JPH0726040A - Production of prepreg and production of epoxy resin laminate from the prepreg - Google Patents
Production of prepreg and production of epoxy resin laminate from the prepregInfo
- Publication number
- JPH0726040A JPH0726040A JP17282793A JP17282793A JPH0726040A JP H0726040 A JPH0726040 A JP H0726040A JP 17282793 A JP17282793 A JP 17282793A JP 17282793 A JP17282793 A JP 17282793A JP H0726040 A JPH0726040 A JP H0726040A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- epoxy resin
- resin
- laminate
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＣＥＭ−３材、すなわち
中間層をガラス不織布、表面層をガラス織布の基材を用
いたエポキシ樹脂積層板の製造方法、及びこのエポキシ
樹脂積層板の製造に有用なプリプレグの製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an epoxy resin laminate using a CEM-3 material, that is, a glass nonwoven fabric for the intermediate layer and a glass woven fabric for the surface layer, and the production of this epoxy resin laminate. The present invention relates to a method for producing a prepreg useful for
【０００２】[0002]
【従来の技術】プリント配線板としてパンチング可能な
ＣＥＭ−３材、すなわち中間層をガラス不織布、表面層
をガラス織布の基材を用いたエポキシ樹脂積層板が知ら
れている。近年、このＣＥＭ−３材の使用の増大に伴っ
て、吸湿後の耐熱性の向上が望まれている。2. Description of the Related Art A CEM-3 material which can be punched as a printed wiring board, that is, an epoxy resin laminated board using a glass nonwoven fabric as a middle layer and a glass woven substrate as a surface layer is known. In recent years, with the increasing use of this CEM-3 material, improvement in heat resistance after moisture absorption is desired.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記事実に鑑
みてなされたもので、その目的とするところは、パンチ
ング性が良好で、且つ吸湿後の耐熱性が優れるエポキシ
樹脂積層板の製造方法、及び、このエポキシ樹脂積層板
の製造に有用なプリプレグの製造方法を提供することに
ある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object of the present invention is to provide a method for producing an epoxy resin laminate having good punching properties and excellent heat resistance after moisture absorption. And a method for producing a prepreg useful for producing the epoxy resin laminate.
【０００４】[0004]
【課題を解決するための手段】本発明のプリプレグの製
造方法は、樹脂ワニスとして、ビスフェノールＡ型エポ
キシ樹脂１００重量部に対し、ノボラック型エポキシ樹
脂を１０〜１７重量部配合した樹脂ワニスを、ガラス不
織布に含浸させ、樹脂ワニスを半硬化させるプリプレグ
の製造方法であって、このプリプレグの１６０±３℃１
５分乾燥した揮発分が、０．６ｗｔ％以下とすることを
特徴とする。The method for producing a prepreg according to the present invention is a resin varnish containing a resin varnish prepared by mixing 10 to 17 parts by weight of a novolac type epoxy resin with 100 parts by weight of a bisphenol A type epoxy resin. A method for producing a prepreg in which a non-woven fabric is impregnated and a resin varnish is semi-cured.
It is characterized in that the volatile matter dried for 5 minutes is 0.6 wt% or less.
【０００５】本発明のエポキシ樹脂積層板の製造方法
は、中間層をガラス不織布、表面層をガラス織布の基材
を用いたプリプレグを重ね、加熱加圧するエポキシ樹脂
積層板の製造方法において、上記中間層のプリプレグに
請求項１記載のプリプレグを用いることを特徴とする。The method for producing an epoxy resin laminate according to the present invention is the same as the method for producing an epoxy resin laminate in which a prepreg using a substrate of a glass nonwoven fabric as an intermediate layer and a glass woven fabric as a surface layer is superposed and heated and pressed. The prepreg according to claim 1 is used as the prepreg of the intermediate layer.
【０００６】以下、本発明を詳細に説明する。本発明の
対象となるエポキシ樹脂積層板はＣＥＭ−３材、すなわ
ち中間層をガラス不織布、表面層をガラス織布の基材を
用いたエポキシ樹脂積層板である。The present invention will be described in detail below. The epoxy resin laminate which is the object of the present invention is a CEM-3 material, that is, an epoxy resin laminate which uses a glass nonwoven fabric for the intermediate layer and a glass woven substrate for the surface layer.
【０００７】本発明のプリプレグの製造方法は、ガラス
不織布に樹脂ワニスを含浸し、樹脂を半硬化させたプリ
プレグである。上記樹脂ワニスは、樹脂、及び必要によ
り硬化剤、溶剤、充填剤等から構成される。上記樹脂は
ビスフェノールＡ型エポキシ樹脂とノボラック型エポキ
シ樹脂を主成分として含有し、このビスフェノールＡ型
エポキシ樹脂１００重量部に対し、ノボラック型エポキ
シ樹脂が１０〜１７重量部配合される。ノボラック型エ
ポキシ樹脂が１０重量部未満であると、得られるエポキ
シ樹脂積層板の吸湿後の耐熱性が劣り、１７重量部を越
えると得られるエポキシ樹脂積層板が固くなり、パンチ
ング性が劣る。なお、上記エポキシ樹脂は、必要により
ブロム等で変成されてもよい。上記ガラス不織布は、エ
ポキシ樹脂積層板に用いられる公知の各種ガラス不織布
を用いればよい。The method for producing a prepreg of the present invention is a prepreg obtained by impregnating a glass nonwoven fabric with a resin varnish and semi-curing the resin. The resin varnish comprises a resin and, if necessary, a curing agent, a solvent, a filler and the like. The above resin contains a bisphenol A type epoxy resin and a novolac type epoxy resin as main components, and 10 to 17 parts by weight of the novolac type epoxy resin is mixed with 100 parts by weight of the bisphenol A type epoxy resin. When the amount of the novolac type epoxy resin is less than 10 parts by weight, the heat resistance after moisture absorption of the obtained epoxy resin laminate is poor, and when it exceeds 17 parts by weight, the epoxy resin laminate obtained is hard and the punching property is poor. The epoxy resin may be modified with bromine or the like, if necessary. As the above glass nonwoven fabric, various known glass nonwoven fabrics used for epoxy resin laminated plates may be used.
【０００８】本発明のガラス不織布を用いたプリプレグ
の製造方法においては、このプリプレグの１６０±３℃
１５分乾燥した揮発分が０．６ｗｔ％以下に制限され
る。上記揮発分が０．６ｗｔ％を越えると、得られるエ
ポキシ樹脂積層板の吸湿後の耐熱性が劣る。上記揮発分
は０．３ｗｔ％以下がより好ましい。上記揮発分を得る
方法は、樹脂ワニスに含有する溶剤等の沸点以上の温度
で５分以上乾燥して得られる。In the method for producing a prepreg using the glass nonwoven fabric of the present invention, the prepreg is produced at 160 ± 3 ° C.
Volatile matter dried for 15 minutes is limited to 0.6 wt% or less. When the volatile content exceeds 0.6 wt%, the heat resistance after moisture absorption of the obtained epoxy resin laminated plate is poor. The volatile content is more preferably 0.3 wt% or less. The method of obtaining the volatile matter is obtained by drying at a temperature not lower than the boiling point of the solvent contained in the resin varnish for 5 minutes or longer.
【０００９】本発明のエポキシ樹脂積層板の製造方法
は、上述のプリプレグの製造方法によって得られるプリ
プレグを中間層とし、この中間層の表面に、ガラス織布
の基材を用いたプリプレグを重ね、必要により銅箔等の
金属箔をさらに重ね、加熱加圧する。この加熱加圧によ
りプリプレグの樹脂が完全に硬化したエポキシ樹脂積層
板が得られる。上記表面に重ねるガラス織布の基材を用
いたプリプレグは、エポキシ樹脂を含む樹脂ワニスを半
硬化して得られたプリプレグである限り、エポキシ樹脂
の種類は特に限定しないが、接着性から中間層に用いる
プリプレグに使用したと同種の樹脂ワニスが好ましい。In the method for producing an epoxy resin laminate of the present invention, the prepreg obtained by the above-mentioned method for producing a prepreg is used as an intermediate layer, and the surface of this intermediate layer is overlaid with a prepreg using a glass woven base material. If necessary, a metal foil such as a copper foil is further stacked and heated and pressed. By this heating and pressing, an epoxy resin laminated plate in which the resin of the prepreg is completely cured can be obtained. The prepreg using the glass woven base material to be laid on the surface is not particularly limited as to the type of epoxy resin, as long as it is a prepreg obtained by semi-curing a resin varnish containing an epoxy resin, but the intermediate layer from the adhesive property. The resin varnish of the same kind as that used for the prepreg used in is preferable.
【００１０】このようにして得られたエポキシ樹脂積層
板は、パンチング性が良好で、且つ吸湿後の耐熱性が優
れる。The epoxy resin laminate thus obtained has good punching properties and excellent heat resistance after absorbing moisture.
【００１１】[0011]
実施例１ 樹脂として、ブロム化したビスフェノールＡ型エポキシ
樹脂（東都化成株式会社製ＹＤＢ５００）を１００重量
部（以下部と記す）、ノボラック型エポキシ樹脂（大日
本インキ株式会社製Ｎ６９０）を１４部、硬化剤とし
て、ジシアンジアミドを３部、２エチル４メチルイミダ
ゾールを０．０２部、充填剤として、水酸化アルミを９
０部、タルクを３０部、溶剤としてジメチルホルムアミ
ドを３０部配合したエポキシ樹脂の樹脂ワニスを用い
た。Example 1 As the resin, 100 parts by weight (hereinafter referred to as "part") of brominated bisphenol A type epoxy resin (YDB500 manufactured by Tohto Kasei Co., Ltd.), 14 parts of novolac type epoxy resin (N690 manufactured by Dainippon Ink and Chemicals, Inc.), 3 parts of dicyandiamide as a curing agent, 0.02 part of 2-ethyl-4-methylimidazole, and 9 parts of aluminum hydroxide as a filler.
A resin varnish of an epoxy resin containing 0 parts, 30 parts of talc, and 30 parts of dimethylformamide as a solvent was used.
【００１２】中間層のプリプレグは、重量７５ｇ／ｍ2
のガラス不織布に上記樹脂ワニスを含浸させ、１７０
℃、１０分乾燥させ、樹脂固形分が８５ｗｔ％のプリプ
レグを得た。このプリプレグを１６０±３℃１５分乾燥
した際の揮発分は０．４ｗｔ％であった。The prepreg of the intermediate layer has a weight of 75 g / m 2.
170 g of glass non-woven fabric is impregnated with the above resin varnish,
After drying at 10 ° C. for 10 minutes, a prepreg having a resin solid content of 85 wt% was obtained. When this prepreg was dried at 160 ± 3 ° C. for 15 minutes, the volatile content was 0.4 wt%.
【００１３】表面層のプリプレグは、重量２００ｇ／ｍ
2 のガラス織布に上記樹脂ワニスを含浸させ、１７０
℃、７分乾燥させ、樹脂固形分が４５ｗｔ％のプリプレ
グを得た。The surface layer prepreg has a weight of 200 g / m.
The glass woven fabric of 2 is impregnated with the above resin varnish, and 170
C. and dried for 7 minutes to obtain a prepreg having a resin solid content of 45 wt%.
【００１４】上記ガラス不織布を用いたプリプレグを中
間層とし、上記ガラス織布を用いたプリプレグを表面に
重ね、さらに３５μｍの銅箔を両側に重ね、温度１７０
℃、圧力３０ｋｇ／ｃｍ2 で加熱加圧して厚さ１．６ｍ
ｍのエポキシ樹脂積層板を得た。The prepreg using the above glass nonwoven fabric is used as an intermediate layer, the prepreg using the above glass woven fabric is laid on the surface, and copper foil of 35 μm is laid on both sides, and the temperature is set to 170.
1.6m thick by heating and pressing at 30 ℃ / pressure of 30kg / cm 2.
m epoxy resin laminated board was obtained.
【００１５】得られたエポキシ樹脂積層板の吸湿後の耐
熱性とパンチング性を評価した。上記吸湿後の耐熱性
は、エッチングにより銅箔を除去した上記エポキシ樹脂
積層板の試験片を圧力２ｋｇ／ｃｍ2 、時間１２０分で
ＰＣＴ処理をした後に、２６０℃の半田に２０秒浸漬し
た。浸漬後に、試験片の外観を観察し、異常の有無を調
べ、異常のないものは合格、ふくれやミ−ズリングと称
す剥離の発生しているものは不合格とした。The heat resistance and punching property of the obtained epoxy resin laminated plate after moisture absorption were evaluated. Regarding the heat resistance after moisture absorption, the test piece of the epoxy resin laminated plate from which the copper foil was removed by etching was subjected to PCT treatment at a pressure of 2 kg / cm 2 for a time of 120 minutes, and then immersed in solder at 260 ° C. for 20 seconds. After the immersion, the appearance of the test piece was observed, and the presence or absence of abnormality was examined. If there was no abnormality, the specimen passed, and if peeling called blistering or maze ring occurred, it was rejected.
【００１６】上記パンチング性は、得られたエポキシ樹
脂積層板を室温で直径５．０ｍｍと２．０ｍｍの穴をパ
ンチングした後に、この穴の周囲を観察し、異常の有無
を調べ、異常のないものは合格、剥離が発生しているも
のは不合格とした。結果は表１のとおり、吸湿後の耐熱
性、パンチング性とも良好であった。Regarding the punching property, after punching holes of 5.0 mm and 2.0 mm in diameter at room temperature of the obtained epoxy resin laminated plate, the periphery of the holes is observed to check whether there is any abnormality. Those that passed were judged to be rejected, and those in which peeling had occurred were rejected. As shown in Table 1, the results were good in both heat resistance and punching property after moisture absorption.
【００１７】実施例２ ノボラック型エポキシ樹脂を１７部とした以外は実施例
１と同様にして樹脂ワニスを配合した。中間層のプリプ
レグは、実施例１と同種のガラス不織布を用い、上記樹
脂ワニスを含浸し、１７０℃で７分乾燥させ、樹脂固形
分が８５ｗｔ％のプリプレグを得た。このプリプレグは
揮発分が０．６ｗｔ％であった。上記ガラス不織布を用
いたプリプレグを中間層とし、実施例１と同様のガラス
織布を用いたプリプレグ、及び銅箔を用い、実施例１の
条件で加熱加圧して厚さ１．６ｍｍのエポキシ樹脂積層
板を得た。Example 2 A resin varnish was mixed in the same manner as in Example 1 except that 17 parts of the novolac type epoxy resin was used. As the prepreg for the intermediate layer, the same glass nonwoven fabric as in Example 1 was used, impregnated with the above resin varnish and dried at 170 ° C. for 7 minutes to obtain a prepreg having a resin solid content of 85 wt%. This prepreg had a volatile content of 0.6 wt%. An epoxy resin having a thickness of 1.6 mm, which was heated and pressed under the conditions of Example 1, using the prepreg using the glass nonwoven fabric as an intermediate layer, the prepreg using the same glass woven fabric as in Example 1, and a copper foil. A laminated board was obtained.
【００１８】得られたエポキシ樹脂積層板の吸湿後の耐
熱性とパンチング性を実施例１と同様に評価した。結果
は表１のとおり、吸湿後の耐熱性、パンチング性とも良
好であった。The heat resistance and punching property of the obtained epoxy resin laminated plate after moisture absorption were evaluated in the same manner as in Example 1. As shown in Table 1, the results were good in both heat resistance and punching property after moisture absorption.
【００１９】実施例３ ノボラック型エポキシ樹脂を１０部とした以外は実施例
１と同様にして樹脂ワニスを配合した。中間層のプリプ
レグは、実施例１と同種のガラス不織布を用い、上記樹
脂ワニスを含浸し、１７０℃で１３分乾燥させ、樹脂固
形分が８５ｗｔ％のプリプレグを得た。このプリプレグ
は揮発分が０．３ｗｔ％であった。上記ガラス不織布を
用いたプリプレグを中間層とし、実施例１と同様のガラ
ス織布を用いたプリプレグ、及び銅箔を用い、実施例１
の条件で加熱加圧して厚さ１．６ｍｍのエポキシ樹脂積
層板を得た。Example 3 A resin varnish was compounded in the same manner as in Example 1 except that 10 parts of the novolac type epoxy resin was used. As the prepreg of the intermediate layer, the same glass nonwoven fabric as in Example 1 was used, impregnated with the above resin varnish and dried at 170 ° C. for 13 minutes to obtain a prepreg having a resin solid content of 85 wt%. The prepreg had a volatile content of 0.3 wt%. The prepreg using the above glass nonwoven fabric was used as the intermediate layer, and the prepreg using the same glass woven fabric as in Example 1 and the copper foil were used.
By heating and pressurizing under the conditions described above, an epoxy resin laminate having a thickness of 1.6 mm was obtained.
【００２０】得られたエポキシ樹脂積層板の吸湿後の耐
熱性とパンチング性を実施例１と同様に評価した。結果
は表１のとおり、吸湿後の耐熱性、パンチング性とも良
好であった。The resulting epoxy resin laminate was evaluated for heat resistance and punching property after moisture absorption in the same manner as in Example 1. As shown in Table 1, the results were good in both heat resistance and punching property after moisture absorption.
【００２１】比較例１ 中間層のプリプレグの乾燥時間が４分とした以外は、実
施例１と同様にしてガラス不織布を用いたプリプレグを
得た。このプリプレグは揮発分が０．９ｗｔ％であっ
た。上記ガラス不織布を用いたプリプレグを中間層と
し、実施例１と同様のガラス織布を用いたプリプレグ、
及び銅箔を用い、実施例１の条件で加熱加圧して厚さ
１．６ｍｍのエポキシ樹脂積層板を得た。Comparative Example 1 A prepreg using a glass nonwoven fabric was obtained in the same manner as in Example 1 except that the drying time of the intermediate layer prepreg was set to 4 minutes. This prepreg had a volatile content of 0.9 wt%. A prepreg using the same glass woven fabric as in Example 1 using the prepreg using the above glass nonwoven fabric as an intermediate layer,
Using the copper foil and the copper foil, heating and pressurization were performed under the conditions of Example 1 to obtain an epoxy resin laminate having a thickness of 1.6 mm.
【００２２】得られたエポキシ樹脂積層板の吸湿後の耐
熱性とパンチング性を実施例１と同様に評価した。結果
は表１のとおり、吸湿後の耐熱性が不合格であった。The heat resistance and punching property of the obtained epoxy resin laminated plate after moisture absorption were evaluated in the same manner as in Example 1. The results are shown in Table 1, and the heat resistance after moisture absorption was unacceptable.
【００２３】比較例２ ノボラック型エポキシ樹脂を２２部とした以外は実施例
１と同様にして樹脂ワニスを配合した。中間層のプリプ
レグは、実施例１と同種のガラス不織布を用い、上記樹
脂ワニスを含浸し、１７０℃で４分乾燥させ、樹脂固形
分が８５ｗｔ％のプリプレグを得た。このプリプレグは
揮発分が０．９ｗｔ％であった。上記ガラス不織布を用
いたプリプレグを中間層とし、実施例１と同様のガラス
織布を用いたプリプレグ、及び銅箔を用い、実施例１の
条件で加熱加圧して厚さ１．６ｍｍのエポキシ樹脂積層
板を得た。Comparative Example 2 A resin varnish was mixed in the same manner as in Example 1 except that 22 parts of the novolac type epoxy resin was used. As the prepreg of the intermediate layer, the same glass nonwoven fabric as in Example 1 was used, impregnated with the above resin varnish and dried at 170 ° C. for 4 minutes to obtain a prepreg having a resin solid content of 85 wt%. This prepreg had a volatile content of 0.9 wt%. An epoxy resin having a thickness of 1.6 mm, which was heated and pressed under the conditions of Example 1, using the prepreg using the glass nonwoven fabric as an intermediate layer, the prepreg using the same glass woven fabric as in Example 1, and a copper foil. A laminated board was obtained.
【００２４】得られたエポキシ樹脂積層板の吸湿後の耐
熱性とパンチング性を実施例１と同様に評価した。結果
は表１のとおり、剥離が生じパンチング性が不合格であ
った。The heat resistance and punching property after moisture absorption of the obtained epoxy resin laminate were evaluated in the same manner as in Example 1. As shown in Table 1, peeling occurred and the punching property was unacceptable.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【発明の効果】本発明の製造方法により作製されたエポ
キシ樹脂積層板は、パンチング性が良好で、且つ吸湿後
の耐熱性が優れている。本発明のプリプレグ製造方法に
よって得られるプリプレグは上記エポキシ樹脂積層板の
製造に有用である。The epoxy resin laminate produced by the production method of the present invention has good punching properties and excellent heat resistance after absorbing moisture. The prepreg obtained by the prepreg manufacturing method of the present invention is useful for manufacturing the epoxy resin laminate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｇ 59/32 ＮＨＱ Ｃ０８Ｌ 63/02 ＮＪＷ // Ｂ２９Ｋ 63:00 105:08 Ｂ２９Ｌ 9:00 Ｃ０８Ｌ 63:02 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C08G 59/32 NHQ C08L 63/02 NJW // B29K 63:00 105: 08 B29L 9:00 C08L 63 : 02
Claims (2)
エポキシ樹脂１００重量部に対し、ノボラック型エポキ
シ樹脂を１０〜１７重量部配合した樹脂ワニスを、ガラ
ス不織布に含浸させ、樹脂ワニスを半硬化させるプリプ
レグの製造方法であって、このプリプレグの１６０±３
℃１５分乾燥した揮発分が、０．６ｗｔ％以下とするこ
とを特徴とするプリプレグの製造方法。1. A prepreg in which a glass non-woven fabric is impregnated with a resin varnish prepared by mixing 10 to 17 parts by weight of a novolac type epoxy resin with 100 parts by weight of a bisphenol A type epoxy resin as a resin varnish to semi-cure the resin varnish. Manufacturing method, 160 ± 3 of this prepreg
A method for producing a prepreg, characterized in that the volatile matter dried at 15 ° C. for 15 minutes is 0.6 wt% or less.
織布の基材を用いたプリプレグを重ね、加熱加圧するエ
ポキシ樹脂積層板の製造方法において、上記中間層のプ
リプレグに請求項１記載のプリプレグを用いることを特
徴とするエポキシ樹脂積層板の製造方法。2. A method for producing an epoxy resin laminate, comprising stacking a prepreg using a substrate made of a glass non-woven fabric as an intermediate layer and a glass woven fabric as a surface layer, and heating and pressurizing the prepreg. A method for producing an epoxy resin laminate, which comprises using a prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17282793A JPH0726040A (en) | 1993-07-13 | 1993-07-13 | Production of prepreg and production of epoxy resin laminate from the prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17282793A JPH0726040A (en) | 1993-07-13 | 1993-07-13 | Production of prepreg and production of epoxy resin laminate from the prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0726040A true JPH0726040A (en) | 1995-01-27 |
Family
ID=15949099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17282793A Withdrawn JPH0726040A (en) | 1993-07-13 | 1993-07-13 | Production of prepreg and production of epoxy resin laminate from the prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726040A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802840B1 (en) * | 2001-09-25 | 2008-02-12 | 스미또모 베이크라이트 가부시키가이샤 | Method for manufacturing composite laminate |
| WO2018193908A1 (en) * | 2017-04-18 | 2018-10-25 | 三菱ケミカル株式会社 | Fiber-reinforced composite material molded article and method for producing same |
-
1993
- 1993-07-13 JP JP17282793A patent/JPH0726040A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100802840B1 (en) * | 2001-09-25 | 2008-02-12 | 스미또모 베이크라이트 가부시키가이샤 | Method for manufacturing composite laminate |
| WO2018193908A1 (en) * | 2017-04-18 | 2018-10-25 | 三菱ケミカル株式会社 | Fiber-reinforced composite material molded article and method for producing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008127530A (en) | Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and multilayer printed wiring board | |
| JPH0726040A (en) | Production of prepreg and production of epoxy resin laminate from the prepreg | |
| JP3561359B2 (en) | Prepreg sheet and laminated products | |
| JP2000169605A (en) | Prepreg sheet for laminated board and its production | |
| JP2004115634A (en) | Epoxy resin composition for printed wiring board, prepreg, metal-clad laminated sheet, and multilayer printed wiring board | |
| JP2004067968A (en) | Resin composition, prepreg, and laminated plate | |
| JP3211608B2 (en) | Manufacturing method of copper-clad laminate | |
| JPH05309789A (en) | Production of composite copper clad laminated sheet | |
| JP2002348754A (en) | Glass cloth, prepreg, laminated sheet, and printed wiring board | |
| JP2003313272A (en) | Epoxy resin composition for impregnating organic fiber base material, and prepreg, laminated sheet, and printed- wiring board using the same | |
| JPS6360053B2 (en) | ||
| JPH08151507A (en) | Epoxy resin composition for laminate | |
| JPS6341937B2 (en) | ||
| JPH09141781A (en) | Manufacture of laminated plate for printed circuit | |
| JP2000212249A (en) | Epoxy resin composition, prepreg and laminate using the same | |
| JPH08109274A (en) | Production of prepreg | |
| JPS61209234A (en) | Epoxy resin laminate | |
| JP2000154232A (en) | Heat-resistant resin composition, and prepreg and laminate using same | |
| JPS63293049A (en) | Electrical laminate | |
| JPH06107822A (en) | Production of epoxy resin laminate | |
| JPH05286075A (en) | Manufacture of copper-clad laminate | |
| JPH05286074A (en) | Copper-clad laminate | |
| JPH0780994A (en) | Copper-clad laminated plate | |
| JPH05304360A (en) | Manufacture of multi-layer printed wiring board | |
| JPH05301980A (en) | Prepreg for printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20001003 |