JPH0637141A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent corrosion of electrodes in a chip by improving moisture resistance of a tape carrier package(TCP). CONSTITUTION:A tape carrier package has a plurality of cutouts 6 extended along sides of a device hole 3 at an insulation film 1 in the package 5 in such a manner that the cutouts 6 are disposed at different steps thereby to increase a length of an effective invading route of moisture to be invaded into the package 5 through a boundary between the package 5 and the film 1, thereby improving its moisture resistance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, and more particularly to a tape carrier package (Tape Carrier Package).
The present invention relates to a technology effectively applied to improve the moisture resistance of a package (TPC).

[0002]

2. Description of the Related Art Conventionally, as a typical multi-terminal package, a QFP (Quad Flat Pack) is used.
Although e) is known, the fine processing of leads is reaching its limit due to the remarkable increase in the number of terminals accompanying the multifunctionalization and speeding up of logic LSI.

Therefore, recently, as an LSI package capable of increasing the number of terminals as compared with QFP, a lead formed on one surface of an insulating film and a semiconductor chip are connected by a TAB (tape carrier) method, and this is sealed with a resin package. A so-called tape carrier package is receiving attention.

[0004]

However, the tape carrier package having the above structure has a structure in which a part of the insulating film extends to the outside from the side surface of the package body. There is a problem in that moisture enters the inside of the package through the interface and causes corrosion of the in-chip electrodes.

The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of improving the humidity resistance of a tape carrier package.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

The typical ones of the inventions disclosed in the present application will be outlined below.

In the tape carrier package of the present invention, a plurality of notches extending along the sides of the device hole are provided in the insulating film inside the package, and the plurality of notches are arranged in different steps.

[0009]

According to the above-mentioned means, the moisture infiltration path through the interface between the package and the insulating film can be effectively lengthened, so that the moisture resistance of the tape carrier package can be improved.

[0010]

Embodiment 1 FIG. 1 is a plan view showing a tape carrier package (TCP) which is an embodiment of a semiconductor integrated circuit device of the present invention.

A plurality of leads 2 are radially formed on one surface of an insulating film 1 made of a heat resistant synthetic resin such as a polyimide resin. One end (inner lead portion) of the lead 2 extends inside the device hole 3 provided in the center of the insulating film 1, and the other end (outer lead portion) extends outside the device hole 3. There is. The lead 2 is made of, for example, Cu foil, and the surface thereof is plated with Au, Sn, or the like.

A semiconductor chip 4 on which a predetermined logic LSI is formed is arranged inside the device hole 3. The chip 4 and the lead 3 are bumps made of Au or the like formed on the chip 4 or the lead 3. It is electrically connected via electrodes (not shown).

Inner lead portions of the chip 4 and the leads 3 are sealed with a package 5 made of synthetic resin such as epoxy resin. In FIG. 1, in order to make the inside of the package 5 easier to see, the outer periphery of the package 5 is shown by a dashed line.

Insulating film 1 inside the package 5
A plurality of elongated notches 6 are formed in the. These notches 6 are arranged in different steps along the sides of the device hole 3. In this case, it is desirable that the length of the portion where one notch 6 intersects with the other notch 6 arranged in a staggered manner is at least 0.5 mm or more. These notches 6 are, for example, the insulating film 1
It is formed by etching the synthetic resin forming the.

As described above, in this embodiment, the package 5
By providing a plurality of elongated cutouts 6 so as to surround the device hole 3 in the inside of the insulating film 1 and arranging these cutouts 6 in different steps, the package 5 and The moisture infiltration path can be effectively lengthened, so that the moisture resistance of the tape carrier package can be improved.

As a result, it is possible to prevent corrosion of the in-chip electrodes, so that it is possible to provide a highly reliable tape carrier package.

[0017]

[Embodiment 2] FIG. 2 is a plan view showing a tape carrier package which is another embodiment of the semiconductor integrated circuit device of the present invention.

The tape carrier package of this embodiment is
The shape of the notch 6 provided in the insulating film 1 inside the package 5 is different from that of the above-mentioned embodiment. That is, the notch 6 of the present embodiment is formed so as to surround the entire circumference of the device hole 3, and the insulating film 1 inside the notch 6 and the insulating film 1 on the outside are completely separated. There is.

The notch 6 is, for example, an insulating film 1.
It is formed by etching the synthetic resin forming the. In this case, since the insulating film 1 inside the notch 6 is supported by the large number of leads 3, it does not fall off.

As described above, in this embodiment, the insulating film 1 inside the notch 6 and the insulating film 1 outside are completely separated, so that the package 5 passes through the interface between the package 5 and the insulating film 1. Since moisture that enters the inside of the cutout 5 does not reach the inside of the notch 6, the moisture resistance of the tape carrier package can be significantly improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

In the first embodiment, the elongated notch is formed along the side of the device hole, but as shown in FIG. 3, for example, another notch 7 is formed at the corner of the device hole 3 or the like. Good.

In the second embodiment, one notch is formed so as to surround the entire circumference of the device hole, but such notches may be doubled or tripled.

[0024]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

According to the present invention, the moisture infiltration path that penetrates the inside of the package through the interface between the resin and the insulating film is effectively lengthened, so that the moisture resistance of the tape carrier package can be improved and the inside of the chip can be improved. It is possible to prevent corrosion of the electrodes.

[Brief description of drawings]

FIG. 1 is a plan view of a semiconductor integrated circuit device that is an embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor integrated circuit device according to another embodiment of the present invention.

FIG. 3 is a plan view of a semiconductor integrated circuit device which is another embodiment of the present invention.

[Explanation of symbols]

 1 Insulating film 2 Lead 3 Device hole 4 Semiconductor chip 5 Package 6 Notch 7 Notch

Claims (2)

[Claims] 1. An inner lead portion of a lead formed radially on one surface of an insulating film extends inside a device hole formed in the insulating film, and an outer lead portion of the lead extends outside the insulating film. A semiconductor integrated circuit in which the semiconductor chip located inside the device hole and the inner lead portion of the lead are electrically connected via a bump electrode, and the semiconductor chip is sealed with a synthetic resin package. A circuit integrated circuit, wherein a plurality of notches extending along a side of the device hole are provided in an insulating film inside the package, and the plurality of notches are arranged in different steps. apparatus. 2. An inner lead portion of a lead formed radially on one surface of an insulating film extends inside a device hole provided in the insulating film, and an outer lead portion of the lead extends outside the insulating film. A semiconductor integrated circuit in which the semiconductor chip located inside the device hole and the inner lead portion of the lead are electrically connected via a bump electrode, and the semiconductor chip is sealed with a synthetic resin package. A circuit integrated circuit device, wherein a cutout that surrounds the entire circumference of the device hole is provided in an insulating film inside the package.