JPH04260343A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To improve reflow crack resistance of a tape carrier package. CONSTITUTION:Leads 2 formed on one surface of an insulating film 1 is connected with a semiconductor chip 4 by a TAB method. In a tape carrier package wherein a semiconductor chip 4 is sealed with a package main body 6 of synthetic resin which has an external size smaller than the insulating film 1, a notch 7 is formed in the insulating film 1 inside the package main body 6.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to semiconductor integrated circuit devices, and in particular to tape carrier packages (Tape C
The present invention relates to a technique that is effective when applied to a semiconductor integrated circuit device of the arrier package (TPC) type.

0002

[Prior Art] Conventionally, QFP (Quad Flat Package) is a typical multi-terminal package.
), however, due to the remarkable increase in the number of terminals as logic LSIs become more multifunctional and faster, the microfabrication of leads is reaching its limit.

Therefore, recently, as an LSI package that can increase the number of terminals compared to QFP, leads formed on one side of an insulating film and a semiconductor chip are connected by the TAB (tape carrier) method, and this is sealed with a resin package. The so-called tape carrier package (TC
P) is attracting attention.

FIG. 5 shows an example of the tape carrier package. Inner lead portions of leads 21 formed on one surface of insulating film 20 are connected to chip 23 via bump electrodes 22 . The chip 23 is sealed in a package body 24 made of molded resin, and the insulating film 2 is visible from the side of the package body 24.
0 and an outer lead portion of the lead 21 extend outward.

[0005] Regarding the above tape carrier package, please refer to "Nikkei Electronics 1" published by Nikkei BP.
990.8.6 (no.506)” P113-P11
4.

[0006]

[Problems to be Solved by the Invention] However, the tape carrier package having the above structure has a structure in which a part of the insulating film extends outside from the side of the package body, so that the mold resin and the insulating film are The problem is that moisture infiltrates into the inside of the package body through the interface, which tends to cause package cracks during reflow soldering.

The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a technique that can improve the package crack resistance of a tape carrier package.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[0009]

[Means for Solving the Problems] According to the present invention, leads formed on one surface of an insulating film and a chip are connected by a TAB method, and the chip is sealed with a resin package having external dimensions smaller than that of the insulating film. The tape carrier package has a notch in the insulating film inside the resin package.

0010

[Operation] According to the above means, by providing a notch in the insulating film inside the resin package, the resin separated into upper and lower parts with the chip and the insulating film in between can be
Since they are connected through this notch, moisture will not penetrate inside beyond this notch.

The present invention will be explained below with reference to Examples. In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

0012

Embodiment A semiconductor integrated circuit device according to this embodiment is shown in FIGS. 1 and 2. A plurality of leads 2 are arranged on one side of the insulating film 1 made of heat-resistant synthetic resin such as polyimide resin.
are formed in a radial pattern. One end (inner lead part) of the lead 2 extends inside the device hole 3 provided at the center of the insulating film 1, and the other end (outer lead part) extends outside the insulating film 1. There is. The lead 2 is made of, for example, Cu foil, and its surface is plated with Au, Sn, or the like.

A semiconductor chip 4 on which a predetermined logic LSI is formed is arranged inside the device hole 3, and the chip 4 and the leads 3 are connected to bumps made of Au or the like formed on the chip 4 or the leads 3. They are electrically connected via electrodes 5.

The chip 4 and the inner lead portions of the leads 3 are sealed by a package body 6 made of synthetic resin such as epoxy resin. The above package body 6
The external dimensions of the insulating film 1 are smaller than those of the insulating film 1, and a portion of the insulating film 1 and the outer lead portion of the lead 2 extend outward from the side surface of the package body 6.

A notch 7 is provided in the insulating film 1 inside the package body 6. As shown in FIG. The cutout 7 has a pattern that surrounds almost the entire circumference of the device hole 3.

As described above, in this embodiment, by providing the notch 7 surrounding the device hole 3 in the insulating film 1 inside the package body 6, the chip 4 and the resin on the upper side of the insulating film 1 are separated. The resin on the lower side is connected through this notch 7. As a result, moisture that has entered the inside of the pattern body 6 through the interface between the resin on the side surface of the package body 6 and the insulating film 1 cannot enter inside the notch 7.
Package crack resistance will be significantly improved.

Another embodiment of the semiconductor integrated circuit device of the present invention is shown in FIGS. 3 and 4. In this semiconductor integrated circuit device, a chip 4 is bonded to the center of an insulating film 1 with an adhesive 8 interposed therebetween. The inner lead portions of the plurality of leads 2 formed radially on one surface of the insulating film 1 extend near the chip 4, and the outer lead portions extend outside the insulating film 1. . The inner lead parts of the chip 4 and leads 2 are made of Au, Cu or Al.
They are electrically connected via wires 9 such as.

The inner lead portions of the chip 4 and the leads 3 are sealed by a package body 6 having external dimensions smaller than the insulating film 1, and from the side of the package body 6, a part of the insulating film 1 and a portion of the insulating film 1 and An outer lead portion of the lead 2 extends outward.

The insulating film 1 of this embodiment is provided with a notch 7 at a location extending between the inside and outside of the package body 6. The cutout 7 has a pattern that surrounds almost the entire circumference of the package body 6. Further, a notch 7 is provided in the insulating film 1 inside the package body 6 as necessary.

As described above, in this embodiment, the notch 7 surrounding the package body 6 is provided in the insulating film 1 at a portion extending between the inside and the outside of the package body 6, so that the chip 4 and the insulating film are separated. The upper resin and the lower resin of 1 are connected through this notch 7. This prevents moisture from entering the pattern body 6 from the side surface of the package body 6 through the interface between the resin and the insulating film 1, so that the package crack resistance is greatly improved.

[0021] The invention made by the present inventor has been specifically explained based on examples, but the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say.

In the first embodiment, a notch is provided in the insulating film inside the package body, but as in the second embodiment, a cutout is provided at a location spanning the inside and outside of the package body, or both. A notch may be provided.

The package body may be made of either molding resin or potting resin.

[0024]

[Effects of the Invention] Among the inventions disclosed in this application, the effects obtained by the typical inventions will be briefly explained as follows.
It is as follows.

[0025] The leads formed on one surface of the insulating film and the chip are connected by the TAB method, and the chip is sealed in a resin package having external dimensions smaller than the insulating film, and the insulating film inside the resin package is sealed. By providing a notch in the package, the package crack resistance can be greatly improved.

[Brief explanation of the drawing]

FIG. 1 is a cutaway plan view of essential parts of a semiconductor integrated circuit device that is an embodiment of the present invention.

FIG. 2 is a cross-sectional view of this semiconductor integrated circuit device.

FIG. 3 is a fragmentary plan view of a main part of a semiconductor integrated circuit device according to another embodiment of the present invention.

FIG. 4 is a cross-sectional view of this semiconductor integrated circuit device.

FIG. 5 is a cross-sectional view of a conventional semiconductor integrated circuit device.

[Explanation of symbols]

1 Insulating film 2 Lead 3 Device hole 4 Semiconductor chip 5 Bump electrode 6　Package body 7 Notch 8. Adhesive 9 Wire 20 Insulating film 21 Lead 22 Bump electrode 23 Semiconductor chip 24 Package body

Claims (4)

[Claims] 1. Inner lead portions of leads formed radially on one surface of the insulating film extend inside a device hole provided at the center of the insulating film, and outer lead portions of the leads extend outside the insulating film. electrically connects the semiconductor chip disposed inside the device hole and the inner lead portion of the lead via a bump electrode, and has an external dimension smaller than the insulating film. 1. A semiconductor integrated circuit device sealed with a resin package, characterized in that an insulating film inside the resin package is provided with a notch. 2. Inner lead portions of leads formed radially on one surface of the insulating film extend inside a device hole provided at the center of the insulating film, and outer lead portions of the leads extend outside the insulating film. electrically connects the semiconductor chip disposed inside the device hole and the inner lead portion of the lead via a bump electrode, and has an external dimension smaller than that of the insulating film. 1. A semiconductor integrated circuit device sealed with a resin package, characterized in that a notch is provided in an insulating film spanning the inside and outside of the resin package. 3. Inner lead portions of leads formed radially on one surface of the insulating film extend near the semiconductor chip bonded to the center of the insulating film, and outer lead portions of the leads extend outside the insulating film. electrically connecting the semiconductor chip and the inner lead portion of the lead via a wire;
A semiconductor integrated circuit device comprising the semiconductor chip sealed in a resin package having external dimensions smaller than the insulating film, the semiconductor integrated circuit device comprising a notch provided in the insulating film inside the resin package. Integrated circuit device. 4. Inner lead portions of leads formed radially on one surface of the insulating film extend near the semiconductor chip bonded to the center of the insulating film, and outer lead portions of the leads extend outside the insulating film. electrically connecting the semiconductor chip and the inner lead portion of the lead via a wire;
A semiconductor integrated circuit device in which the semiconductor chip is sealed in a resin package having outer dimensions smaller than the insulating film, wherein a notch is provided in the insulating film spanning the inside and outside of the resin package. Features of semiconductor integrated circuit devices.