JPH0983165A - Cooling device for electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a cooling device in which an electronic component such as an IC package or the like is cooled by a heat sink by a method wherein the cooling device is provided with a spherical part which is curved in a direction opposite to the mounting side of a cooling fin and with a chip surface part which conducts a heat loss. SOLUTION: A board 4 is a board to which an electronic component 2 is attached. A heat loss which is generated in the electronic component 2 is dissipated to the air by a cooling fin 1b. A heat sink 1 is a cooling device to which the cooling fin 1b is attached. Studs 3 are used to attach the heat sink 1 to the board 4. S spherical part 1a is formed at the heat sink 1, and it is a part which is curved in a direction opposite to a mounting side to which the cooling fin 1b is attached. A chip surface part 5 is sandwiched between the spherical part 1a and the electronic component, and it conducts a heat loss. Thereby, the cooling operation of the chip surface part 5 is promoted. In addition, since the heat sink 1 can be attached without being influenced by the size and the weight of the heat sink 1, it is possible to deal with the high temperature of the IC 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device cooling device that cools electronic components with a heat sink.

[0002]

2. Description of the Related Art Conventionally, the heat generation density of various electronic components such as ICs used in electronic equipment has been increasing year by year. Under such circumstances, a heat dissipation component such as a heat sink is an indispensable condition, and is utilized for promoting heat generation of various electronic components such as ICs and ensuring reliability. Along with the increase in heat generation density of various electronic components such as ICs, heat dissipation components such as heat sinks also tend to be large or heavy (because of the attachment of fans). At this time, the method of fixing the heat dissipation component such as the heat sink is such that the thin lead wires of various electronic components such as IC are not stressed, so that they must be fixed around various electronic components such as IC. Also, I
Various electronic components such as C may be mounted on the substrate in an inclined state due to uneven soldering.

[0003]

DISCLOSURE OF THE INVENTION As mentioned above,
When mounting heat dissipation components such as heat sinks on various electronic components such as ICs that are mounted in a tilted state, since various electronic components such as ICs are mounted in a tilted state Contact cannot be made reliably, cooling performance deteriorates, and reliability is impaired. Also, adjustment work is required to mount various electronic components such as ICs horizontally with the studs.
There was a problem such as.

It is an object of the present invention to provide an electronic device cooling device for cooling various electronic components such as IC packages with a heat sink.

[0005]

SUMMARY OF THE INVENTION An electronic equipment cooling apparatus according to the present invention includes a substrate on which electronic components are mounted, cooling fins for radiating heat loss generated in the electronic components, a heat sink to which the cooling fins are attached, and a heat sink on the substrate. A stud to be mounted on the heat sink, a spherical surface portion of the heat sink that is curved in a direction opposite to the cooling fin mounting side, and a chip surface portion that is sandwiched between the spherical surface portion and the electronic component to transfer loss heat. There is. Further, the electronic device cooling device of the second aspect is characterized in that the stud is soldered, and the electronic device cooling device of the third aspect is characterized in that the heat sink is made of a plastically deformable material.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of an electronic device cooling apparatus of the present invention will be described. In FIG. 1, the substrate 4 is a plate to which the electronic component 2 is attached. The cooling fin 1b radiates the heat loss generated in the electronic component 2 to the atmosphere. Heat sink 1
Is a cooling device to which the cooling fin 1b is attached. The stud 3 attaches the heat sink 1 to the substrate 4. Spherical part 1
Reference numeral a denotes a portion of the heat sink 1 which is curved in a direction opposite to the mounting side on which the cooling fin 1b is mounted. The chip surface portion 5 is sandwiched between the spherical surface portion 1a and the electronic component 2 to transfer the heat loss. Further, the stud 3 can be soldered, and the heat sink 1 can be made of a plastically deformable material.

That is, a heat radiation component such as a heat sink having a spherical contact surface is mounted on various electronic components 2 such as an IC mounted in an inclined state to cool the chip surface portion 5 which is a heat source. The heat dissipation component of the heat sink 1 is fixed by screws via the studs 3. After being fixed, the heat radiating component forming the heat sink 1 has a structure in which the chip surface portion 5 can be reliably and widely contacted by plastic deformation.

The same effect can be obtained by using the heat sink according to the present technology.

The spherical portion means a substantially spherical surface, and includes elliptic spherical surfaces, parabolic spherical surfaces, cylindrical surfaces and other rounded surfaces.

Further, the heat sink may include an insulating spacer arranged between the heat sink and the electronic component.

[0011]

According to the present invention, cooling of the chip surface is promoted and high reliability can be obtained. Also, the size of the heat sink,
Since there is no influence on the weight and the heat sink can be attached, there is an effect that it can cope with high heat generation of the IC.

[Brief description of drawings]

FIG. 1 is a front view of an electronic device cooling apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of FIG.

[Explanation of symbols]

 1 Heat Sink 1a Spherical Part 1b Cooling Fin 2 Electronic Component 3 Stud 4 Board

Claims (3)

[Claims] 1. A substrate on which electronic components are mounted, a cooling fin for radiating heat loss generated in the electronic component, a heat sink to which the cooling fin is mounted, a stud for mounting the heat sink on the substrate, and the heat sink. An electronic device cooling device comprising: a spherical surface portion curved in a direction opposite to the cooling fin mounting side; and a chip surface portion sandwiched between the spherical surface portion and the electronic component to transmit the loss heat. 2. The electronic device cooling apparatus according to claim 1, wherein the stud is soldered. 3. The electronic device cooling apparatus according to claim 1, wherein the heat sink is made of a material that is plastically deformable.