to each other through one heat radiating body 20,
The heat generating body 12-12 and the heat radiating body 20 are in direct contact with each other without interposing an adhesive, a resin or the like, and the heat radiating body 20 is joined to the heat generating body 12 by a heat radiating body fixing device 30 described later. .

The heat radiator fixing device 30 is made of a plate material such as brass, stainless steel, phosphor bronze, aluminum, etc. The heat radiator fixing device 30 has a bottom surface 30a, side surfaces 30b-30b and a main body fixing portion.
The main body fixing portion 30C is provided with a screw hole 35 for fixing and fixing the heat radiator fixing device 30 to the wiring board 10 or a peripheral housing (not shown) or the like.
The radiator fixing device 30 is fixed by inserting 40 and fastening it to the female screw part attached to the wiring board 10 or the like.

Each of the side surfaces 30b-30b is a guide portion integrally formed with the bottom surface 30a for holding and fixing the radiator 20, and this shape has both sides 30b as shown in FIG. 3 which is a front view. The end of -30b forms an opening 50 from which the bottom surface 30a
There is a space that becomes the heat radiator placement portion 52 toward. An opening 50 is wide open on both side surfaces 30b-30b, and there is a narrowing from this opening 50 toward the bottom surface 30a.
The heat dissipating member disposing portion 52 is large enough to dispose. A side surface 30b extending from the opening 50 to the narrowing portion, the radiator placement portion 52, and the bottom surface 30a has a curved shape, and the bottom surface 30 is formed.
Elasticity is provided so that it can move to the left and right with respect to the insertion direction of the radiator 20 about the axis a, and due to this structure, even if there are variations in the dimensions of the radiator 20, the thickness, width and other dimensions are different. Even if it is replaced with another type of heat radiator, the corner portion 20a of the plate-shaped heat radiator 20 can be fixed by abutting against the inner wall of the side surface 30b, so that the heat radiator 20 can be prevented from being deformed and at the same time reliable heat radiation can be achieved. The body 20 can be fixed.

Incidentally, in the above embodiment, even if the main body fixing portion 30c is not provided, as shown in FIG. 4, the wiring board insertion pin 37 which can be inserted into the wiring board 10 or the surrounding housing is provided so as to be perpendicular to the bottom surface 30a. Thus, the main fixing device 30 may be attached and fixed to the wiring board 10.

Another embodiment of the present invention is shown in FIGS. As shown in FIG. 5, the radiator fixing device 30 is provided with the side surfaces 30b-30b which are linearly tapered without being curved, and the corner portions 20a-20a of the radiator 20 contact the side surfaces 30b-30b. Except for the parts described above, the description is omitted because it is the same as or equivalent to that described in the embodiment of FIGS. In FIG. 6, the side surfaces 30b-30b of each of the above embodiments are provided in a structure in which the side surfaces 30b-30b are provided substantially vertically from the bottom surface 30a, and the heat radiator pressing portions 34-34 are provided on the inner wall, and the corner portions of the heat radiator 20 are provided here. The description is omitted because it is the same as or equivalent to that described in the embodiment of FIGS. 1 and 4, except for the portion where the heat radiator 20 is fixed by contacting 20a-20a.

[0014]

According to the above construction, when either the heat generating body 12 such as an electronic component or the heat dissipating body 20 such as a heat pipe is broken or damaged, both of them must be replaced at the same time. However, it is sufficient to replace only the one that has failed or damaged.

Further, in the shape of the second embodiment, the radiator fixing device 30 can be attached and detached more easily than by screwing, and as in the third and subsequent embodiments, the radiator 20 is held by fixing this corner. Therefore, even if the radiator 20 is a flat plate heat pipe formed with a space inside,
Due to the elasticity of 30b-30b, it is possible to prevent the flat plate surface from being crushed, and a stable fixing of the radiator 20 can be obtained.

[Brief description of drawings]

FIG. 1 is a side view in which a radiator fixing device according to an embodiment of the present invention is mounted on a wiring board.

FIG. 2 is a perspective view of FIG.

FIG. 3 is a front view of FIG.

FIG. 4 is a perspective view showing a second embodiment of the present invention.

FIG. 5 is a front view of a radiator fixing device according to the third embodiment of the present invention mounted on a wiring board.

FIG. 6 is a front view of a radiator fixing device according to a fourth embodiment of the present invention mounted on a wiring board.

FIG. 7 is a perspective view of a conventional radiator and heating element.

FIG. 8 is a side view of a conventional radiator and heating element.

[Explanation of symbols]

 In the drawings, the same reference numerals indicate the same or corresponding parts. 10 Wiring Board 12 Heating Element 20 Radiator 30 Radiator Fixing Device 34 Radiator Holding Section 35 Screw Hole 37 Wiring Board Insertion Pin 40 Screw 50 Opening 52 Radiator Arrangement Section

Claims (1)

[Claims] 1. A semiconductor device serving as a heating element, an electronic component,
In an electric / electronic component including a radiator for cooling the heating element, the heating element and the radiator are integrated by a radiator fixing device without using an adhesive, and the radiator fixing device is a bottom surface. , The bottom surface is formed of a side surface having elasticity, the end portion of the side surface is defined as an opening, and a radiator placement portion is formed from a lower portion of the opening to the bottom surface, and the side surface contacts a corner portion of the radiator. Heat sink fixing device.