JP2002348754A - Glass cloth, prepreg, laminated sheet, and printed wiring board - Google Patents
Glass cloth, prepreg, laminated sheet, and printed wiring boardInfo
- Publication number
- JP2002348754A JP2002348754A JP2001159104A JP2001159104A JP2002348754A JP 2002348754 A JP2002348754 A JP 2002348754A JP 2001159104 A JP2001159104 A JP 2001159104A JP 2001159104 A JP2001159104 A JP 2001159104A JP 2002348754 A JP2002348754 A JP 2002348754A
- Authority
- JP
- Japan
- Prior art keywords
- glass cloth
- prepreg
- glass
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Woven Fabrics (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ガラス繊維を縦横
に織って形成されるガラス布、及びこのガラス布を補強
基材として用いたプリプレグ、及びこのプリプレグを硬
化して形成される積層板、並びにこの積層板から形成さ
れるプリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass cloth formed by weaving glass fibers vertically and horizontally, a prepreg using the glass cloth as a reinforcing base material, and a laminate formed by curing the prepreg. And a printed wiring board formed from the laminate.
【０００２】[0002]
【従来の技術】従来より、銅張り積層板などの金属箔張
り積層板を形成するにあたって、ガラス布を補強基材と
して用いたプリプレグが用いられているが、このような
積層板用のガラス布としては１インチ（２５．４ｍｍ）
当たりの縦糸と横糸の本数が５６本ずつで且つ通気度が
３００ｃｍ3／ｃｍ2／ｓｅｃである１０６タイプのもの
（織物密度が５６×５６（本／２５ｍｍ））や、１イン
チ当たりの縦糸の本数が６０本で１インチ当たりの横糸
の本数が４７本で且つ通気度が１００ｃｍ3／ｃｍ2／ｓ
ｅｃである１０８０タイプのもの（織物密度が６０×４
７（本／２５ｍｍ））などが使用されている。2. Description of the Related Art Conventionally, in forming a metal foil-clad laminate such as a copper-clad laminate, a prepreg using a glass cloth as a reinforcing substrate has been used. Is 1 inch (25.4mm)
106 types (the fabric density is 56 × 56 (lines / 25 mm)) in which the number of the warp yarns and the weft yarns are 56 each and the air permeability is 300 cm 3 / cm 2 / sec, and the warp yarns per inch The number is 60, the number of weft yarns per inch is 47, and the air permeability is 100 cm 3 / cm 2 / s.
ec type 1080 (woven fabric density 60 × 4
7 (book / 25 mm)).
【０００３】そして、一枚のプリプレグあるいは所定の
枚数重ねたプリプレグの外側に銅箔等の金属箔を重ねた
後、これを加熱加圧成形してプリプレグを硬化させて絶
縁基板を形成すると共にプリプレグの硬化により絶縁基
板と金属箔とを一体に接着することにより、絶縁基板の
外面に金属箔を有する積層板を形成することができるも
のである。また、この積層板の金属箔にサブトラクティ
ブ法などの回路形成工程を施すことによってプリント配
線板を形成することができるものである。[0003] Then, after a metal foil such as a copper foil is laminated on the outside of one prepreg or a predetermined number of prepregs, the prepreg is heated and press-molded to cure the prepreg, thereby forming an insulating substrate and a prepreg. By laminating the insulating substrate and the metal foil integrally by hardening, a laminate having the metal foil on the outer surface of the insulating substrate can be formed. Further, a printed wiring board can be formed by subjecting the metal foil of the laminate to a circuit forming step such as a subtractive method.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上記のように
して得られる積層板やプリント配線板では、耐電圧性能
が低くて電気的な特性の信頼性が低いという問題があっ
た。However, the laminate and the printed wiring board obtained as described above have a problem that the withstand voltage performance is low and the reliability of the electrical characteristics is low.
【０００５】本発明は上記の点に鑑みてなされたもので
あり、電気的な特性の信頼性が高い積層板やプリント配
線板を形成することができるガラス布及びプリプレグを
提供することを目的とするものである。また、本発明
は、電気的な特性の信頼性が高い積層板やプリント配線
板を提供することを目的とするものである。[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a glass cloth and a prepreg capable of forming a laminate or a printed wiring board having high reliability in electrical characteristics. Is what you do. Another object of the present invention is to provide a laminate or a printed wiring board having high reliability of electrical characteristics.
【０００６】[0006]
【課題を解決するための手段】本発明の請求項１に係る
ガラス布は、縦糸の幅寸法をＡ（ｍｍ）、横糸の幅寸法
をＢ（ｍｍ）、２５．４（ｍｍ）当たりの縦糸の本数を
ａ（本）、２５．４（ｍｍ）当たりの横糸の本数をｂ
（本）とした時、下記の（１）式の値が８８（％）以上
の条件を満たすことを特徴とするものである。The glass cloth according to claim 1 of the present invention has a warp width of A (mm), a weft width of B (mm), and a warp per 25.4 (mm). Is the number of a (lines) and the number of weft yarns per 25.4 (mm) is b
In the case of (book), the value of the following equation (1) satisfies the condition of 88 (%) or more.
【０００７】[0007]
【式２】 (Equation 2)
【０００８】また、本発明の請求項２に係るガラス布
は、請求項１の構成に加えて、通気度を６０ｃｍ3／ｃ
ｍ2／ｓｅｃ以下に形成して成ることを特徴とするもの
である。[0008] The glass cloth according to claim 2 of the present invention has, in addition to the structure of claim 1, an air permeability of 60 cm 3 / c.
m 2 / sec or less.
【０００９】また、本発明の請求項３に係るガラス布
は、請求項１又は２の構成に加えて、縦糸及び横糸のガ
ラス繊維がＥ−ガラスであることを特徴とするものであ
る。Further, the glass cloth according to claim 3 of the present invention is characterized in that, in addition to the constitution of claim 1 or 2, the glass fibers of the warp and the weft are E-glass.
【００１０】また、本発明の請求項４に係るガラス布
は、請求項１乃至３のいずれかに記載の構成に加えて、
上記の（１）式の値が９５（％）以上の条件を満たすこ
とを特徴とするものである。Further, the glass cloth according to claim 4 of the present invention has the structure according to any one of claims 1 to 3,
The value of the above equation (1) satisfies a condition of 95% or more.
【００１１】本発明の請求項５に係るプリプレグは、請
求項１乃至４のいずれかに記載のガラス布に熱硬化性樹
脂を含浸して乾燥して成ることを特徴とするものであ
る。A prepreg according to a fifth aspect of the present invention is characterized in that the glass cloth according to any one of the first to fourth aspects is impregnated with a thermosetting resin and dried.
【００１２】本発明の請求項６に係る積層板は、請求項
５に記載のプリプレグを加圧加熱成形して厚み６０μｍ
以下の絶縁基板を形成して成ることを特徴とするもので
ある。According to a sixth aspect of the present invention, there is provided a laminated plate having a thickness of 60 μm obtained by subjecting the prepreg of the fifth aspect to pressure and heat molding.
It is characterized by forming the following insulating substrate.
【００１３】本発明の請求項７に係るプリント配線板
は、請求項６に記載の絶縁基板に回路を形成して成るこ
とを特徴とするものである。A printed wiring board according to a seventh aspect of the present invention is characterized in that a circuit is formed on the insulating substrate according to the sixth aspect.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。Embodiments of the present invention will be described below.
【００１５】本発明のガラス布は、縦糸の幅寸法をＡ
（ｍｍ）、横糸の幅寸法をＢ（ｍｍ）、２５．４（ｍ
ｍ）当たりの縦糸の本数をａ（本）、２５．４（ｍｍ）
当たりの横糸の本数をｂ（本）とした時、下記の（２）
式の条件を満たすことを特徴とするものである。In the glass cloth of the present invention, the width of the warp is set to A.
(Mm), the width of the weft is B (mm), 25.4 (m
a) (number of warp yarns per m), 25.4 (mm)
When the number of weft yarns per hit is b (lines), the following (2)
It is characterized by satisfying the condition of the expression.
【００１６】[0016]
【式３】 (Equation 3)
【００１７】すなわち、本発明のガラス布は上記（１）
式で示される１インチ×１インチ中のガラス占有率が８
８％以上であることを必須条件とするものである。上記
（１）の値が８８％未満であれば、積層板やプリント配
線板の耐電圧性能が低くなる恐れがある。また、上記の
ガラス占有率は高いほど好ましいので、その上限は１０
０％である。また、積層板やプリント配線板の耐電圧性
能を高く得るために、上記のガラス占有率は９５％以上
にするのが好ましい。That is, the glass cloth of the present invention has the above (1)
The glass occupancy in 1 inch × 1 inch is 8
8% or more is an essential condition. If the value of the above (1) is less than 88%, the withstand voltage performance of the laminated board or the printed wiring board may be reduced. The higher the glass occupancy is, the more preferable.
0%. Further, in order to obtain a high withstand voltage performance of the laminated board or the printed wiring board, the above-mentioned glass occupation ratio is preferably set to 95% or more.
【００１８】尚、縦糸の幅寸法及び横糸の幅寸法はガラ
ス布の表面と平行な方向の寸法である。また、上記の縦
糸の幅寸法をＡ（ｍｍ）、横糸の幅寸法をＢ（ｍｍ）、
２５．４（ｍｍ）当たりの縦糸の本数をａ（本）、２
５．４（ｍｍ）当たりの横糸の本数をｂ（本）はそれぞ
れ任意ではあるが、例えば、Ａ＝０．２〜０．５ｍｍ、
Ｂ＝０．２〜０．５ｍｍ、ａ＝５０〜７０本、ｂ＝５０
〜７０本の範囲に設定することができる。また、ガラス
布の織成は従来からある既知の方法を採用することがで
きる。The width of the warp yarn and the width of the weft yarn are measured in a direction parallel to the surface of the glass cloth. The width of the warp is A (mm), the width of the weft is B (mm),
The number of warp yarns per 25.4 (mm) is a (number), 2
Although the number of weft yarns per 5.4 (mm) is arbitrary b (line), for example, A = 0.2 to 0.5 mm,
B = 0.2-0.5 mm, a = 50-70, b = 50
It can be set in the range of up to 70 lines. Further, the weaving of the glass cloth can employ a conventionally known method.
【００１９】本発明のガラス布はその通気度が６０ｃｍ
3／ｃｍ2／ｓｅｃ以下であることが好ましい。ガラス布
の通気度が６０ｃｍ3／ｃｍ2／ｓｅｃを超えると、ガラ
スの被覆が少なくなり、本発明の効果が少なくなるとい
う問題が生じる恐れがある。また、ガラス布の通気度は
小さいほど好ましいので特に下限はないが、例えば、通
気度の下限は３ｃｍ3／ｃｍ2／ｓｅｃに設定することが
できる。また、ガラス布の通気度の調整方法は任意では
あるが、例えば、織成したガラス布に水や空気を吹き付
けるようにする開繊（解繊）等の方法を採用することが
できる。そして、この開繊によりガラス布をけばだたせ
てガラス布の表面をこのけばだちで被覆して通気度を上
記の範囲に設定するものである。The air permeability of the glass cloth of the present invention is 60 cm.
It is preferably at most 3 / cm 2 / sec. When the air permeability of the glass cloth exceeds 60 cm 3 / cm 2 / sec, there is a possibility that a problem that the coating of the glass is reduced and the effect of the present invention is reduced is caused. The lower the air permeability of the glass cloth, the better. Therefore, there is no particular lower limit. For example, the lower limit of the air permeability can be set to 3 cm 3 / cm 2 / sec. The method of adjusting the air permeability of the glass cloth is arbitrary, but for example, a method such as opening (fibrillation) of blowing water or air onto the woven glass cloth can be adopted. Then, the glass cloth is fluffed by this fiber opening, and the surface of the glass cloth is covered with the fluff to set the air permeability in the above range.
【００２０】また、本発明のガラス布において、縦糸及
び横糸のガラス繊維の材質としては、Ｅ−ガラス、Ｄ−
ガラス、Ｔ−ガラスなどの任意のものを用いることがで
きるが、Ｅ−ガラスを用いるのが好ましい。このＥ−ガ
ラスのガラス布は他のガラスのガラス布に比べて、プリ
ント配線板にする時の加工性に優れるものである。Further, in the glass cloth of the present invention, the material of the warp and weft glass fibers is E-glass, D-glass.
Any material such as glass and T-glass can be used, but E-glass is preferably used. This E-glass glass cloth is more excellent in workability when used as a printed wiring board than other glass cloths.
【００２１】本発明のプリプレグは上記のガラス布に熱
硬化性樹脂等の樹脂を含浸させた後、ガラス布中の樹脂
を加熱等により半硬化させてＢステージ化することによ
り形成することができる。熱硬化性樹脂としてはエポキ
シ樹脂などを用いることができる。ガラス布に熱硬化性
樹脂を含浸させるにあたっては任意の方法を採用するこ
とができるが、例えば、熱硬化性樹脂とその硬化剤及び
必要に応じて硬化促進剤や無機充填材及び溶剤を混合し
て樹脂ワニスを調製し、この樹脂ワニスにガラス布を浸
漬させて樹脂ワニスをガラス布に含浸させる方法などを
採用することができる。また、本発明のプリプレグの樹
脂量は任意ではあるが、例えば、５０〜８０％に設定す
ることができる。The prepreg of the present invention can be formed by impregnating the above-mentioned glass cloth with a resin such as a thermosetting resin and then semi-curing the resin in the glass cloth by heating or the like to form a B stage. . An epoxy resin or the like can be used as the thermosetting resin. Any method can be used to impregnate the thermosetting resin into the glass cloth.For example, a thermosetting resin and its curing agent and, if necessary, a curing accelerator, an inorganic filler and a solvent may be mixed. Then, a method of preparing a resin varnish, and immersing a glass cloth in the resin varnish to impregnate the resin varnish into the glass cloth can be adopted. The resin amount of the prepreg of the present invention is optional, but can be set, for example, to 50 to 80%.
【００２２】本発明の積層板は、上記のように形成され
るプリプレグに金属箔を重ねた後、これを加熱加圧成形
してプリプレグを硬化させて絶縁基板を形成すると共に
プリプレグの硬化により絶縁基板と金属箔とを一体に接
着することにより、絶縁基板の外面に金属箔を有する片
面あるいは両面の金属箔張り積層板として形成すること
ができるものである。一枚の積層板に使用するプリプレ
グの枚数は任意であって、一枚であっても良いし、ある
いは複数枚重ね合わせて使用しても良い。また、上記の
金属箔としては銅箔やアルミニウム箔などの既知のもの
を使用することができる。さらに、上記の加熱加圧はプ
レス機等を用いて従来から既知の条件で行うことができ
るが、例えば、温度１３０〜２００℃、圧力０．９８〜
５．８８ＭＰａ、時間３０〜２４０分などに設定するこ
とができる。In the laminate of the present invention, a metal foil is laminated on the prepreg formed as described above, and then heated and press-molded to cure the prepreg to form an insulating substrate and to cure the prepreg by curing the prepreg. By integrally bonding the substrate and the metal foil, it is possible to form a single-sided or double-sided metal foil-clad laminate having a metal foil on the outer surface of the insulating substrate. The number of prepregs used for one laminated plate is arbitrary, and may be one or a plurality of prepregs. In addition, as the above-mentioned metal foil, a known foil such as a copper foil or an aluminum foil can be used. Furthermore, the above-mentioned heating and pressurization can be performed using a press machine or the like under conventionally known conditions. For example, the temperature is 130 to 200 ° C., and the pressure is 0.98 to
It can be set to 5.88 MPa, time 30 to 240 minutes, and the like.
【００２３】本発明のプリント配線板は、上記のように
して形成される積層板にサブトラクティブ法などの既知
の回路形成工程を施すことによって金属箔から回路を形
成し、プリント配線板を作成することができるものであ
る。また、このようにして形成されるプリント配線板の
外面にビルドアップ法などにより絶縁層と金属箔を積層
して一体化し、この積層一体化した金属箔に回路形成工
程を施すことによって、多層のプリント配線板を形成す
ることができる。In the printed wiring board of the present invention, a circuit is formed from a metal foil by subjecting the laminate formed as described above to a known circuit forming step such as a subtractive method to prepare a printed wiring board. Is what you can do. In addition, the insulating layer and the metal foil are laminated and integrated on the outer surface of the printed wiring board thus formed by a build-up method or the like, and a circuit forming process is performed on the laminated and integrated metal foil to form a multilayer. A printed wiring board can be formed.
【００２４】そして、本発明の積層板やプリント配線板
は絶縁基板に内蔵されている補強基材として上記のよう
なガラス布を用いているので、他のガラス布を用いた場
合よりも耐電圧性能を向上させることができるものであ
る。特に、絶縁基板の厚みが６０μｍ以下の薄いもので
あっても、耐電圧性能が高い積層板やプリント配線板を
形成することができるものである。Since the laminated board and the printed wiring board of the present invention use the above-mentioned glass cloth as the reinforcing base incorporated in the insulating substrate, the withstand voltage is higher than when other glass cloths are used. The performance can be improved. In particular, even if the thickness of the insulating substrate is as thin as 60 μm or less, a laminated board or a printed wiring board having high withstand voltage performance can be formed.
【００２５】[0025]
【実施例】以下本発明を実施例によって具体的に説明す
る。The present invention will be described below in detail with reference to examples.
【００２６】（実施例１、２及び比較例１）ガラス布と
して表１に示す条件のものを用い、このガラス布にエポ
キシ樹脂組成物を含浸させることによってプリプレグを
形成した。エポキシ樹脂組成物は、９０質量部のブロム
化エポキシ樹脂（東都化成社製の品番「ＹＤＢ−５０
０」、エポキシ当量５００ｇ／ｅｑ、臭素含有率２１質
量％）と、１０質量部のクレゾールノボラック型エポキ
シ樹脂（大日本インキ化学工業社製の品番「Ｎ−６９
０」、エポキシ当量２２５ｇ／ｅｑ）と、硬化剤として
２．５質量部のジシアンジアミドと、硬化促進剤として
０．１質量部の２−エチル−４−メチルイミダゾールと
を配合して調製した。そして、このエポキシ樹脂組成物
に溶剤としてメチルエチルケトン：ジメチルホルムアミ
ド＝１：１で混合した液を配合して樹脂ワニスを調製し
た。樹脂ワニス中の上記エポキシ樹脂組成物の含有量は
６０質量％とした。(Examples 1, 2 and Comparative Example 1) A prepreg was formed by impregnating the glass cloth with the epoxy resin composition under the conditions shown in Table 1 as shown in Table 1. The epoxy resin composition comprises 90 parts by mass of a brominated epoxy resin (product number “YDB-50” manufactured by Toto Kasei Co., Ltd.).
0 ", an epoxy equivalent of 500 g / eq, and a bromine content of 21% by mass, and 10 parts by mass of a cresol novolac type epoxy resin (product number" N-69 "manufactured by Dainippon Ink and Chemicals, Inc.).
0 ", an epoxy equivalent of 225 g / eq), 2.5 parts by mass of dicyandiamide as a curing agent, and 0.1 part by mass of 2-ethyl-4-methylimidazole as a curing accelerator. A resin varnish was prepared by mixing a liquid obtained by mixing methyl ethyl ketone: dimethylformamide = 1: 1 as a solvent with the epoxy resin composition. The content of the epoxy resin composition in the resin varnish was 60% by mass.
【００２７】このようにして調製される樹脂ワニス中に
ガラス布を浸漬してガラス布に樹脂ワニスを含浸させ、
乾燥機で乾燥後に、硬化時間が１７０℃で１５０秒とな
るようにプリプレグを半硬化させて形成した。また、プ
リプレグの樹脂量（樹脂含有率）は６８質量％とした。A glass cloth is immersed in the resin varnish prepared in this way to impregnate the glass cloth with the resin varnish.
After drying with a dryer, the prepreg was semi-cured so that the curing time was 170 seconds at 170 ° C. to form a prepreg. The resin amount (resin content) of the prepreg was 68% by mass.
【００２８】上記のようにして形成されるプリプレグを
一枚用意し、このプリプレグの両面に厚み３５μｍの銅
箔を重ねて配置し、この積層体を金属プレート間に挟ん
だ後熱盤間に挿入し、積層体を加熱加圧することによっ
て絶縁基板の厚みが５０μｍの両面銅張り積層板を形成
した。上記のように加熱加圧するにあたっては二段階の
条件を設定した。まず、プリプレグに含浸した樹脂が溶
融するまでの間（一段階目）は、熱盤温度１３０〜１３
５℃で初期の加圧を０．９８ＭＰａの低圧で行い、この
後、樹脂を完全に硬化させるまでの間（二段階目）は、
熱盤温度１７０℃で加圧を２．９４ＭＰａに上昇させて
行った。One prepreg formed as described above is prepared, a copper foil having a thickness of 35 μm is placed on both sides of the prepreg, and the laminate is sandwiched between metal plates and then inserted between hot plates. Then, the laminate was heated and pressed to form a double-sided copper-clad laminate having an insulating substrate having a thickness of 50 μm. In heating and pressurizing as described above, two-stage conditions were set. First, until the resin impregnated in the prepreg is melted (first stage), the hot platen temperature is 130 to 13.
An initial pressurization is performed at 5 ° C. at a low pressure of 0.98 MPa, and thereafter, until the resin is completely cured (second stage),
Pressing was performed at a hot platen temperature of 170 ° C. while increasing the pressure to 2.94 MPa.
【００２９】（実施例３、４及び比較例２）ガラス布と
して表１に示すものを用い、且つプリプレグの樹脂量を
５６質量％とした以外は実施例１と同様にした。(Examples 3 and 4 and Comparative Example 2) The same procedure as in Example 1 was carried out except that the glass cloth shown in Table 1 was used and the resin amount of the prepreg was 56% by mass.
【００３０】上記実施例１乃至４及び比較例１、２で得
られた積層板について、耐電圧性能試験を行った。The withstand voltage performance test was performed on the laminates obtained in Examples 1 to 4 and Comparative Examples 1 and 2.
【００３１】耐電圧性能試験は、上記の積層板を２５０
×２５０ｍｍ大きさにカットして１０個のサンプルを形
成し、両面の銅箔間に５００Ｖの電圧を印加し、その時
の絶縁抵抗値を測定するようにして行った。そして、絶
縁抵抗値が１０7Ω未満のものを不良品とし、絶縁抵抗
値が１０7Ω以上のものを良品とした。結果を表１に示
す。尚、表中の分子は良品の個数を、分母はサンプル数
（１０個）をそれぞれ示す。In the withstand voltage test, the above laminate was subjected to 250
The sample was cut into a size of × 250 mm to form 10 samples, a voltage of 500 V was applied between the copper foils on both sides, and the insulation resistance value at that time was measured. Those having an insulation resistance value of less than 10 7 Ω were regarded as defective products, and those having an insulation resistance value of 10 7 Ω or more were regarded as good products. Table 1 shows the results. The numerator in the table indicates the number of non-defective products, and the denominator indicates the number of samples (10).
【００３２】[0032]
【表１】 [Table 1]
【００３３】表１から明らかなように、実施例１乃至４
は比較例１、２のものよりも耐電圧性能が高く、電気的
な特性の信頼性が高いことが判る。As is clear from Table 1, Examples 1 to 4
It can be seen that the withstand voltage performance is higher than those of Comparative Examples 1 and 2, and the reliability of the electrical characteristics is higher.
【００３４】[0034]
【発明の効果】上記のように本発明の請求項１の発明
は、縦糸の幅寸法をＡ（ｍｍ）、横糸の幅寸法をＢ（ｍ
ｍ）、２５．４（ｍｍ）当たりの縦糸の本数をａ
（本）、２５．４（ｍｍ）当たりの横糸の本数をｂ
（本）とした時、上記の（１）式の値が８８（％）以上
の条件を満たすので、１インチ×１インチ中のガラス占
有率を高くすることができ、このガラス布を絶縁基板の
補強基材として用いることによって、電気的な特性の信
頼性が高い積層板やプリント配線板を形成することがで
きるものである。As described above, according to the first aspect of the present invention, the width of the warp is A (mm) and the width of the weft is B (m).
m), the number of warps per 25.4 (mm) is a
(Number), the number of weft yarns per 25.4 (mm) is b
In the case of (book), the value of the above equation (1) satisfies the condition of 88 (%) or more, so that the glass occupancy in 1 inch × 1 inch can be increased. By using it as a reinforcing base material, it is possible to form a laminate or a printed wiring board having high reliability of electrical characteristics.
【００３５】また、本発明の請求項２の発明は、通気度
を６０ｃｍ3／ｃｍ2／ｓｅｃ以下に形成するので、面方
向でのガラスの被覆を多くすることができて１インチ×
１インチ中のガラス占有率をさらに高めることができ、
このガラス布を絶縁基板の補強基材として用いることに
よって、電気的な特性の信頼性がさらに高い積層板やプ
リント配線板を形成することができるものである。According to the invention of claim 2 of the present invention, since the air permeability is formed to be 60 cm 3 / cm 2 / sec or less, the coating of glass in the plane direction can be increased and 1 inch ×
The glass occupancy per inch can be further increased,
By using this glass cloth as a reinforcing base material for an insulating substrate, it is possible to form a laminate or a printed wiring board having higher reliability of electrical characteristics.
【００３６】また、本発明の請求項３の発明は、縦糸及
び横糸のガラス繊維がＥ−ガラスであるので、プリント
配線板にする時の加工性を良くすることができるもので
ある。In the invention according to claim 3 of the present invention, since the glass fibers of the warp and the weft are E-glass, the workability of the printed wiring board can be improved.
【００３７】また、本発明の請求項４の発明は、上記の
（１）式の値が９５（％）以上の条件を満たすので、電
気的な特性の信頼性が高い積層板やプリント配線板を確
実に形成することができるものである。According to the invention of claim 4 of the present invention, since the value of the above equation (1) satisfies the condition of 95% or more, a laminated board or a printed wiring board having high reliability of the electrical characteristics is provided. Can be reliably formed.
【００３８】本発明の請求項５の発明は、請求項１乃至
４のいずれかに記載のガラス布に熱硬化性樹脂を含浸し
て乾燥するので、このプリプレグを硬化させて絶縁基板
を形成することによって、電気的な特性の信頼性が高い
積層板やプリント配線板を形成することができるもので
ある。According to a fifth aspect of the present invention, since the glass cloth according to any one of the first to fourth aspects is impregnated with a thermosetting resin and dried, the prepreg is cured to form an insulating substrate. This makes it possible to form a laminated board or a printed wiring board having high reliability in electrical characteristics.
【００３９】本発明の請求項６の発明は、請求項５に記
載のプリプレグを加圧加熱成形して厚み６０μｍ以下の
絶縁基板を形成するので、厚みが薄くても電気的な特性
の信頼性を高くすることができるものであり、また、こ
の積層板に回路を形成することによって、厚みが薄くて
も電気的な特性の信頼性が高いプリント配線板に形成す
ることができるものである。According to a sixth aspect of the present invention, since the insulating substrate having a thickness of 60 μm or less is formed by press-heating and molding the prepreg according to the fifth aspect, the reliability of the electrical characteristics is reduced even if the thickness is small. In addition, by forming a circuit on this laminated board, it is possible to form a printed wiring board having high reliability in electrical characteristics even though the thickness is small.
【００４０】本発明の請求項７の発明は、請求項６に記
載の絶縁基板に回路を形成するので、厚みが薄くても電
気的な特性の信頼性を高くすることができるものであ
る。According to a seventh aspect of the present invention, since a circuit is formed on the insulating substrate according to the sixth aspect, the reliability of electrical characteristics can be improved even if the thickness is small.
Claims (7)
法をＢ（ｍｍ）、２５．４（ｍｍ）当たりの縦糸の本数
をａ（本）、２５．４（ｍｍ）当たりの横糸の本数をｂ
（本）とした時、下記の（１）式の値が８８（％）以上
の条件を満たすことを特徴とするガラス布。 【式１】 1. The width of the warp is A (mm), the width of the weft is B (mm), and the number of warp yarns per 25.4 (mm) is a (line), and the number of warp yarns is 25.4 (mm). The number of weft yarns is b
A glass cloth characterized by satisfying a condition that the value of the following expression (1) is 88 (%) or more when (book) is satisfied. (Equation 1)
に形成して成ることを特徴とする請求項１に記載のガラ
ス布。2. The glass cloth according to claim 1, wherein the glass cloth is formed to have an air permeability of 60 cm 3 / cm 2 / sec or less.
であることを特徴とする請求項１又は２に記載のガラス
布。3. The glass cloth according to claim 1, wherein the glass fibers of the warp and the weft are E-glass.
条件を満たすことを特徴とする請求項１乃至３のいずれ
かに記載のガラス布。4. The glass cloth according to claim 1, wherein the value of the expression (1) satisfies a condition of 95 (%) or more.
ス布に熱硬化性樹脂を含浸して乾燥して成ることを特徴
とするプリプレグ。5. A prepreg obtained by impregnating the glass cloth according to claim 1 with a thermosetting resin and drying.
成形して厚み６０μｍ以下の絶縁基板を形成して成るこ
とを特徴とする積層板。6. A laminate comprising a prepreg according to claim 5 formed by pressurizing and heating to form an insulating substrate having a thickness of 60 μm or less.
して成ることを特徴とするプリント配線板。7. A printed wiring board comprising a circuit formed on the insulating substrate according to claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001159104A JP2002348754A (en) | 2001-05-28 | 2001-05-28 | Glass cloth, prepreg, laminated sheet, and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001159104A JP2002348754A (en) | 2001-05-28 | 2001-05-28 | Glass cloth, prepreg, laminated sheet, and printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002348754A true JP2002348754A (en) | 2002-12-04 |
Family
ID=19002744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001159104A Pending JP2002348754A (en) | 2001-05-28 | 2001-05-28 | Glass cloth, prepreg, laminated sheet, and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002348754A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004020715A1 (en) * | 2002-08-29 | 2004-03-11 | Asahi-Schwebel Co., Ltd. | Glass cloth for printed circuit plate, and multilayer plate |
| JP2006315392A (en) * | 2005-04-13 | 2006-11-24 | Hitachi Chem Co Ltd | Method for manufacturing metal foil-clad laminate |
| JP6536764B1 (en) * | 2018-02-22 | 2019-07-03 | 日東紡績株式会社 | Glass cloth, prepreg, and glass fiber reinforced resin molded product |
| WO2019163159A1 (en) * | 2018-02-22 | 2019-08-29 | 日東紡績株式会社 | Glass cloth, prepreg, and glass fiber-reinforced resin molding |
-
2001
- 2001-05-28 JP JP2001159104A patent/JP2002348754A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004020715A1 (en) * | 2002-08-29 | 2004-03-11 | Asahi-Schwebel Co., Ltd. | Glass cloth for printed circuit plate, and multilayer plate |
| JP2006315392A (en) * | 2005-04-13 | 2006-11-24 | Hitachi Chem Co Ltd | Method for manufacturing metal foil-clad laminate |
| JP6536764B1 (en) * | 2018-02-22 | 2019-07-03 | 日東紡績株式会社 | Glass cloth, prepreg, and glass fiber reinforced resin molded product |
| WO2019163159A1 (en) * | 2018-02-22 | 2019-08-29 | 日東紡績株式会社 | Glass cloth, prepreg, and glass fiber-reinforced resin molding |
| US10934640B2 (en) | 2018-02-22 | 2021-03-02 | Nitto Boseki Co., Ltd. | Glass cloth, prepreg, and glass fiber reinforced resin molded product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8637151B2 (en) | Interlayer dielectric film with carrier material and multilayer printed circuit board therewith | |
| JP2002348754A (en) | Glass cloth, prepreg, laminated sheet, and printed wiring board | |
| JP6015303B2 (en) | Prepreg, laminated board and printed wiring board | |
| JP2001031782A (en) | Prepreg and laminate prepared by using the same | |
| JP3412572B2 (en) | Epoxy resin composition, prepreg, metal foil with resin, adhesive sheet, laminated board and multilayer board | |
| JP3806200B2 (en) | Prepreg and laminate | |
| JP2001030279A (en) | Manufacture of laminated sheet | |
| JP3211608B2 (en) | Manufacturing method of copper-clad laminate | |
| JP3883727B2 (en) | Aramid fiber base insulation board and printed wiring board | |
| JP3364782B2 (en) | Prepreg and laminate for printed wiring board production | |
| JP2002348768A (en) | Whole aromatic fiber nonwoven fabric, prepreg, laminated plate, and multilayer printed circuit board | |
| JP4207282B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP2002192520A (en) | Prepreg, laminated sheet and multilayered printed wiring board | |
| JP2002192521A (en) | Prepreg, laminated sheet and multilayered printed wiring board | |
| JP2002225056A (en) | Method for producing composite laminated plate | |
| JP2001244588A (en) | Composite sheet and laminated board using it | |
| JP2001274523A (en) | Prepreg for printed wiring board | |
| JP2002192522A (en) | Prepreg, laminated sheet and multilayered wiring board | |
| JPH07115444B2 (en) | Copper clad laminate | |
| JPH10324755A (en) | Resin impregnated substrate, its production, laminated sheet and its production | |
| JPH11157009A (en) | Manufacture of metal foil-clad laminated sheet | |
| JPH1016100A (en) | Preparation of laminated sheet | |
| JP2006224587A (en) | Manufacturing process of metal foil stretched laminate | |
| JP2001205740A (en) | Laminated sheet | |
| JPH06272135A (en) | Woven fabric of glass yarn for multi-layer printed-wiring board and prepreg for multi-layer printed-wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050705 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050809 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051011 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20051101 |